PCB Manufacturer & PCB Assembly

surface-mounted components<\/a>. The ball grid array is the best solution for this. These BGA can be easily identified at the bottom of the microprocessors. Since this directly connects the terminals, the BGA is highly considered in the development of computer parts and other high-performance computational machines. The BGA uses the total component's full area, giving more space for connections and good communication.<\/p>\r\n\r\n<h2>Introduction to BGA<\/h2>\r\n\r\n<h3>What is Ball Grid Array?<\/h3>\r\n\r\n<p><img alt=\"Ball Grid Array\" src=https://www.nextpcb.com/"https:////www.nextpcb.com//uploads//images//202211//23//1669196236-5845-PJdnyD.jpg/" style=\"width: 800px; height: 531px;\" \/><\/p>\r\n\r\n<p>BGA is an acronym for Ball Grid Array. This is, in general, a collection of little, tiny metallic conductor balls that are put harmoniously on the board as we move toward creating a printed circuit board (PCB).<\/p>\r\n\r\n<p>The Ball Grid Array, or BGA, has a different connecting strategy than typical surface mount connectors. Another packaging, such as the quad flat pack (QFP), included connectors on the sides of the package. This meant that there was little space for the pins, which had to be closely spaced and significantly shrunk to offer the necessary amount of communication. The BGA employs the package's underside, where there is ample space for connections.<\/p>\r\n\r\n<h3>Reason for the Use of BGA<\/h3>\r\n\r\n<p>The ball grid array is gaining popularity among SMD ICs that require dense connections. Using the underside of the <a href=https://www.nextpcb.com/"https:////www.nextpcb.com//blog//ic-packages/">IC package<\/a> instead of connections around the edge makes it possible to reduce connection density, hence facilitating PCB layout.<\/p>\r\n\r\n<p>Using the underside of the chip prevents direct access to the connections, which makes <a href=https://www.nextpcb.com/"https:////www.nextpcb.com//blog//pcb-soldering/">soldering, desoldering, and inspection more challenging. However, with mainline PCB production equipment, these challenges are easily surmounted, and overall reliability and performance can improve.<\/p>\r\n\r\n<h3>Where Can It be Identified?<\/h3>\r\n\r\n<p><img alt=\"Applications of BGA\" src=https://www.nextpcb.com/"https:////www.nextpcb.com//uploads//images//202211//23//1669196284-5687-tfPqyc.jpg/" style=\"width: 800px; height: 600px;\" \/><\/p>\r\n\r\n<p>The superior thermal dissipation performance of BGA keeps the core cool during operation, hence extending the product's lifespan. Heat is the most crucial factor to consider, and BGA is the reason why technology goods operate so efficiently while maintaining a normal temperature even when operating at full capacity.<\/p>\r\n\r\n<p>The second most essential factor is the electrical characteristics. The shortest distance connections with the lowest feasible resistive paths increase the value and importance of BGAs.<\/p>\r\n\r\n<p>The third most essential factor is compatibility. Being able to utilize the shortest space while dealing with a bigger number of balls enables the producer to include an increasing number of workable choices. Hence increasing the product's value and desirability.<\/p>\r\n\r\n<h2>Different Types of BGA<\/h2>\r\n\r\n<p>BGAs are the heart of the things you wish to manufacture. This relies not only on the sort of products you wish to manufacture. But also on the entire production cost, the weight of the final product, the quality of the product, the amount of heat generated, and a host of other factors.<\/p>\r\n\r\n<h3>Ceramic BGA (CBGA)<\/h3>\r\n\r\n<p>This is ceramic BGA type. In this type, the ratio between tin and lead is 10:90. This type of BGA requires C4 Approach (Controlled Collapse Chip Connection) for constructing the bridge between BGAs and PCBs. It is due to its extremely high <a href=https://www.nextpcb.com/"https:////www.nextpcb.com//blog//melting-point-of-solder/">melting point<\/a>. This type of BGA is more expensive than PBGAs, but it is incredibly dependable for improved electrical performance and thermal conductivity.<\/p>\r\n\r\n<h3>Plastic Laminate BGA (PBGA)<\/h3>\r\n\r\n<p><img alt=\"Plastic Laminate BGA\" src=https://www.nextpcb.com/"https:////www.nextpcb.com//uploads//images//202211//23//1669196311-5426-abuVqj.jpg/" style=\"width: 800px; height: 615px;\" \/><\/p>\r\n\r\n<p>The abbreviation for Plastic Ball Grid Array is PBGA. This is the most prevalent type of <a href=https://www.nextpcb.com/"https:////www.nextpcb.com//blog//2-layer-print-circuit-boardpcb-manufacturer/">double-sided PCB<\/a> now in use. <a href=https://www.nextpcb.com/"https:////www.motorola.com//us//about/">MOTOROLA becomes credited with pioneering it, although currently, virtually all producers make use of it. As the substrate material, <a href=https://www.nextpcb.com/"https:////en.wikipedia.org//wiki//BT-Epoxy/">bismaleimide triazine<\/a> (BT) resin forms the core. This, together with the application of over-molded pad array carrier (OMPAC) sealant technology or glob-to-pad array carrier (GTPAC), and proven by JEDEC as being highly dependable (Level 3). These BGAs contain between 200 and 500 ball arrays.<\/p>\r\n\r\n<h3>Tape BGA<\/h3>\r\n\r\n<p>The only disadvantage of TBGA is that it is always more expensive than PBGA. However, TBGA is the best choice for thin goods. That requires robust core materials, superior heat dissipation, and superior electrical connectivity. Whether the ICs \/ Chips must be facing up or down, this is the strategy for maximizing product value while minimizing costs. In this form of BGA, wire bonding is usually preferred if the chips are facing up, but the flip-chip technique seems suited if the chips are facing down.<\/p>\r\n\r\n<h3>PoP Package Types<\/h3>\r\n\r\n<p>The package on package (PoP) is a packaging approach for integrated circuits that combines vertically discrete logic and memory BGA units. Stacking refers to the installation of two or more packages atop one another with a standard interface to transport signals between them.<\/p>\r\n\r\n<p>PoP technology exists to meet the electronics industry's continual demands for fine pitch, smaller size, high signal processing speed, and lower mounting space in electronic products such as smartphones and digital cameras. Using this technique in the <a href=https://www.nextpcb.com/"https:////www.nextpcb.com//blog//pcb-assembly-process/">PCB assembly<\/a> process, memory devices in the top package and logic devices in the bottom package are electrically connected and are tested and replaced individually. All of these qualities lower the cost and complexity of PCB construction.<\/p>\r\n\r\n<h3>LGA Package Types<\/h3>\r\n\r\n<p>The Land Grid Array, or LGA, is a package that uses metal pads instead of leads (as in the pin grid array) or <a href=https://www.nextpcb.com/"https:////www.nextpcb.com//blog//solder-ball/">solder balls<\/a> for external electrical connection (as in the ball grid array). These metal pads, known as "lands," are typically organized in a grid or array at the package's base, hence the name "land grid array." The grid-like design of the LGA package's lands enables it to have a large land count, making it a common packaging option for devices with extensive I\/O needs.<\/p>\r\n\r\n<p>Land counts for typical LGAs range from 8 to 1681. LGAs with the lowest land counts are essentially QFNs, as the lands of these packages are confined to the body's periphery. Typical LGA land pitch (distance between lands) values range from <strong>1.0 mm<\/strong> to <strong>1.27 mm<\/strong>.<\/p>\r\n\r\n<h3>QFN Package Type<\/h3>\r\n\r\n<p><img alt=\"The QFN type\" src=https://www.nextpcb.com/"https:////www.nextpcb.com//uploads//images//202211//23//1669196334-7053-zxEZoK.jpg/" style=\"width: 800px; height: 519px;\" \/><\/p>\r\n\r\n<p>Connecting the ASCIC to the PCB is the QFN semiconductor package. Moreover, it accomplishes this via <a href=https://www.nextpcb.com/"https:////www.nextpcb.com//blog//ultimate-guide-to-smt-pcb-assembly/">surface-mount technology<\/a>. In addition, the QFN is a lead-framed packaging known as a Chip Scale Package (CSP). And this is due to the fact that it enables you to observe and contact leads after assembly. Typically, the PCB connectivity and die assembly of QFN packages typically comprised of a copper lead frame. In addition, this package may feature a single or numerous row of pins.<\/p>\r\n\r\n<p>The QFN packaging has a die wrapped by a lead frame. The lead frame consists of a copper alloy with a tin covering that is matte.<\/p>\r\n\r\n<p>Wire bonding is typically utilized to connect the die and the frame. Copper\/gold is typically preferred for bonding wires. Some manufacturers implement this interface using flip-chip technology. The flip-chip method provides superior electrical performance in comparison to the conventional method.<\/p>\r\n\r\n<p>On the underside of the device are the metalized terminal pads. Along the four borders of the bottom surface, these terminal pads offer electrical connectivity to the PCB.<\/p>\r\n\r\n<p>On the bottom of the packaging is a pad that is exposed. This pad provides a heat-conductive channel to the PCB. The exposed pad also allows for ground connection. At the exposed pad, the QFN package becomes soldered to the circuit board. Die to attach refers to the epoxy used to secure the die to the exposed pad.<\/p>\r\n\r\n<h3>Flip-Chip<\/h3>\r\n\r\n<p><img alt=\"The flip chip method\" src=https://www.nextpcb.com/"https:////www.nextpcb.com//uploads//images//202211//23//1669196366-3932-GOVZwa.jpg/" style=\"width: 800px; height: 524px;\" \/><\/p>\r\n\r\n<p>Comparable to CBGA, except for the ceramic substrate. This FC-BGA instead utilizes BT resin. In this manner, the additional expense becomes minimized for this type. The primary benefit derives from the shorter electrical pathways compared to other BGA varieties, resulting in superior electrical conductivity and increased performance speed. The ratio of tin to lead in this BGA type is 63:37. The chips utilized on the substrate can easily realign to the correct place without the usage of a flip-chip alignment machine, which is another advantage of this BGA kind.<\/p>\r\n\r\n<h2>Advantages of BGA<\/h2>\r\n\r\n<p>The Ball Grid Array originally created to provide a number of advantages to IC and equipment producers, as well as to equipment users. Among the advantages of BGA over other technologies are the following:<\/p>\r\n\r\n<ul style=\"margin-left: 40px;\">\r\n\t<li>Efficient use of printed circuit board space, allowing connections to get done under the SMD package rather than just around its perimeter.<\/li>\r\n\t<li>Thermal and electrical performance enhancements. BGA packages can provide power and ground planes with low inductances, controlled impedance traces for signal traces, and the ability to channel heat away via pads, etc.<\/li>\r\n\t<li>Increased production yields as a result of the enhanced soldering. BGAs allow for wider separation between connections and improved solderability.<\/li>\r\n\t<li>Reduced package thickness, which is advantageous when multiple assemblies, such as mobile phones, are only made considerably thinner; Improved re-workability due to bigger pad sizes, etc.<\/li>\r\n<\/ul>\r\n\r\n<h2>Final Word<\/h2>\r\n\r\n<p>There are numerous reasons why current technology relies heavily on BGA. The most crucial is that BGA offers superior thermal dissipation. It allows the core to remain cool during operation and so extending the product's lifespan. Heat is the most crucial factor to consider, and BGA is the reason why technology goods operate so efficiently while maintaining a normal temperature even when operating at full capacity.<\/p>\r\n\r\n<p>The second most essential factor is the electrical characteristics. The shortest distance connections with the lowest feasible resistive paths increase the value and importance of BGAs.<\/p>\r\n\r\n<p>The third most essential factor is Compatibility. Being able to utilize the shortest space while dealing with a bigger number of balls enables the producer to include an increasing number of workable choices, hence increasing the product's value and desirability. This indirectly contributes to reducing production costs while producing more valuable and affordably priced goods for production and market clients.<\/p>\r\n","status":1,"create_time":1669196431,"update_time":1723702544,"clicks":32372,"hits":7,"custom_url":"7-types-of-bga-ball-grid-array-packages","related":"","add_uid":111,"publish_uid":0,"attr":0,"type":0,"keywords":"ball grid array, BGA","comment_count":0,"share_count":0,"need_move":0,"c_time":"2022-11-23 17:40:31","u_time":"2025-06-27 16:08:09","comments_count":0,"is_like":0}">

7 Types of BGA (Ball Grid Array) Packages
Posted on August 15, 2024 by NextPCB
It is clearly identifiable that connecting the Integrated circuits through the wires is hard when it comes to the Surface Mounted Components. As a solution for this, the Ball Grid Array can be used.

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Tag: Ball Grid Array
soldering of the components<\/a> to the PCBs. They are <a href=https://www.nextpcb.com/"https:////www.nextpcb.com//blog//through-hole-technology/">Through-hole technology<\/a> (THT) and <a href=https://www.nextpcb.com/"https:////www.nextpcb.com//blog//ultimate-guide-to-smt-pcb-assembly/">surface mount technology<\/a> (SMT). When considering the THT, machinery <a href=https://www.nextpcb.com/"https:////www.nextpcb.com//blog//reflow-soldering-and-wave-soldering/">wave soldering<\/a> and selective soldering are currently options in the industry for the development of a considerable amount of PCBs. Furthermore, the Hand soldering of the PCBs is also an important method of soldering the components to the PCBs. Using the hand-soldering iron, solder, and <a href=https://www.nextpcb.com/"https:////www.nextpcb.com//blog//solder-flux/">flux are the main components of the hand-soldering process of the Through Hole Component Soldering.<\/p>\r\n\r\n<h2><strong>Introduction to Through Hole Soldering<\/strong><\/h2>\r\n\r\n<h3>What is Through Hole Technology?<\/h3>\r\n\r\n<p>Through-hole technology is a technology for the soldering of PCB components. When referring to the soldering of the PCB components, they are diodes, resistors, <a href=https://www.nextpcb.com/"https:////www.nextpcb.com//blog//pcb-capacitors/">capacitors, etc.<\/p>\r\n\r\n<p><img alt=\"An example image of inspection rules\" src=https://www.nextpcb.com/"//uploads//images//202211//23//1669193778-0115-cZodTq.png/" style=\"width: 800px; height: 465px;\" \/><\/p>\r\n\r\n<p>With through-hole technology, components with tails or leads insert into holes drilled in the PCB. We'll refer to these parts as through-board components. The leads are subject to soldering, typically using a wave solder method. It could be onto pads or land on the underside of the board (but also by hand).<\/p>\r\n\r\n<p>The older point-to-point building method of electronics assembly went down with the rising of through-hole technology. Every component on a standard PCB was a through-hole component. It began with the second generation of computers in the 1950s. Until surface-mount technology (SMT) achieved popularity in the middle of the 1980s. PCBs had <a href=https://www.nextpcb.com/"https:////www.nextpcb.com//blog//pcb-trace/">traces printed on one side only at first, then both sides and finally, <a href=https://www.nextpcb.com/"https:////www.nextpcb.com//blog//multilayer-printed-circuit-board/">multi-layer boards<\/a>. To allow the components to make contact with the necessary electrical layers, through holes converted to plated-through holes (PTH). SMT boards no longer require plated-through holes for component connections, although they still utilize for layer connections and are more commonly it refers to as vias in this context.<\/p>\r\n\r\n<h3>Difference between the Surface Mount and Through Hole Technology<\/h3>\r\n\r\n<p>Components are put directly onto the surface of the PCB using the SMT method. The technique, which was created in the 1960s and was initially called "planar mounting," has become more and more well-known since the 1980s. Nowadays, SMT is used almost exclusively in the production of electronic devices. It has become crucial to PCB design and production, increasing PCB quality and performance as a whole. Moreover, it significantly decreased processing and handling costs.<\/p>\r\n\r\n<p><img alt=\"Difference between SMT and THT components\" src=https://www.nextpcb.com/"//uploads//images//202211//23//1669193811-6964-uSTWmi.jpg/" style=\"width: 800px; height: 492px;\" \/><\/p>\r\n\r\n<p>A PCB does not need to have holes drilled through it for SMT mounting. The components are considerably smaller. SMT components are possible to set on both sides of the board. These are the main distinctions between SMT and through-hole mounting. Smaller, more efficient, and denser PCBs are now possible. It is because of the <a href=https://www.nextpcb.com/"https:////www.nextpcb.com//blog//pcb-capacitors/">capacity to place many tiny components on a single PCB.<\/p>\r\n\r\n<p><a href=https://www.nextpcb.com/"https:////www.nextpcb.com//blog//pcb-via/">PCB vias<\/a> are small components that allow a conductive connection between a PCB's various layers. And effectively serve as through-hole component leads, which have taken the place of a through-hole component leads, which go through the board and connect a board's layers. <a href=https://www.nextpcb.com/"https:////www.nextpcb.com//blog//7-types-of-bga-ball-grid-array-packages/">BGAs are a type of surface mount component. It performs better because they have more connecting pins and shorter leads, which enable faster speeds.<\/p>\r\n\r\n<h4>Advantages of THT:<\/h4>\r\n\r\n<p>THT is the best option for components like connectors and transformers that will experience high heat or mechanical stress since the bindings formed between THT components, and the board is far more robust than SMT bonds. THT parts are extremely simple to replace, which makes them ideal for <a href=https://www.nextpcb.com/"https:////www.nextpcb.com//blog//13-popular-pcb-test-methods/">testing and prototypes.<\/p>\r\n\r\n<h4>Advantages of SMT:<\/h4>\r\n\r\n<p>SMT enables the use of higher-density components on both sides of the board, resulting in smaller, more potent PCBs. You can produce products more quickly and at a low cost because holes do not need to drill in the new board. SMT parts can install up to ten times more quickly than THT parts. In reflow ovens, the solder can apply rapidly and uniformly and is significantly more trustworthy. Additionally, SMT is to be more stable and performs better when subjected to shaking and vibration.<\/p>\r\n\r\n<h3>Where to Use Through Hole Technology?<\/h3>\r\n\r\n<p>Through-hole technology is perfect for devices that need excellent dependability even under extreme mechanical and environmental stress, as well as high voltage, power, and heat conditions. Through-hole technology is also more frequently used for manufacturing in large units. Since it is less critical to cut costs by using smaller components. The ability to physically change and replace leads makes the Through-hole technology method advantageous for testing and prototyping because it enables you to attempt different configurations.<\/p>\r\n\r\n<p>Through-hole technology can probably see in transformers, semiconductors, electrolytic capacitors, and plug connectors. Because of its dependability and durability in extreme environments, it is frequently used in the military, aerospace, and industrial equipment sectors, due to its ability to resist outdoor environments, light-emitting diodes or LED lights used in outdoor applications like billboards and stadium displays may also utilize thru-hole technology.<\/p>\r\n\r\n<h3>Available Methods for Through Hole Soldering<\/h3>\r\n\r\n<p>The soldering of the through-hole component is possible to carry out in two ways. They are the machinery method and the hand soldering method. The machinery process of through-hole component soldering can categorize as wave soldering and selective soldering. Under these two methods, the bulk of PCB soldering is possible to carry out within a short period of time. Moreover, to control the quality of the PCB, changing a few controlling parameters is the thing that we have to do.<\/p>\r\n\r\n<p>When considering wave soldering is a vast machinery process. Basically, these types of operations are good for the production of a large number of THT PCBs. So when it comes to the soldering of the Through Hole components to the PCBs, leaded and lead-free are the main types of solder that we can use for the soldering. The type of solder used for the soldering will change according to the requirement of the manufacturing client.<\/p>\r\n\r\n<h4>1) Wave Soldering<\/h4>\r\n\r\n<p><img alt=\"Wave soldering pot with molten solder\" src=https://www.nextpcb.com/"//uploads//images//202211//23//1669193854-9763-RhjaKm.jpg/" style=\"width: 800px; height: 450px;\" \/><\/p>\r\n\r\n<p>A bulk soldering technique is using to create PCBs is wave soldering. The circuit board moves or a container. It consists of molten solder where a pump creates an appearance of a standing wave-like upwelling of solder. The parts are subject to soldering to the circuit board as soon as it comes into touch with the wave. Surface mount and through-hole printed circuit assemblies both use wave soldering. In the latter scenario, placement equipment users adhere the components to a printed circuit board (PCB) surface before putting them through the hot solder wave. Through-hole component soldering often uses wave soldering.<\/p>\r\n\r\n<p>Wave soldering is replacing now with the rising of the reflow soldering technique. In many large-scale electronics applications surface, mount components undergo replacement with through-hole components. However, significant wave soldering is still in demand, in situations where surface-mount technology (SMT) is insufficient or where straightforward through-hole technology is the norm.<\/p>\r\n\r\n<h4>Process of Wave Soldering<\/h4>\r\n\r\n<h5><strong>Preparation<\/strong><\/h5>\r\n\r\n<p>An electronic printed circuit board must undergo correct assembling methods and correct designing techniques.<\/p>\r\n\r\n<ul style=\"margin-left: 40px;\">\r\n\t<li><strong><em>Solder resist layer:<\/em><\/strong> The first is the best practice for board design. The PCB design incorporates a solder resist or solder mask layer, which provides a layer of "varnish"-like material to the board and prevents solder from adhering to it. Only the necessary parts are opening to soldering. The hue of this solder resist is most frequently green.<\/li>\r\n\t<li><strong><em>Pad spacing:<\/em><\/strong> The second major precaution is to make sure there is enough space between the solder pads that undergoes the soldering. There is a chance that the solder will bridge the two pads if they are too close together, leading to a short circuit. The spacing requirements for wave soldering depend on the orientation of the board in relation to the solder flow. Because the solder wave creates by solder flowing out of the reservoir tank as the board passes over it. Pads that separate from one another perpendicular to the solder flow should have a wider separation than those that separate perpendicular to it. This is due to the fact that solder bridges are considerably more likely to form in the direction that solder flows.<\/li>\r\n<\/ul>\r\n\r\n<h5><strong>Fluxing<\/strong><\/h5>\r\n\r\n<p>Flux is necessary to make sure the regions going to solder are clean and free of oxidation, etc. The flux applies on the board where the soldering is going to undertake. The flowing amount control is a critical thing. Poor joints are more likely to occur with too little flux than with too much flux, which will leave residual flux on the board. Although this does not have a pleasant aesthetic appearance, the acidic nature of the flux raises the possibility of long-term deterioration. The flux can use in two different ways.<\/p>\r\n\r\n<ul style=\"margin-left: 40px;\">\r\n\t<li><strong><em>Spray flux: <\/em><\/strong> On the underside of the board that needs is going to be soldering, a mist made of flux will apply. To get rid of extra flux, certain systems might even use a compressed air jet.<\/li>\r\n\t<li><strong><em>Foam flux: <\/em><\/strong> A flux foam cascade pass over the electronic printed circuit board. Submerging a plastic cylinder with small pores in a flux tank is the method for foam fluxing. Air pumps through the plastic cylinder, which is with a metal chimney covering. Flux foam starts to ascend the chimney as a result.<\/li>\r\n<\/ul>\r\n\r\n<h5><strong>Preheat<\/strong><\/h5>\r\n\r\n<p><img alt=\"Preheaters in wave soldering\" src=https://www.nextpcb.com/"//uploads//images//202211//23//1669193886-1236-bYsoEH.jpg/" style=\"width: 800px; height: 533px;\" \/><\/p>\r\n\r\n<p>Electronic printed circuit boards get exposed to significant heat levels during the wave soldering process, which is far more heat than they would experience during manual soldering. If this thermal shock were not managed, it would result in a far higher level of failure. In order to avoid any thermal shock, the board is preheated so that it can be gradually brought up to the necessary temperature.<\/p>\r\n\r\n<p>Usually, hot air heaters are used in the preheating area to blast hot air onto the boards as they move near the wave soldering device. Infrared warmers may also be utilized occasionally, particularly if the board is crowded. This makes sure that the board is heated uniformly throughout and that there are no dark spots.<\/p>\r\n\r\n<p>While the wave soldering machine would cause a thermal shock if it does not undergo preheating, the heating is also necessary to activate the flux. To guarantee that the regions that need to undergo soldering are clean and capable of accepting the solder, this flux is necessary.<\/p>\r\n\r\n<h4>2)  Selective Soldering<\/h4>\r\n\r\n<p>The procedure entails adding flux, preheating, and soldering, much like wave soldering. Unlike wave soldering, which coats the entire PCB, flux only applies to the components that need to undergo soldering. The assembly's temperature rises before soldering during the same preheat stage as in wave soldering. Similar to wave soldering, selective soldering involves exposing the PCB to a molten wave of solder. But individual connections experience the wave one at a time rather than the entire board. Although it takes longer than wave soldering, the procedure is significantly more accurate, and each variable for each spot that has to undergo soldering can control independently.<\/p>\r\n\r\n<p>The amount of clearance provided in the design between surface mount components and the through-hole component pads that need to be soldered is one of the key obstacles preventing wave soldering from being used. Depending on the board design and machine being used, the minimum clearance will vary, but usually speaking, 3mm is required but might be as low as 1mm.<\/p>\r\n\r\n<p>The requirement for a high-purity nitrogen supply in selective soldering, which prevents the solder from oxidizing and generating dross, is a significant distinction between wave soldering and selective soldering. Dross is undesirable in either technique, but selective soldering's use of large nozzles makes it more problematic since dross accumulation leads to uneven solder flow through the nozzle and produces unfavorable outcomes.<\/p>\r\n\r\n<h4>3) Hand Soldering of  Through Hole Components<\/h4>\r\n\r\n<p>The simplest and most popular soldering technique in electrical engineering is hand soldering. Here, pressure applies using a soldering iron's pre-tinned soldering tip to heat the components that need to link and melt the solder. Soft soldering is another name for this method. Either manually or automatically guided soldering irons are available.<\/p>\r\n\r\n<p>The pre-tinned tip of the soldering iron keeps above the joint and exerts pressure against the connecting partner to heat it up. The solder junction is then covered with a specific amount of solder wire, which is then applied and melts at the joint. The solder junction solidifies once the soldering iron is removed.<\/p>\r\n\r\n<h2><strong>Guidance of Through Hole Soldering <\/strong><\/h2>\r\n\r\n<h3>Basic Things Need for the Hand Through Hole Soldering<\/h3>\r\n\r\n<h4><strong>1) Soldering iron<\/strong><\/h4>\r\n\r\n<p><img alt=\"Soldering irons\" src=https://www.nextpcb.com/"//uploads//images//202211//23//1669193949-5105-uMdCVZ.jpg/" style=\"width: 800px; height: 600px;\" \/><\/p>\r\n\r\n<p>A soldering iron is a hand instrument used to melt solder around electrical connections. It connects to a typical 120v AC outlet and heats up. This is one of the most crucial tools for soldering, and it can be in the shape of a pen or a gun. You should use a pen-style soldering iron in the 15W to 30W range if you're a beginner. The majority of soldering irons feature replaceable tips that can be utilized for various soldering tasks. When using a soldering iron of any kind, use considerable caution because the temperature can reach up to 896° F, which is extremely hot.<\/p>\r\n\r\n<h4>2) Soldering Station<\/h4>\r\n\r\n<p><img alt=\"Soldering Station\" src=https://www.nextpcb.com/"//uploads//images//202303//31//1680257520-842-OGANgE.jpg/" style=\"width: 800px; height: 545px;\" \/><\/p>\r\n\r\n<p>The more sophisticated alternative to the standard solo soldering pen is a soldering station. These are excellent to have if you plan to conduct a lot of soldering because they provide more flexibility and control. The capacity to accurately control the soldering iron's temperature, which is fantastic for a variety of applications, is the fundamental advantage of a soldering station. Because some of these stations have sophisticated temperature sensors, alarm settings, and even password protection for security, they can help make a workstation that is safer.<\/p>\r\n\r\n<h4>3) Soldering Iron Tips<\/h4>\r\n\r\n<p><img alt=\"Soldering tip types\" src=https://www.nextpcb.com/"//uploads//images//202211//23//1669194001-0095-zsCjvD.jpg/" style=\"width: 800px; height: 665px;\" \/><\/p>\r\n\r\n<p>Most soldering irons have a soldering tip at the end that can be swapped out. This advice has many different iterations, and they are available in a wide range of sizes and shapes. Each advice piece serves a certain function and provides a clear benefit over the others. The conical tip and the chisel tip are the most frequent tips used in electronics projects.<\/p>\r\n\r\n<p><strong>Conical Tip<\/strong> – Because of the fine tip, it is used in precision electronics soldering. It can distribute heat to smaller areas without impacting its surroundings thanks to its pointed end.<\/p>\r\n\r\n<p><strong>Chisel Tip<\/strong> – Due to its broad flat tip, this tip is ideal for soldering wires or other bigger components.<\/p>\r\n\r\n<h4>4) Brass or Conventional Sponge<\/h4>\r\n\r\n<p><img alt=\"Brass solder tip cleaner\" src=https://www.nextpcb.com/"//uploads//images//202211//23//1669194027-0391-ZGLEcV.jpg/" style=\"width: 800px; height: 800px;\" \/><\/p>\r\n\r\n<p>By eliminating the oxidation that develops, using a sponge will help to keep the soldering iron tip clean. Oxidized tips have a tendency to turn black and stop accepting solder like they did when they were first made. You might use a regular wet sponge. However, due to expansion and contraction, this usually results in the tip wearing out sooner. Additionally, when wiped, a damp sponge will momentarily lower the temperature of the tip.<\/p>\r\n\r\n<h4>5) Soldering Iron Stand<\/h4>\r\n\r\n<p><img alt=\"Solder iron stand\" src=https://www.nextpcb.com/"//uploads//images//202211//23//1669194054-2695-rSxpBt.jpg/" style=\"width: 800px; height: 746px;\" \/><\/p>\r\n\r\n<p>Even though it is quite simple, a soldering iron stand is very practical and useful. This stand aids in preventing unintentional injuries to your hand or contact between the hot iron tip and combustible things. The majority of soldering stations have this built-in and a brass sponge or sponge for cleaning the tip as well.<\/p>\r\n\r\n<h4>6) Solder<\/h4>\r\n\r\n<p><img alt=\"Different-sized solder wires\" src=https://www.nextpcb.com/"//uploads//images//202211//23//1669194079-9806-ahHOLA.jpeg/" style=\"width: 800px; height: 800px;\" \/><\/p>\r\n\r\n<p>To permanently link electrical components together, a metal alloy called solder is melted. It is available in the <a href=https://www.nextpcb.com/"https:////www.nextpcb.com//blog//lead-vs-lead-free-solder/">lead and lead-free<\/a> versions, with the most popular diameters being 0.032" and 0.062". <a href=https://www.nextpcb.com/"https:////www.nextpcb.com//blog//solder-flux/">Flux, a substance found inside the solder core, helps to enhance electrical contact and mechanical strength.<\/p>\r\n\r\n<p>Lead-free rosin core solder is the most used variety for soldering electronics. Typically, an alloy of tin and copper is used to make this kind of solder. Leaded 60\/40 (60 percent tin, 40 percent lead) rosin core solder is another option, however, it's less common now because of health issues. If you do use lead solder, be sure to wash your hands afterward and have adequate ventilation.<\/p>\r\n\r\n<p>Avoid purchasing acid core solder when purchasing solder since it will harm your circuits and components. Acid core solder is typically used in plumbing and metalworking and is available at home improvement stores.<\/p>\r\n\r\n<h5>For a Hobby Project<\/h5>\r\n\r\n<p>Solder does exist in a couple of various sizes, as was previously indicated. The broader diameter solder (0.062′′) is useful for quickly soldering larger joints, but it can be challenging to solder tiny joints. Due to this, it's wise always to have both sizes available for your various projects.<\/p>\r\n\r\n<p>Lead-based, lead-free, and flux solder are the three primary varieties. When it comes to reliability and understanding, lead-based solders are chosen for mission-critical applications like aircraft or medical electronics. Electronics that must adhere to environmental and health standards can use lead-free solders. The rosin-reducing agent in flux solders, which is released during soldering and removes oxidation from the bonding point, is also present in the solder.<\/p>\r\n\r\n<p>Your typical Sn60Pb40 solder is sufficient for the majority of hobbyist applications. It might be worthwhile to investigate mixes that include enhanced wetting or practical eutectic melting points if you want to increase craftsmanship on the production line. Finding the ideal qualities to fulfill your needs, as well as cost-optimizing, are all important steps in choosing the correct blend.<\/p>\r\n\r\n<h4>7) Helping Hand (Third Hand)<\/h4>\r\n\r\n<p><img alt=\"PCB holder for the soldering\" src=https://www.nextpcb.com/"//uploads//images//202211//23//1669194107-9361-UhNAMS.jpg/" style=\"width: 800px; height: 800px;\" \/><\/p>\r\n\r\n<p>A helpful hand is a tool with two or more alligator clips and, occasionally, a light or magnifying glass attached. By holding the objects you are attempting to solder while using the soldering iron and solder, these clips will be of assistance to you. An essential item for your makerspace.<\/p>\r\n\r\n<h3>How to set up the correct temperature for the soldering iron<\/h3>\r\n\r\n<p>For lead-based solder, a reasonable starting point is 600°-650°F (316°- 343°C), and for lead-free solder, it's 650°-700°F (343°- 371°C). The soldering tip needs to be hot enough to melt the solder efficiently, but too much heat might harm components because it travels along the leads and shortens the life of the tip.<\/p>\r\n\r\n<p>According to the application, the user has to select the temperature range.<\/p>\r\n\r\n<h3>How to select the correct flux level and solder thickness<\/h3>\r\n\r\n<p>A solder wire with a diameter of between 0.711 mm and 1.63 mm is adequate for basic electronics work. However, the gauge number determines the solder diameter. You will be working with through-hole PDIP packages; as a result, gauges 18, 20, and 21 work nicely. Since there is less danger of forming bridges or wasting solder, beginners would be wise to stay within this range.<\/p>\r\n\r\n<h3>How to handle the components in Through Hole Soldering<\/h3>\r\n\r\n<p>In the industry, there could be some highly sensitive PCBs. So most of them are made up of SMD (Surface Mount Devices). Most of the  SMD components are subject to Electro Static Discharge and undergo damaging the whole PCB. Therefore one of the severe cases is handling PCBs with less effect of the ESD. When soldering and handling the PCBs, this factor makes a huge impact. So users have to be more careful about that. Even when connecting a THT component manually to an SMT PCB, users have to wear the appropriate warnings. They are ESD gloves, ESD head caps, and ESD bands.<\/p>\r\n\r\n<h3>Through Hole Soldering of the components to the PCB<\/h3>\r\n\r\n<ul style=\"margin-left: 40px;\">\r\n\t<li>Step 1:  Start by putting the leads into the circuit board's holes. Turn the board over and make a 45° curve in the leads. As a result, the component will have a stronger bond with the copper pad and won't slip out during soldering.<\/li>\r\n\t<li>Step 2: Heat the Joint: Turn on your soldering iron, and if it has a heat-control dial, set the temperature to 400°C. At this moment, simultaneously touch the resistor lead and copper pad with the iron's tip. To heat the pad and the lead, you must hold the soldering iron stationary for 3–4 seconds.<\/li>\r\n\t<li>Step 3: Continue touching your solder to the joint while holding the soldering iron on the lead and copper pad. Important: Avoid touching the iron's tip directly with the solder. You want the joint to be hot enough for touching it to melt the solder. A poor connection will occur if the joint is excessively cold.<\/li>\r\n\t<li>Step 4: The solder will naturally cool down after the soldering iron is removed. Avoid blowing on the solder because this will result in a poor joint. You can cut the extra wire from leads once they've cooled. A good solder junction is bright, smooth, and shaped like a volcano or cone. The ideal amount of solder is just enough to completely cover the joint without being too much that it forms a ball or overflows onto a nearby joint or lead.<\/li>\r\n<\/ul>\r\n\r\n<h3>Cleaning of the Circuit Board<\/h3>\r\n\r\n<p><img alt=\"Antistatic brushes for cleaning\" src=https://www.nextpcb.com/"//uploads//images//202211//23//1669195517-4959-NatESQ.jpg/" style=\"width: 800px; height: 800px;\" \/><\/p>\r\n\r\n<p>Cleaning of the PCBs after the through-hole soldering is a must. That's because there could be small solder particles hidden inside the components. They could lead to the short-circuiting of the PCB. So these things should be minimized as much as possible before powering up the PCB. Most of the <a href=https://www.nextpcb.com/"https:////www.nextpcb.com//pcb-assembly-services/">PCB assembling<\/a> industries use ESD brushes for this. They brush the PCB smoothly with visual inspection and remove unwanted solder particles. If the circuit is so complicated, cleaning is a must.<\/p>\r\n\r\n<h3>Inspection after soldering<\/h3>\r\n\r\n<p>Inspecting after the soldering is an important task. Here the quality of soldering and the standards will inspect. The most common standard is the IPC standard. So most companies use these standard methods. Moreover, In here, the methods of soldering and the ways the components should undergo soldering are clearly explained.<\/p>\r\n\r\n<p>if the users follow these standards, the risk of having failures and possible errors is at a low level. Because every step of soldering is mentioned here.<\/p>\r\n\r\n<h2><strong>Tips for soldering and things to avoid<\/strong><\/h2>\r\n\r\n<ul style=\"margin-left: 40px;\">\r\n\t<li>Make sure you know what the solder type is<\/li>\r\n\t<li>Don't touch the tip of the soldering iron<\/li>\r\n\t<li>Use tweezers to handle the wires<\/li>\r\n\t<li>Keep a solder iron tip cleaning materials near and clean the tip before starting the work<\/li>\r\n\t<li>wear essential wearing for ESD<\/li>\r\n\t<li>Work in an area with light<\/li>\r\n\t<li>Once soldering is done, return the soldering iron to stand.<\/li>\r\n\t<li>After completing the switch of the unit<\/li>\r\n\t<li>IMPORTANT - When you finish the soldering, keep some clean solder on the tip of the soldering iron. So with the reducing of the temperature, it will be there until you start working again. This will increase the lifespan of the soldering iron and protect the tip.<\/li>\r\n<\/ul>\r\n","status":1,"create_time":1669195650,"update_time":1686904894,"clicks":4939,"hits":0,"custom_url":"how-to-do-through-hole-solder-well","related":"","add_uid":111,"publish_uid":0,"attr":0,"type":0,"keywords":"through hole soldering","comment_count":0,"share_count":0,"need_move":0,"c_time":"2022-11-23 17:27:30","u_time":"2025-06-27 16:16:07","comments_count":0,"is_like":0}">

How to Do Through Hole Solder Well
Posted on June 16, 2023 by NextPCB
Through Hole Technology machinery wave soldering and selective soldering are currently options in the industry for the a bulk of PCBs.

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Tag: Through Hole Soldering
different colors<\/a> for the PCBs. If we look into the PCB domain, it is clear that there are blue, red, green, and black color PCBs. These are the main colors that are commonly identifiable in industry.  So, it is more curious why different colors are there for the PCBs.<\/p>\r\n\r\n<p><img alt=\"Example- blue circuit board\" src=https://www.nextpcb.com/"//uploads//images//202211//22//1669085890-0651-VhryCG.jpg/" style=\"width: 800px; height: 450px;\" \/><\/p>\r\n\r\n<p>PCBs are the main components of the modern world. The PCB colors and functionality and the PCB type mainly depend upon the designers' choices. Functionality is the main factor that has to consider.<\/p>\r\n\r\n<h2>Introduction to the Blue Circuit Board<\/h2>\r\n\r\n<p>One of the fundamental ideas in electrical design is the printed circuit board. Using conductive pads, tracts, and other components notched from copper sheets glued onto a non-conductive substrate, designers shape them such that they mechanically support and electrically link electronic components. <a href=https://www.nextpcb.com/"https:////www.nextpcb.com//blog//single-layer-flex-pcb/">Single-sided, <a href=https://www.nextpcb.com/"https:////www.nextpcb.com//blog//2-layer-print-circuit-boardpcb-manufacturer/">double-layer, or <a href=https://www.nextpcb.com/"https:////www.nextpcb.com//blog//multilayer-printed-circuit-board/">multilayered printed circuit boards are all possible. Active devices, resistors, and <a href=https://www.nextpcb.com/"https:////www.nextpcb.com//blog//pcb-capacitors/">capacitors are a few examples of items that advanced PCBs may have embedded in the substrate. Even the most basic electrical items require PCBs. Color code is one of the intriguing things to know about PCBs. Red, purple, black, clear, and <a href=https://www.nextpcb.com/"https:////www.nextpcb.com//blog//white-printed-circuit-board/">white PCBs<\/a> are among the most prevalent, along with blue and green PCBs.<\/p>\r\n\r\n<h3>Why the Blue Circuit Board?<\/h3>\r\n\r\n<p>Blue PCB electronics are becoming more and more popular among engineers and electrical designers even though there is no discernible difference between them and PCB boards of other colors. This is because of the appealing hue.<\/p>\r\n\r\n<p>Blue PCBs enable the integration of electrical or data circuits into a usable piece of hardware. Through conductive routes, they provide the required mechanical support and electrical connections.<\/p>\r\n\r\n<h3>Difference of the Blue Circuit Board<\/h3>\r\n\r\n<p><img alt=\"Different colors of PCBs for designing\" src=https://www.nextpcb.com/"//uploads//images//202211//22//1669085927-026-HjkuyV.jpg/" style=\"width: 800px; height: 424px;\" \/><\/p>\r\n\r\n<p>They are blue in hue, not because of the color of their paint, dye, or mark, but rather because they resemble <a href=https://www.nextpcb.com/"https:////www.nextpcb.com//blog//white-solder-mask/">solder masks<\/a>. The copper wires on the board get protected with the use of a solder mask that is the same shade of blue. It looks similar to the blue Arduino.<\/p>\r\n\r\n<p>There is little distinction between planar traces and space. Magnification is said to be important in blue solder masks because it aids in finding manufacturing flaws. For this reason, designers who are creating intricate circuits and electronic systems, including gaming PCs and remote-control robots, choose blue circuit boards.<\/p>\r\n\r\n<p>Blue PCBs have a variety of uses because they are attractive:<\/p>\r\n\r\n<ul style=\"margin-left: 40px;\">\r\n\t<li>Mobile devices<\/li>\r\n\t<li>Appliances<\/li>\r\n\t<li>Digital clock and signage<\/li>\r\n\t<li>Musical instruments, synthesizers, and amplifiers<\/li>\r\n\t<li>RC drones, robots, and other vehicles<\/li>\r\n<\/ul>\r\n\r\n<h3>Functioning of the Blue Circuit Board<\/h3>\r\n\r\n<p>Power and communications between physical devices can be rout via a blue circuit board. Using solder, designers link the electronic parts to the blue PCB's surface electrically. An effective mechanical adhesive, solder. And since it is metal, the blue surface makes it easy to notice. <a href=https://www.nextpcb.com/"https:////www.nextpcb.com//blog//pcb-soldering/">Soldering components<\/a> ensures the proper fit. It enables designers to accurately remove any worn-out parts from the blue substrate during repairs without affecting the others.<\/p>\r\n\r\n<h2>The Material Composition of the Blue Circuit Board<\/h2>\r\n\r\n<p><img alt=\"Composition of the Blue Circuit Board\" src=https://www.nextpcb.com/"//uploads//images//202211//22//1669086339-9416-ofpuQt.jpg/" style=\"width: 800px; height: 439px;\" \/><\/p>\r\n\r\n<h3>The Blue Substrate (FR-4)<\/h3>\r\n\r\n<p>The foundation material, or substrate, is designed with the use of blue fiberglass. <a href=https://www.nextpcb.com/"https:////www.nextpcb.com//blog//guide-to-fr-4-printed-circuit-board-material-nextpcb/">FR-4 is another name for it. A printed circuit board's core, or substrate, is what gives the board its thickness and stiffness. Depending on the manufacturer, bendable blue PBCs are also available. Generally, they are made from flexible, high-temperature plastic. There are many thicknesses of blue PCBs available depending on the application case. Nevertheless, there are two common sizes: 1.6 mm and 0.8 mm. Custom blue-printed circuit boards are also made by manufacturers. They may be adapted for RC vehicles and gaming PCs.<\/p>\r\n\r\n<p>Some producers use phenolic or epoxy resin to create blue PCBs. They lack fiberglass PCBs' strength and functionality. They are considerably less costly, though. A fiberglass PCB may be easily distinguished from an epoxy PCB. An epoxy-blue PCB will emit a distinctly unpleasant smell when soldered. They are frequently identifiable in subpar consumer equipment. The low thermal decomposition temperature of phenolics and epoxy. When the soldering iron makes prolonged contact with the circuit board, this results in their smoking and charring.<\/p>\r\n\r\n<h3>Copper<\/h3>\r\n\r\n<p>A thin copper foil is the second-most significant element in blue PCB electronics. It follows the blue substrate as the second layer. These two layers adhere to the heated laminated. The copper layer is present on both sides of the substrate in double-sided blue PCBs. PCBs using copper often have one side on low-end devices. When we talk of double-sided or two-layer blue boards, we are referring to the number of copper layers. There may be just one layer or as many as sixteen. The number of layers may be more depending on the usage and the manufacturer.<\/p>\r\n\r\n<p>The stated weight (ounces per square foot) of copper might vary. One ounce of copper is present per square foot on the majority of blue PCBs. However, some programmable blue-printed circuit boards may utilize 2-3 ounces of copper since they can take greater power.<\/p>\r\n\r\n<h3>Solder Mask<\/h3>\r\n\r\n<p><img alt=\"Blue solder mask\" src=https://www.nextpcb.com/"//uploads//images//202211//22//1669086382-3439-auvJBl.jpg/" style=\"width: 800px; height: 581px;\" \/><\/p>\r\n\r\n<p>The <a href=https://www.nextpcb.com/"https:////www.nextpcb.com//blog//what-is-a-pcb-solder-mask/">solder mask<\/a> layer is the third layer of a printed circuit board. It is visible above the copper foil. The solder mask on conventional PCBs is what gives them their color. The solder mask can be either transparent or blue because the substrate is blue in blue PCBs. It protects the copper layer from accidental contact with other metals, conductive objects, and solder. This indicates that the thin copper layer is on top of it. It facilitates soldering in the proper locations while avoiding solder jumpers.<\/p>\r\n\r\n<h3>Silkscreen<\/h3>\r\n\r\n<p>In a blue PCB, the <a href=https://www.nextpcb.com/"https:////www.nextpcb.com//blog//printed-circuit-board-silkscreen/">silkscreen is the last layer. Silkscreen applies over the solder mask layer of the PCB. It serves to supplement the blue PCB board with additional symbols, numbers, and characters. As a result of the symbols and numbers being engraved legibly, assembly is made simpler. These symbols serve as markers that make the circuit board easier to grasp. Board makers may use employ silkscreen labels to specify the purposes of each LED or pin. Usually, silkscreens are white. However, designers like black and white inks on blue PCBs.<\/p>\r\n\r\n<h2>Different Types of Industrially Used Blue Circuit Board<\/h2>\r\n\r\n<h3>Single Layer Blue PCB<\/h3>\r\n\r\n<p>The simplest printed circuit board is a single-sided PCB, which is best suited for low-density designs and only has one layer of conductive material. Holes in the board are often not plated through.<\/p>\r\n\r\n<p>The circuit is on one side, while parts are laid out on the other. It is called a single-sided PCB or a one-layer PCB since there is just one conductor layer. Due to constraints in circuit design, it was utilized more frequently in early printed circuit boards (PCB) (since there is only one side wire and no crossing is allowed, each line must have its path).<\/p>\r\n\r\n<p>Network printing (screen printing) is mostly used for single-sided PCB diagrams. This entails printing resist on bare copper, followed by etching and printing solder mask before punching to complete the pieces' plated hole and profile. Additionally, a photoresist is frequently used to create circuit patterns on a small number of different goods.<\/p>\r\n\r\n<h3>Double Layer Blue PCB<\/h3>\r\n\r\n<p>A copper layer is present on both sides of the blue substrate of a double-layer printed circuit board. To let circuitry, go from one side to the other, designers cut holes in the substrate. Additionally, they produce similar boards for HVAC systems, instrumentation, power supply, vending machines, amplifiers, vehicle dashboards, LED lighting, and industrial controls.<\/p>\r\n\r\n<h3>Multi-Layer Blue PCB<\/h3>\r\n\r\n<p>Multi-layer PCBs typically consist of three or more double-layer blue PCBs. These have holes drilled by the designer so that circuits can travel through the circuit board. Additionally, multi-layer boards with the most layers might have up to 50 layers. These circuit boards are widely used in file servers, satellite systems, GPS technology, <a href=https://www.nextpcb.com/"https:////www.nextpcb.com//blog//medical-pcb-assembly-service/">medical equipment, and weather analysis devices.<\/p>\r\n\r\n<h3>Rigid PCBs<\/h3>\r\n\r\n<p><img alt=\"Rigid blue printed circuit board\" src=https://www.nextpcb.com/"//uploads//images//202211//22//1669086409-7196-vwDpOW.jpg/" style=\"width: 800px; height: 450px;\" \/><\/p>\r\n\r\n<p>A sturdy base material prevents twisting in <a href=https://www.nextpcb.com/"https:////www.nextpcb.com//blog//rigid-pcb/">rigid PCBs<\/a>. To guarantee that they maintain their rigidity for the duration of the electrical device's life, designers make them strong. They may have many layers, two layers, or only one layer.<\/p>\r\n\r\n<h3>Flexible<\/h3>\r\n\r\n<p>PCBs made of flexible material can be twisted and bent to conform to the precise requirements of electronic equipment. When considering the flexible blue circuit boards, saving assembly time, less error in manufacturing, and <a href=https://www.nextpcb.com/"https:////www.nextpcb.com//blog//analysis-of-temperature-rise-factors-of-printed-circuit-boards/">heat dissipation<\/a> is some other advantages.<\/p>\r\n\r\n<h2>Final Words<\/h2>\r\n\r\n<p>Comparable to traditional circuit boards are blue-printed circuit boards. Blue boards, though, are more inviting. As the designer <a href=https://www.nextpcb.com/"https:////www.nextpcb.com//blog//pcb-soldering/">solders the components<\/a> to their surface, they appear futuristic. Blue circuit boards have a shallower contract between <a href=https://www.nextpcb.com/"https:////www.nextpcb.com//blog//pcb-trace/">traces, planes, and vacant areas than green and red circuit boards. The blue solder mask must also be examined under a magnifying glass to find any manufacturing flaws.<\/p>\r\n\r\n<p>A blue-printed circuit board can route power and communications between physical devices. Designers utilize solder to electrically connect the electronic components to the blue PCB's surface. An effective mechanical adhesive, solder. And since it is metal, the blue surface makes it easy to notice. The proper fit of the components is ensured by soldering. It enables designers to accurately remove any worn-out parts from the blue substrate during repairs without affecting the others.<\/p>\r\n\r\n<p>Despite being in great demand, consumers of the blue PCBs cannot easily access them as they do with other modern boards. They are more costly than other boards as a result of their scarcity. However, expanding the production of these boards would lower the <a href=https://www.nextpcb.com/"https:////www.nextpcb.com//blog//pcb-cost-how-much-does-a-printed-circuit-board-pcb-cost/">cost and increase the consumers' access to blue PCBs. Almost all consumer electronics and commonplace sensors are built with blue circuit boards. Users may drill components across PCB boards with ease thanks to blue PCBs.<\/p>\r\n","status":1,"create_time":1669086760,"update_time":1680255498,"clicks":3951,"hits":6,"custom_url":"blue-circuit-board","related":"","add_uid":111,"publish_uid":0,"attr":0,"type":0,"keywords":"blue circuit board, PCB color","comment_count":0,"share_count":0,"need_move":0,"c_time":"2022-11-22 11:12:40","u_time":"2025-06-27 09:54:10","comments_count":0,"is_like":0}">

Blue Circuit Board - The Basic Introduction Is Here - NextPCB
Posted on March 31, 2023 by NextPCB
Blue circuit board electronics are becoming more and Blue PCB electronics are becoming more and more popular among engineers and electrical designers.

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Tag: PCB Color Blue Circuit Board
ANSI & <a href=https://www.nextpcb.com/"https:////www.iec.ch//homepage/">IEC to represent the components, symbols vary depending on the country.<\/p>\r\n\r\n<p>Wires, power sources, resistors, capacitors, diodes, transistors, meters, switches, sensors, logic gates, audio equipment, and other components mostly illustrate by the symbols which are for electronic circuits. Additionally, the majority of electrical circuit symbols include switches, cells, batteries, etc.<\/p>\r\n\r\n<h3>Why these Symbols?<\/h3>\r\n\r\n<p>Electrical and circuit diagrams both utilize symbols to indicate a component. Another name for it is a schematic symbol.<\/p>\r\n\r\n<p>According to its operating features, each component has a typical functionality. A connected route connects electronic components in an electronic circuit or schematic layout to complete the circuit. The corresponding symbols for it serve to symbolize these components. Most of the symbol designs are based on different national and international standards. Instances include IEC standards, JIC standards, ANSI standards, IEEE standards, etc. Although electrical symbols are standardized, they might differ from engineering discipline to engineering field depending on previous traditions.<\/p>\r\n\r\n<p>This makes it simple and clear for everyone to understand electrical circuits, schematic diagrams, and floor layouts. Unless the circuit is constructed with the components being physically used, electrical symbols only represent the individual parts of electrical and electronic circuits; they do not describe any functions or processes. There is a circuit symbol for each electrical device or component used in a circuit, such as <a href=https://www.nextpcb.com/"https:////www.nextpcb.com//blog//pcb-smd-components-types-and-how-to-identify-them/">passive components<\/a>, <a href=https://www.nextpcb.com/"https:////www.nextpcb.com//blog//pcb-smd-components-types-and-how-to-identify-them/">active components<\/a>, measuring devices, logic gates, etc. (For example, the circuit on a breadboard or assembled printed circuit board).<\/p>\r\n\r\n<h3>Advantages of the Symbols<\/h3>\r\n\r\n<p>Electronic symbols primarily use for simplifying drafting and making circuit diagrams easier to understand. The whole industry uses the same symbols. A symbol's precise meaning is provided by the inclusion of a dot, line, letter, letter spacing, shading, and number. One has to be familiar with the basic structure of various symbols to comprehend circuits and their corresponding symbol meanings.<\/p>\r\n\r\n<p>These symbols, which are represented by electronic drawings, are required for circuit design to communicate information about wiring, layouts, equipment locations, and its intricacies so that component arrangement may be done with ease.<\/p>\r\n\r\n<ul style=\"margin-left: 40px;\">\r\n\t<li><strong>Simple Accessibility<\/strong> - A symbol undergoes production once, and, from that onward, it is accessible to anybody on the network.<\/li>\r\n\t<li><strong>Reduces confusion in production<\/strong> - By using a defined set of electrical symbols, it is impossible to assign various symbols to similar components.<\/li>\r\n\t<li><strong>Lessens Rework<\/strong> - By developing and using a single, standardized set of electrical symbols, unnecessary and redundant schematic rework is eliminated. You won't need to go back and use the proper symbol on the second or third review if you use the authorized one the first time.<\/li>\r\n\t<li><strong>Greater Electrical and Mechanical Communication<\/strong> - The use of standardized electrical symbols reduces instances of misunderstanding between members of the MCAD and ECAD teams. The use of connections between 2D symbols and 3D modeled parts puts everyone on the same page.<\/li>\r\n\t<li><strong>Saves Time<\/strong> - Standardized electrical symbols not only save time on rework and misunderstandings, but they also make it much simpler to find the right symbol in your company's shared symbol library. You may be sure you're taken to the right file by using the search's symbol name, type, or manufacturer filters. There's no need to look for or try to discern which symbol's incarnation to utilize.<\/li>\r\n<\/ul>\r\n\r\n<h2>Identification of the symbols and the meaning<\/h2>\r\n\r\n<h3>Electrical Symbols<\/h3>\r\n\r\n<h4>1 . Switch<\/h4>\r\n\r\n<p><img alt=\"Switch - Electrical Symbol\" src=https://www.nextpcb.com/"//uploads//images//202211//22//1669084061-307-eEitCV.png/" style=\"width: 450px; height: 142px;\" \/><\/p>\r\n\r\n<p>In the application, there are many types of switches. Selecting the switches depending upon the application. The main purpose of a switch is to make the circuit to the "open" condition or to the "close" condition. The following are examples of some switches commonly identifiable in the industry.<\/p>\r\n\r\n<ul>\r\n\t<li><strong>Toggle switch<\/strong> - A lever that is tilted in one of two or more positions operates toggle switches. A toggle switch is a type of switch that is frequently used in home wiring.<\/li>\r\n\t<li><strong>Push button<\/strong> - Pushbutton switches are two-position devices, that can operate by pressing and releasing a button. For momentary functioning, the majority of pushbutton switches contain an internal spring mechanism that returns the button to its "out," or "unpressed," state.<\/li>\r\n\t<li><strong>Limit switch<\/strong> - These limit switches have a lever that operates with the functioning of the machine portion and closely resemble sturdy toggle or selection hand switches.<\/li>\r\n\t<li><strong>Proximity switch<\/strong> - Proximity switches use a magnetic or high-frequency electromagnetic field to detect the proximity of a metallic machine component.<\/li>\r\n\t<li><strong>Speed switch<\/strong> - These switches detect the rotational speed of a shaft either using an on-shaft centrifugal weight mechanism or through a non-contact method such as optical or magnetic shaft motion detection.<\/li>\r\n\t<li><strong>Pressure switch<\/strong> - When delivered to a piston, diaphragm, or bellows, which transforms pressure into mechanical force, gas or liquid pressure can be utilized to activate a switch mechanism.<\/li>\r\n\t<li><strong>Temperature switch<\/strong> - The "bimetallic strip," which is a thin strip made of two metals linked back-to-back and with each metal having a variable rate of thermal expansion, is a low-cost temperature-sensing method.<\/li>\r\n<\/ul>\r\n\r\n<h4>2. Cell<\/h4>\r\n\r\n<p><img alt=\"Cell - Electrical Symbol\" src=https://www.nextpcb.com/"//uploads//images//202303//31//1680251169-9961-PzBqCI.jpg/" style=\"width: 425px; height: 204px;\" \/><\/p>\r\n\r\n<p>The potential difference is provided by cells, which power the circuit. This is the source that mainly develops the charge for the circuit. Here chemical energy is the base energy source that energizes the whole circuit.<\/p>\r\n\r\n<h4>3. Battery<\/h4>\r\n\r\n<p><img alt=\"Battery - Electrical Symbol\" src=https://www.nextpcb.com/"//uploads//images//202303//31//1680251194-6136-Eqmcdt.jpg/" style=\"width: 425px; height: 204px;\" \/><\/p>\r\n\r\n<p>Making a connection between a few cells makes a battery. It is more energized than a single cell.<\/p>\r\n\r\n<h4>4. Lamp<\/h4>\r\n\r\n<p><img alt=\"Lamp - Electrical Symbol\" src=https://www.nextpcb.com/"//uploads//images//202303//31//1680248796-1699-RmjPBL.jpg/" style=\"width: 425px; height: 209px;\" \/><\/p>\r\n\r\n<p>The lamp will light up when the electrical charge is flowing through this. This results from an electrical current heating a thin filament, which causes it to glow.<\/p>\r\n\r\n<h4>5. Fuse<\/h4>\r\n\r\n<p><img alt=\"Fuse - Electrical Symbol\" src=https://www.nextpcb.com/"//uploads//images//202303//31//1680251253-8206-EhHwpr.jpg/" style=\"width: 425px; height: 142px;\" \/><\/p>\r\n\r\n<p>A safety component is a fuse. It has a lower <a href=https://www.nextpcb.com/"https:////www.nextpcb.com//blog//melting-point-of-solder/">melting-point wire in it. As a result, when the current is too high, the wire burns, breaking the circuit. By cutting the circuit, the excessive current can stop from starting fires and harming other parts.<\/p>\r\n\r\n<h4>6. Voltmeter<\/h4>\r\n\r\n<p><img alt=\"Voltmeter - Electrical Symbol\" src=https://www.nextpcb.com/"//uploads//images//202303//31//1680248843-8174-kyvEFA.jpg/" style=\"width: 425px; height: 204px;\" \/><\/p>\r\n\r\n<p>Voltmeter, an instrument that measures voltages of either direct or alternating electric current on a scale usually graduated in volts, millivolts (0.001 volts), or kilovolts (1,000 volts). Many voltmeters are digital, giving readings as numerical displays. The instruments just described can also provide readings in analog form, by moving a pointer that indicates voltage on a scale, but digital voltmeters generally have a higher order of accuracy than analog instruments. For example, a common analog voltmeter is likely to employ an electromechanical mechanism in which current flowing through turns of wire translates into a reading of voltage. Other types of voltmeters include the electrostatic voltmeter, which uses electrostatic forces and, thus, is the only voltmeter to measure voltage directly rather than by the effect of current.<\/p>\r\n\r\n<h4>7. Ammeter<\/h4>\r\n\r\n<p><img alt=\"Ammeter - Electrical Symbol\" src=https://www.nextpcb.com/"//uploads//images//202303//31//1680248870-1775-NVtFKR.jpg/" style=\"width: 425px; height: 204px;\" \/><\/p>\r\n\r\n<p>Ammeter: a device for measuring electric current in amperes, either direct (DC) or alternating (AC). Due to the fact that a shunt running parallel to the meter carries the majority of the current at high current values, the ammeter can measure a wide range of current values. A circle with a capital A inside it serves as the icon for an ammeter in circuit diagrams.<\/p>\r\n\r\n<p>The principles of operation and accuracy of ammeters differ. Accuracy ranges from 0.1 to 2.0 percent when measuring the direct current flowing through a coil hanging between two magnets' poles using the D'Arsonval-movement ammeter.<\/p>\r\n\r\n<h4>8. Thermistor<\/h4>\r\n\r\n<p><img alt=\"Thermistor\" src=https://www.nextpcb.com/"//uploads//images//202303//31//1680248891-8416-aDFIQP.jpg/" style=\"width: 425px; height: 204px;\" \/><\/p>\r\n\r\n<p>Thermistors are a specific kind of semiconductor that responds to temperature changes like a resistor; they have higher resistance than conducting materials but lower resistance than insulating materials. The electrical resistance of a thermistor can identify, and its measured value can be linked with the ambient temperature to establish a temperature measurement.<\/p>\r\n\r\n<h3>Electronic Symbols<\/h3>\r\n\r\n<h4>1. Resistor<\/h4>\r\n\r\n<p><img alt=\"Resistor - Electronic Symbol\" src=https://www.nextpcb.com/"//uploads//images//202303//31//1680248919-3366-xTwgNI.jpg/" style=\"width: 425px; height: 204px;\" \/><\/p>\r\n\r\n<p>The <a href=https://www.nextpcb.com/"https:////www.nextpcb.com//blog//what-is-resistor/">resistor is an electrical component that is passive and adds resistance to the flow of current. They are present in practically all electronic circuits and electrical networks. Ohm is a unit of measurement for resistance. When a resistor has one volt (V) drop across its terminals and a current of one ampere (A), the resistance that results can measure using ohms. The relationship between the current and voltage at the terminal ends is linear. Ohm's law illustrates this ratio:<\/p>\r\n\r\n<p><img alt=\"Ohms formula\" src=https://www.nextpcb.com/"//uploads//images//202303//31//1680248960-4093-pEyeav.jpg/" style=\"width: 425px; height: 143px;\" \/><\/p>\r\n\r\n<p>There are numerous applications for resistors. Among some examples are voltage division, heat production, matching and loading circuits, gain control, and time constant setup. They have resistance values that span more than nine orders of magnitude and use in various applications in the industry. They can be smaller than a square millimeter for electronics or utilized as electric brakes to disperse kinetic energy from moving trains.<\/p>\r\n\r\n<h4>2. Capacitor<\/h4>\r\n\r\n<p><img alt=\"Capacitor - Electronic Symbol\" src=https://www.nextpcb.com/"//uploads//images//202303//31//1680248987-0767-RPqMNV.jpg/" style=\"width: 425px; height: 204px;\" \/><\/p>\r\n\r\n<p>A <a href=https://www.nextpcb.com/"https:////www.nextpcb.com//blog//pcb-capacitors/">capacitor is a method to keep the voltage constant. They can help to lessen voltage pulsation. The capacitor is charged when a high voltage is given to the parallel circuit, and it is discharged when a low voltage is used.<\/p>\r\n\r\n<p>The letter C represents the capacitor with two terminals. A symbol resembling two parallel plates between two terminals represents the capacitor. The design employs two separate capacitor symbol kinds. A polarized capacitor uses one, whereas a non-polarized capacitor uses the other. In the polarized capacitor symbol, one of the parallel plates draws a bent line, making it distinct from the other one. The curved plate, representing the capacitor's cathode, should have a lower voltage than the anode pin (plane-parallel plate). The plane-parallel plate represents the anode of the capacitor; the plus symbol (+) denotes the anode.<\/p>\r\n\r\n<h4>3. Diode<\/h4>\r\n\r\n<p><img alt=\"Diode - Electronic Symbol\" src=https://www.nextpcb.com/"//uploads//images//202303//31//1680252070-8007-wSKhuW.jpg/" style=\"width: 425px; height: 204px;\" \/><\/p>\r\n\r\n<p>A <a href=https://www.nextpcb.com/"https:////www.nextpcb.com//blog//printed-circuit-board-diode/">diode is a semiconductor gadget that effectively switches current in a single direction. While significantly limiting current flow in the opposite direction, it permits easy flow in one direction.<\/p>\r\n\r\n<p>The diode is a polarized, two-terminal device that can identify with the letter D. One terminal of a diode is positive (anode), while the other is negative (cathode). An anode is the base of a triangle, while the closed side is its cathode.<\/p>\r\n\r\n<p>A horizontal isosceles triangle pressed up against a line connecting two terminals forms the shape of a diode. The diode operates under the forward bias situation, or we may say that the diode will let the current flow in this circumstance.<\/p>\r\n\r\n<h4>4. Light Emitting Diode (LED)<\/h4>\r\n\r\n<p><img alt=\"Light Emitting Diode (LED) - Electronic Symbol\" src=https://www.nextpcb.com/"//uploads//images//202303//31//1680249125-8083-ZUqPmr.jpg/" style=\"width: 425px; height: 204px;\" \/><\/p>\r\n\r\n<p>The LED symbol is also similar to the diode symbol but with extra arrows. These arrows appear to radiate out from the triangle and point in the opposite direction. Anode and cathode connections are found on polarized components like Led. LEDs (Light Emitting Diodes) transform electrical energy directly into light as opposed to traditional light sources, which first convert electrical energy into heat before turning it into the light. This results in efficient light creation with little electricity waste.<\/p>\r\n\r\n<h4>5. Photodiode<\/h4>\r\n\r\n<p><img alt=\"Ligh Emitting Diode (LED) - Electronic Symbol\" src=https://www.nextpcb.com/"//uploads//images//202303//31//1680249072-7666-dkqTBn.jpg/" style=\"width: 425px; height: 204px;\" \/><\/p>\r\n\r\n<p>In contrast to the LED symbol, the photodiode's symbol has arrows striking the diode. As arrows that hit the diode represent photons or light. Anode and cathode are the names of the two terminals on the photodiode.<br \/>\r\nUsing a photodiode, light converts into electrical current.<\/p>\r\n\r\n<h4>6. Zener Diode<\/h4>\r\n\r\n<p><img alt=\"Zener Diode - Electronic Symbol\" src=https://www.nextpcb.com/"//uploads//images//202303//31//1680249192-2388-acyARO.jpg/" style=\"width: 425px; height: 204px;\" \/><\/p>\r\n\r\n<p>A silicon semiconductor Zener diode is a circuit component that allows current to flow either forward or backward. The diode is made up of a unique, heavily doped p-n junction, intended to conduct in the opposite way when a specific voltage is attained.<\/p>\r\n\r\n<p>The reverse-breakdown voltage of the Zener diode is clearly defined; at this voltage, the device begins to conduct current and can continue to function continuously in the reverse-bias mode without suffering harm. In addition, the voltage drop across the diode is constant over a broad voltage range, which qualifies Zener diodes for use in voltage control.<\/p>\r\n\r\n<h4>7. Inductor<\/h4>\r\n\r\n<p><img alt=\"Inductor - Electronic Symbol\" src=https://www.nextpcb.com/"//uploads//images//202211//22//1669084538-603-IFGeRf.png/" style=\"width: 450px; height: 225px;\" \/><\/p>\r\n\r\n<p>A non-polarized two-terminal component is an inductor. Looping coils or curved bumps are visually identifiable there in between two terminals on an inductor's symbol. The international representation of an inductor is a filled-in rectangle, instead of loopy coils.<\/p>\r\n\r\n<p>In switched-mode power systems that generate DC current, inductors are frequently employed as energy storage components. The circuit receives energy from the inductor, which stores energy, to keep the current flowing during "off" switching periods, permitting topographies where the output voltage is higher than the input voltage.<\/p>\r\n\r\n<h2>Conclusion<\/h2>\r\n\r\n<p>In conclusion, electronic circuit symbols are signs, drawings, or pictograms used to represent various components in an electronic circuit's schematic diagram. Due to some universal standards established by ANSI & IEC to represent the components, symbols vary depending on the country.<\/p>\r\n\r\n<p>The circuit diagram virtually portrays circuit symbols. Every circuit uses standardized symbols to represent the various parts. To represent fundamental electrical devices, several electronic circuit symbols are the best option. Electronic circuit components such as switches, wires, sources, ground, resistors, capacitors, diodes, inductors, logic gates, transistors, amplifiers, transformers, antennas, etc., typically have separate circuit symbols. The linking of the circuits can analyze through circuit diagrams that employ these electrical and electronic circuit symbols. Wires, power sources, resistors, capacitors, diodes, transistors, meters, switches, sensors, logic gates, audio equipment, and other components are mostly represented by the symbols used in electronic circuits. Additionally, the majority of electrical circuit symbols include switches, cells, batteries, etc.<\/p>\r\n","status":1,"create_time":1669084663,"update_time":1680253653,"clicks":38667,"hits":42,"custom_url":"electrical-electronic-symbols","related":"","add_uid":111,"publish_uid":0,"attr":0,"type":0,"keywords":"electrical symbols, electronic symbols","comment_count":0,"share_count":0,"need_move":0,"c_time":"2022-11-22 10:37:43","u_time":"2025-06-27 15:40:27","comments_count":0,"is_like":0}">

Electrical & Electronic Symbols: A Basic Introduction with Chart
Posted on March 31, 2023 by NextPCB
Electrical equipment and electronic components are represented graphically by standard electrical and electronic symbols.

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Tag: Electrical Symbols Electronic Symbols
standard PCB<\/a>. According to the general rule of cost estimation, a PCB intended for portable and non-complicated devices should cost less than a PCB manufactured for high-tech machinery and military-grade. However, if you still want an estimation, a PCB may cost about $1-$300.<\/p>\r\n\r\n<p>To build a trustworthy relationship with our clients and let them experience our work quality, NextPCB is providing a <a href=https://www.nextpcb.com/"https:////www.nextpcb.com//0-for-1-4-layers-pcbs.html/">$0 PCB prototype<\/a> for the first order.<\/p>\r\n\r\n<h2><b>What Factors Affect PCB Price?<\/b><\/h2>\r\n\r\n<p>PCB material, size of the board, number of layers, and design complexity are the four main factors that specify the cost of a printed circuit board. But other factors can significantly impact a PCB price. In this article, NextPCB is shedding light on those <a href=https://www.nextpcb.com/"https:////www.nextpcb.com//blog//pcb-manufacturing/">PCB manufacturing<\/a> and <a href=https://www.nextpcb.com/"https:////www.nextpcb.com//blog//prototype-pcb/">assembling factors that influence the PCB price the most. <\/p>\r\n\r\n<h2><b>How to Reduce PCB Price in PCB Manufacturing<\/b><\/h2>\r\n\r\n<h3><b>Material Selection<\/b><\/h3>\r\n\r\n<p>The material selection of a printed circuit board is the most integral part of PCB production. As such, the material used in the PCB influences its price and properties. Generally, standard PCBs use<a href=https://www.nextpcb.com/"https:////www.nextpcb.com//blog//guide-to-fr-4-printed-circuit-board-material-nextpcb/"> FR-4 as the base material<\/a>. However, for high-tech and intense working PCBs, the material may change depending on the electrical and mechanical requirements of the circuit board.<\/p>\r\n\r\n<p>For example, in aerospace and military-grade devices, standard FR-4 substrate will serve a different purpose and eventually, high-quality material with better specifications will get prioritized.<\/p>\r\n\r\n<p>The factors that impact the material selection may include.<\/p>\r\n\r\n<ul style=\"margin-left: 40px;\">\r\n\t<li>The required dissipation factor<\/li>\r\n\t<li>Dielectric constant<\/li>\r\n\t<li><a href=https://www.nextpcb.com/"https:////www.nextpcb.com//blog//pcb-tg/">Glass transition temperature (Tg)<\/a><\/li>\r\n\t<li>The insulating property of the material<\/li>\r\n\t<li>Water absorption of the material<\/li>\r\n\t<li>Mechanical strength of the material<\/li>\r\n<\/ul>\r\n\r\n<p>To maintain insulation and reduce <a href=https://www.nextpcb.com/"https:////www.nextpcb.com//blog//signal-loss/">signal loss<\/a> in <a href=https://www.nextpcb.com/"https:////www.nextpcb.com//blog//high-frequency-PCB-Manufacturing/">high-frequency and high-speed circuit boards<\/a>, PCBs required substrate with lower loss tangent and higher glass Transition Temperature to ensure undisturbed and accurate signal transmission from one point to another. Such high-frequency compatible material usually costs more than the standard materials. For instance, the PCB substrate and other materials used in microwaves cost Ten times higher than the materials used in households and handy devices like toys, etc. Hence, material selection is the most significant factor in estimating a PCB price.<\/p>\r\n\r\n<h3><b>PCB Size and Quantity<\/b><\/h3>\r\n\r\n<p>The size of a PCB, quantity, and panel utilization are three of the most impactful factors after material selection in determining a PCB price. The number of small circuits needed to integrate on an individual PCB determines its size. However, panel utilization includes the placement of multiple PCB circuits on a single PCB laminate to use most of its space.<\/p>\r\n\r\n<p>The number of components and their sizes also affect the size of the PCB, which is directly proportional to the circuit board price.<\/p>\r\n\r\n<p>In the end, the quantity of the PCB matters a lot. Bulk orders allow manufacturers to place several small circuits on a single panel. This method reduces the manufacturer's hassle and cuts the production cost by dividing it into multiple circuit boards.<\/p>\r\n\r\n<h3><b>Number of Layers<\/b><\/h3>\r\n\r\n<p>The number of layers is another significant factor that determines the PCB price. Usually, <a href=https://www.nextpcb.com/"https:////www.nextpcb.com//blog//single-layer-flex-pcb/">single and <a href=https://www.nextpcb.com/"https:////www.nextpcb.com//blog//2-layer-print-circuit-boardpcb-manufacturer/">double-layer PCBs cost lower than <a href=https://www.nextpcb.com/"https:////www.nextpcb.com//blog//4-layer-pcb/">4-layer and <a href=https://www.nextpcb.com/"https:////www.nextpcb.com//blog//multilayer-printed-circuit-board/">multi-layer PCBs<\/a>. However, a remarkable difference appears if the circuit board already uses a high-quality material like PTEF and <a href=https://www.nextpcb.com/"https:////www.nextpcb.com//blog//roger-pcb-materials/">Rogers. Further, multi-layer circuit boards require more intense labor and manufacturing time. Hence, considering the added material, labor cost, and manufacturing time, the NextPCB is stating a rough estimation of the increase in PCB price with each increasing layer in the circuit board.<\/p>\r\n\r\n<ul style=\"margin-left: 40px;\">\r\n\t<li><b>1L to 2L:<\/b> 35 – 40%<\/li>\r\n\t<li><b>2L to 4L:<\/b> 35 – 40%<\/li>\r\n\t<li><b>4L to 6L:<\/b> 30 – 40%<\/li>\r\n\t<li><b>6L to 8L:<\/b> 30 – 35%<\/li>\r\n\t<li><b>8L to 10L: <\/b>20 – 30%<\/li>\r\n\t<li><b>10L to 12L: <\/b>20 – 30%<\/li>\r\n<\/ul>\r\n\r\n<h3><b>Surface Finish<\/b><\/h3>\r\n\r\n<p>A surface finish is any non-oxidizing conducting material deposited on the bare copper of the PCB. The surface finish protects open copper pads and improves the solderability of the circuit board. As such, a surface finish boosts the solderability and connection between the signal track and the component; it is crucial to use a compatible finish according to the requirements of the PCB. Some high-quality PCB finishes ensuring longer shelf-life, whereas some basic finishes work enough for hand-held devices. <\/p>\r\n\r\n<p><a href=https://www.nextpcb.com/"https:////www.nextpcb.com//blog//hasl-vs-enig-an-ultimate-guide-on-surface-finish/">HASL is one of the most common and budget-friendly finishes, but it is non-compatible with harsh environmental and electrical conditions. On the other hand, <a href=https://www.nextpcb.com/"https:////www.nextpcb.com//blog//hasl-vs-enig-an-ultimate-guide-on-surface-finish/">ENIG is a better finish than HASL but a little higher in price too. However, the hard-gold and soft-gold finish is the best option for incredibly enhanced performance and shelf-life, which is usually a demand for high-tech, aerospace, and military-grade devices. Hence, depending on the application and operating environment of the PCB, the finish may be a considerable cost driver.<\/p>\r\n\r\n<p>Different Finishes offer distinct features. For instance<\/p>\r\n\r\n<ul style=\"margin-left: 40px;\">\r\n\t<li><b>HASL: <\/b>high Solderability finish<\/li>\r\n\t<li><b>OSP:<\/b> <a href=https://www.nextpcb.com/"https:////www.nextpcb.com//blog//what-is-pcb-osp-surface-finish/">high Solderability finish<\/a><\/li>\r\n\t<li><b>LFHASL:<\/b> high Solderability finish<\/li>\r\n\t<li><b>IMM Sn:<\/b> high Solderability finish<\/li>\r\n\t<li><b>IMM Ag:<\/b> Good Solderability, Al wire bondable<\/li>\r\n\t<li><b>ENIG:<\/b> Good Solderability, Al wire bondable, friendly with BGA soldering<\/li>\r\n\t<li><b>Elec Au: <\/b>Solderability, Al\/Au wire bondable<\/li>\r\n\t<li><b>ENEPIG: <\/b>Solderability, Al wire bondable<\/li>\r\n<\/ul>\r\n\r\n<h3><b>Size of Hole Spacing between Tracks and Tracks Width<\/b><\/h3>\r\n\r\n<p>The size of <a href=https://www.nextpcb.com/"https:////www.nextpcb.com//blog//pcb-via/">holes and vias<\/a> is another factor that impacts a PCB price. Their quantity and diameter reflect the required labor and time. If a PCB design implements several too-thin diameter holes, it will increase the circuit board price; because a thin diameter hole requires special machinery and more specialized and careful labor to take out the task.<\/p>\r\n\r\n<p>Another element that plays its part in placing holes into the list of factors that affect PCB price is the layer account, quality, and <a href=https://www.nextpcb.com/"https:////www.nextpcb.com//blog//standard-pcb-thickness/">thickness of the material. Along with the size and quantity of the holes, the type of PCB material also impacts PCB price because a thicker PCB with rigid material is hard to drill and usually takes longer.<\/p>\r\n\r\n<h2><b>How to Reduce PCB Price in PCB Assembly?<\/b><\/h2>\r\n\r\n<h3><b>Type of Soldering<\/b><\/h3>\r\n\r\n<p>The type of soldering technology used in the circuit board has a direct relation with its price. The through-hole assembling usually comes at a higher cost because <a href=https://www.nextpcb.com/"https:////www.nextpcb.com//blog//through-hole-technology/">through-hole technology<\/a> needs several holes to drill in the board's surface and may require obsolete components. <\/p>\r\n\r\n<p>On the other hand, surface mount technology is more budget-friendly as it does not require holes which is a cost-driven factor. Also, the market demand and easy availability of the components reduce the PCB assembling price.<\/p>\r\n\r\n<p>Hence, the manufacturer counts assembling technology as a factor that affects the PCB price.<\/p>\r\n\r\n<h3><b>Number of Components<\/b><\/h3>\r\n\r\n<p>The number of components describes the required holes, drilling time, assembling cost, and labor. Ahead the place consumed by the electronic components also affects the PCB price. If a PCB uses several electronic components of enormous size, surely it will add up in its surface area. Further, too many through-hole or surface mount components will increase the assembling time and required labor. An increase in the following will eventually affect the PCB price.<\/p>\r\n\r\n<h2><b>How to Reduce the Cost of the PCB Design Process?<\/b><\/h2>\r\n\r\n<p>By utilizing some simple techniques and modifying things, it is possible to reduce PCB prices. A PCB usually end-up expensive when the designer needs to pay more attention to manufacturing tips and tricks that help reduce PCB price. Here NextPCB is stating some primary manufacturing practices that may help you to do so.<\/p>\r\n\r\n<h3><b>Reduce Surface Area<\/b><\/h3>\r\n\r\n<p>When designing the circuit, try to simplify and keep it small. There are many practices to consider while fitting a large complex circuit design in a small space. Pay attention to the spacing between the tracks and the surface areas of the pads. Unnecessary gaps between the tracks will occupy space for no good reason. Another way to reduce the surface area of the PCB is to use smaller components. Here the <a href=https://www.nextpcb.com/"https:////www.nextpcb.com//blog//pcb-smd-components-types-and-how-to-identify-them/">SMT components<\/a> take over the battle! Because they are tiny and widely available.<\/p>\r\n\r\n<h3><b>Reduce the Number of Layers<\/b><\/h3>\r\n\r\n<p>Each increasing layer adds up to 20-40 % to the PCB price. Hence, reducing PCB layers may tremendously decrease the overall cost. Squeezing a circuit is quite impossible but designing it by considering some PCB designing techniques is always something to appreciate. An experienced PCB designer can always incorporate the best design techniques to reduce circuit board prices. So investing in a good designer may lead to reduced manufacturing costs. <\/p>\r\n\r\n<h3><b>SMT Assembling over THT<\/b><\/h3>\r\n\r\n<p>To reduce the PCB price, prioritize the surface mount technology in the boards. SMT is the most used assembling technology that helps reduce the number of holes and surface area of the circuit board. It provides a better connection between the components and the PCB tracks and avoids drilling stress to the PCB. SMT does not require the same labor as THT and has a higher market demand. Hence, it is less expensive.<\/p>\r\n\r\n<h3><b>Chose a Budget-Friendly Manufacturer<\/b><\/h3>\r\n\r\n<p>Each manufacturer quotes a different price for the same PCB design. It may take a lot of work for a beginner to find a budget-friendly and reliable PCB manufacturer that provides quality under a reasonable price tag. But do not worry; the NextPCB got you covered here! NextPCB has been delivering PCB manufacturing, assembling, and component sourcing services for over 15 years. Our dedication and experience of more than a decade have listed us among the <a href=https://www.nextpcb.com/"https:////www.nextpcb.com//blog//top-20-pcb-manufacturers-in-the-world/">best PCB manufacturers in the world<\/a>.<\/p>\r\n\r\n<p>To avail of our services, <a href=https://www.nextpcb.com/"https:////www.nextpcb.com//contactus/">contact us here<\/a>.<\/p>\r\n\r\n<h2><b>How to estimate the PCB Price?<\/b><\/h2>\r\n\r\n<p>The NextPCB has stated the seven factors that affect and helps estimate PCB price. To simplify the cost estimation, NextPCB is writing it in the simplest form.<\/p>\r\n\r\n<p><strong>Single-layer PCBs,<\/strong> the engineering fee of $23 + plate-making fee of $0.006 per square centimeter + film fee of $0.0075 yuan per square centimeter.<\/p>\r\n\r\n<p><strong>Double-layer PCBs,<\/strong> the engineering fee of $37 + board-making fee of $0.0075 per square centimeter + film fee of $0.0075 yuan per square centimeter.<\/p>\r\n\r\n<p><strong>Four-layer PCBs,<\/strong> the engineering fee of $90 + board-making fee of $0.0015 per square centimeter + film fee of $0.0075 yuan per square centimeter.<\/p>\r\n\r\n<p>However, some manufacturers may also include additional testing charges of $0.0003 per point, depending on the complexity of the kanban.<\/p>\r\n\r\n<p>The delivery time and quantity also help in estimating the PCB price. The bulk quantity orders with no special delivery dates always cost less than the small orders with urgent delivery requirements. <\/p>\r\n\r\n<h2><b>Conclusion<\/b><\/h2>\r\n\r\n<p>Material choice, number of layers, surface area, number of components and holes, surface finish, and assembling technology are some factors that affect a PCB price at most. <\/p>\r\n\r\n<p>A standard PCB may cost more than usual if the designer lacks the necessary designing techniques and needs to make decisions wisely. Above, the NextPCB has stated some tips to reduce a PCB cost and an easy method to estimate it. We hope it will help!<\/p>\r\n","status":1,"create_time":1668998729,"update_time":1728895518,"clicks":3787,"hits":0,"custom_url":"factors-that-affect-pcb-price","related":"","add_uid":111,"publish_uid":0,"attr":0,"type":0,"keywords":"PCB price","comment_count":0,"share_count":0,"need_move":0,"c_time":"2022-11-21 10:45:29","u_time":"2025-06-27 15:18:54","comments_count":0,"is_like":0}">

The Factors that Affect PCB Price in Manufacturing and Assembly
Posted on October 14, 2024 by NextPCB
A PCB usually end-up expensive when the designer neglects manufacturing tips and tricks that help reduce PCB price.

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Tag: PCB Cost PCB Price
capacitors, it is now used in many different applications.<\/p>\r\n\r\n<p>The properties of ceramic materials used in the manufacturing process of ceramic circuit boards make them durable, reliable, and a great alternative to other electrical components. It is not the usual ceramic we can find as house decors, potteries, or flooring, as these ceramic boards are made of high-quality industrial materials with metal cores. They may also be called green boards, not because of the color, but because they use less toxic chemicals and have a smaller carbon footprint than their traditional counterparts.<\/p>\r\n\r\n<p>You might then be wondering, are ceramic base material PCBs any good? What are the advantages of ceramic PCB material and its drawbacks? When should someone use a ceramic PCB? In this article, we will go through all of these questions and provide the answer. Read along as this also covers the materials used to make it to the different ceramic PCB types available today, how they are produced, and where to source and find ceramic PCB manufacturers.<\/p>\r\n\r\n<p><img alt=\"Ceramic PCB\" src=https://www.nextpcb.com/"//uploads//images//202303//30//1680171187-3327-GVWpQv.jpg/" style=\"width: 800px; height: 459px;\" \/><\/p>\r\n\r\n<h2>What is a Ceramic PCB?<\/h2>\r\n\r\n<p>A ceramic printed circuit board is a type of PCB made of a ceramic material base or substrate, usually an inorganic dielectric, instead of the traditional fiberglass or epoxy resin base. It is an electronic circuit board made of a thin insulating layer of ceramic material with a metal component.<\/p>\r\n\r\n<p><img alt=\"Ceramic PCB\" src=https://www.nextpcb.com/"//uploads//images//202303//31//1680226945-773-ntmOdW.jpg/" style=\"width: 800px; height: 420px;\" \/><\/p>\r\n\r\n<h3>Basic Components of Ceramic PCBs <\/h3>\r\n\r\n<p>Let's examine its basic components. <\/p>\r\n\r\n<p>First is the highly integrated circuit board, which has become a trend that we cannot avoid with the advancement of electronic technology. Modern technology and electronics have hundreds or thousands, even millions, of transistors and resistors coupled in a complex assembly built on a small silicon chip or integrated circuit, widely known as IC.<\/p>\r\n\r\n<p>These integrated circuits need a base where tiny electronic materials and connections are built, usually known as a substrate. It also needs a structure that isolates the circuit from its external surroundings and turns it into just one compact and solid unit, known as the package.<\/p>\r\n\r\n<p>Substrates and packages are required for the integrated circuits to maintain their reliability. ICs need insulating materials, and these two serve that purpose. These packages will then be mounted on a printed circuit board.<\/p>\r\n\r\n<p>Ceramics are well known for their insulating properties. This advanced ceramic material's protection property is a significant factor for it to be used as substrates and packages. This is what makes a ceramic printed circuit board or PCB stands out from the rest of its kind.<\/p>\r\n\r\n<p>Due to its excellent heat conductivity and gas tightness performance, ceramic PCB has been widely used in power electronics, hybrid microelectronics, electronics packaging, and multi-chip modules. Its excellent conductivity is of utmost importance in applications such as power generation, where large currents must be passed through the material.<\/p>\r\n\r\n<p>The aerospace and automotive industries, in particular, are best suited to employ these PCBs since they have high-power-density circuit designs used in harsh environments.<\/p>\r\n\r\n<p>High temperature, high pressure, as well as corrosive or vibratory circuit conditions, are all suited for ceramic PCB substrate material. They are used in high-temperature applications where a regular PCB cannot be used as it would not be able to withstand high temperatures.<\/p>\r\n\r\n<h2>What are the Materials Used in a Ceramic PCB?<\/h2>\r\n\r\n<p>A variety of ceramic materials are used to make ceramic PCBs. When choosing ceramic materials, the two essential characteristics to pay attention to are the PCB thermal conductivity and coefficient of thermal expansion (CTE).<\/p>\r\n\r\n<p>Alumina or Aluminum Oxide (Al₂O₃), Aluminum nitride (AlN), beryllia or beryllium oxide (BeO), silicon carbide (SiC), and boron nitride (BN) are a few examples of the substrate materials that fall under the category of ceramic materials used in ceramic PCBs. These ceramic materials have comparable physical and chemical characteristics. Three of the most widely used materials in ceramic PCBs are the following.<\/p>\r\n\r\n<p style=\"text-align: center\"><img alt=\"alumina-powder\" src=https://www.nextpcb.com/"//uploads//images//202211//21//1668995945-7583-AQXnjI.jpg/" style=\"width: 350px; height: 350px;\" \/><\/p>\r\n\r\n<h3><b>Aluminum Oxide <\/b>(Al₂O₃)<\/h3>\r\n\r\n<p><a href=https://www.nextpcb.com/"https:////en.wikipedia.org//wiki//Aluminium_oxide/">Aluminum Oxide<\/a> is an inorganic compound, also known as alumina. It is an advanced material made of aluminum and oxygen. It usually appears white in color but varies depending on purity. The color can be pink to almost brown. This compound has no smell and comes in a crystalline powder form but does not dissolve in water.<\/p>\r\n\r\n<p>Of all the oxide ceramics, alpha-phase alumina is the stiffest and strongest. With higher than 95% alumina content, it is an exceptional electrical insulator and has a high electrical resistivity of approximately 1 × 1014 Ω·cm. The common purity ranges from 94% to 99%. The desired color, solidity, size, and shape should be easily achieved. It is considered beneficial for engineering production since the composition can be altered.<\/p>\r\n\r\n<p>This industrial oxide ceramic has outstanding thermal and corrosion stability, great mechanical and dielectric strength, and even the capacity to create airtight seals. The common, 96% alumina has a thermal conductivity property value of 25.0 W\/(m·K) and CTE of 4.5 to 10.9 x 10-6\/K. No wonder it is very popular, with all these benefits aside from its affordability and cost-effective price.<\/p>\r\n\r\n<p>It is the most commonly used substance in ceramics as it has many applications in electronics, including substrates and packages. When the application does not require the maximum level of thermal performance, this is the go-to material in use. It is one of the <a href=https://www.nextpcb.com/"https:////www.glennklockwood.com//materials-science//alumina.html/">most researched<\/a> and thoroughly characterized advanced ceramic materials now available.<\/p>\r\n\r\n<h3><b>Aluminum Nitride (AIN)<\/b><\/h3>\r\n\r\n<p><a href=https://www.nextpcb.com/"https:////en.wikipedia.org//wiki//Aluminium_nitride/">Aluminum nitride<\/a> (AIN) is a non-oxide, semiconductor technical grade ceramic material. The structure of this compound is a hexagonal crystal, and the color is blue-white in its pure form. The aluminum nitride, a synthetic ceramic compound, is commonly white or gray in color and may also sometimes appear as a  pale yellow.<\/p>\r\n\r\n<p><img alt=\"Aluminum Nitride PCB\" src=https://www.nextpcb.com/"//uploads//images//202211//21//1668996109-6634-xJSVwR.jpg/" style=\"width: 800px; height: 533px;\" \/><\/p>\r\n\r\n<p>One of the best ceramic substrate materials available right now is aluminum nitride (AlN). Its electrical resistivity ranges from 10 to 12 10x Ω-m, and the thermal conductivity value is from 80 to 200 W\/(m·K) that may even go up to 300 W\/(m·K). With these features alone, without a doubt, it is the most attractive and one of the best options to use as a PCB substrate.<\/p>\r\n\r\n<p>It has electrical insulation properties and a low coefficient of thermal expansion (CTE), 4 to 6×10-6K1 (between 20 and 1000°C), which is very close and resembles that of a <a href=https://www.nextpcb.com/"https:////great-ceramic.com//aluminum-nitride-properties///">silicon wafer<\/a>. This compound has a lot higher values than alumina, but it certainly comes with a higher cost as well. It is best suited for use in high-current and high-temperature environments.<\/p>\r\n\r\n<h3><b>Beryllium Oxide (BeO) <\/b><\/h3>\r\n\r\n<p>Beryllium Oxide (BeO) or <a href=https://www.nextpcb.com/"https:////www.chemistryworld.com//podcasts//beryllium-oxide//3010505.article/">beryllia, which was also known, historically, as glucan or glucinium oxide. As the name suggests, it is derived from beryl or the mineral <a href=https://www.nextpcb.com/"http:////www.webmineral.com//data//Bromellite.shtml#.Y3SmhS1h3OQ\">bromellite<\/a>. It is a solid crystalline inorganic compound that appears white in color.<\/p>\r\n\r\n<p>In addition to its great electrical insulating property, its thermal conductivity is higher than that of any other nonmetal [(209 to 330 W\/(m·K)], with the diamond as the only exception, and it even surpasses that of some metals. Beryllium oxide has rigid bonds between its atoms,  much like a diamond does. It transmits heat as vibrations across these strong bonds, and as a result, energy loss is minimal.<\/p>\r\n\r\n<p>This refractory compound has a high <a href=https://www.nextpcb.com/"https:////www.nextpcb.com//blog//melting-point-of-solder/">melting point<\/a> of 2506.85 °C to 2575 °C, a boiling point of 3905 °C, and a CTE of 7.4 to 8.9 x 10-6\/K. Given these exceptional properties of beryllium oxide, it is a valuable resource in the electronics sector with its widespread applications. Even other industries benefit from it due to its high melting point, excellent heat conductivity, and good electrical resistance.<\/p>\r\n\r\n<p>For over 60 years, beryllium oxide has demonstrated its outstanding chemical and thermal stability in challenging conditions and harsh environments. BeO is utilized to provide air or liquid cooling in applications where the PCB is exposed to high temperatures or in high-density PCBs with space constraints.<\/p>\r\n\r\n<h2><b>What are the types of ceramic PCBs?<\/b><\/h2>\r\n\r\n<p>There are different types of ceramic PCBs based on the manufacturing process. Below are the widely known and commonly used varieties that are currently available in the market.<\/p>\r\n\r\n<h3><b>Laser Activation Metallization PCB or LAM PCBs<\/b><\/h3>\r\n\r\n<p>The ceramic substance and the metal are ionized during the LAM process using a high-energy, powerful laser drill. They are growing together in the process, and as a result, it creates a bond or deep link. Then after, it achieves a better and smoother texture of the surface. LAM and DPC methods are getting more popular and being used these days.<\/p>\r\n\r\n<h3><b>Direct Plate Copper PCB or DPC PCB<\/b><\/h3>\r\n\r\n<p>This is an advanced coating technique, a new type of ceramic substrate processing where track printing and etching are carried out using thin copper, and it is plated to the ceramic substrate. The physical vapor deposition (PVD) method, a vacuum, and sputtering innovation are used to fabricate DPC to bond copper to substrates at high temperatures and pressures. The range of copper thickness with this process is 10 μm (≈ 1\/3oz) to 140 μm (4oz).<\/p>\r\n\r\n<h3><b>Direct Bonded Copper PCB or DBC PCB<\/b><\/h3>\r\n\r\n<p>With the DBC method, an appropriate amount of oxygen is introduced between copper and ceramic before or during the deposition process. This is utilized when there is a need to have a high copper thickness of 140 μm (4oz)-350 μm (10oz).<\/p>\r\n\r\n<h3><b>Low-Temperature Co-fired Ceramic PCB or LTCC PCBs<\/b><\/h3>\r\n\r\n<p>For this type, manufacturing can be done with or without glass. The conventional method is that a ceramic substance is combined with glass material in amounts ranging from 30% to 50% to create LTCC PCBs. Organic binders are incorporated into the mixture to bond the materials properly. Once the mixture is spread out on sheets to dry, <a href=https://www.nextpcb.com/"https:////www.nextpcb.com//blog//through-hole-technology/">through-holes are drilled following the design layout of each layer. Screen printing is used to print the circuit and fill the holes. 850 and 900 °C are the temperature range to finish it in an oven. <a href=https://www.nextpcb.com/"https:////www.nextpcb.com//blog//pcb-trace/">Traces on this method are usually gold.<\/p>\r\n\r\n<h3><b>High-Temperature Co-fired Ceramic PCB or <\/b><b>HTCC PCBs<\/b><\/h3>\r\n\r\n<p>HTCC PCBs are built from the ground up utilizing raw ceramic substrate material. At no point in the production process that a glass material is added. The only distinction between the HTCC and LTCC production processes is that HTCC PCBs are baked at a temperature of roughly 1600–1700 °C in a gaseous atmosphere. HTCC PCBs have such high co-firing temperatures that circuit traces made of metals with high melting points, such as tungsten, molybdenum, or manganese, are employed. At high temperatures, these PCBs will function without any damage as they are designed to operate even in harsh environments.<\/p>\r\n\r\n<h3><b>Thick Film Ceramic PCB<\/b><\/h3>\r\n\r\n<p>This type of PCB is utilized when oxidation is a concern. That is why the material is baked up to 1000 degrees Celsius in a nitrogen atmosphere after coating the ceramic base with dielectric, gold, silver, or the widely used copper. Since it is prevented from oxidation, the electric capacitors, resistors, conductors, and semiconductors can all be interchanged on the ceramic board. Its conductor layer can be made from 10 up to 13 microns in thickness.<\/p>\r\n\r\n<h2>Ceramic PCBs Benefits and Drawbacks<\/h2>\r\n\r\n<p>Ceramic PCBs have been in use for a while now, and they have been getting a lot of feedback. There are advantages to this type of PCB, such as its being more durable than other types of PCBs. However, there are some drawbacks to ceramic PCBs as well. However, with the remarkable set of qualities ceramic PCBs have, the benefits might outweigh the disadvantages.<\/p>\r\n\r\n<p>They are often recognized as the superior choice for various applications due to the many benefits offered by ceramic PCBs. It even has a lot of advantages over traditional <a href=https://www.nextpcb.com/"https:////www.nextpcb.com//blog//guide-to-fr-4-printed-circuit-board-material-nextpcb/">FR-4 PCBs<\/a>. The main benefit of ceramic PCB is that it is much more heat-resistant than traditional PCB. Below, we summarize some of the advantages ceramic PCBs have.<\/p>\r\n\r\n<h3>Advantages of Ceramic PCBs<\/h3>\r\n\r\n<ul style=\"margin-left: 40px;\">\r\n\t<li><b>High Thermal Conductivity <\/b>- Depending on the material used (alumina to beryllia, as stated earlier), the values range from 25 to 330 W\/(m·K). It is way beyond that of FR-4 PCB, more than 20x higher. With its ability to dispel heat, ceramic performs better and can prevent a device from being damaged by high temperatures.<\/li>\r\n\t<li><b>Low Coefficient of Thermal Expansion (CTE) <\/b>- It has solid and outstanding interatomic bonds, so it can withstand high temperatures and is still firm, stable, and steady even under changing temperatures. <\/li>\r\n\t<li><b>Excellent Thermal Insulation<\/b> - Ceramic is incredibly insulating; therefore, heat will be less likely to flow through the substrate, preserving the circuit board's components from getting damaged or harmed.<\/li>\r\n\t<li><b>Inorganic<\/b> - Due to its inorganic materials, it can work and be of use for a longer period of time. Also, the chemical resistance to erosion is impressive.<\/li>\r\n\t<li><b>Multi-Layering<\/b> - A multi-layer ceramic PCB can do a more complicated task. With the toughness of its material, another layer can be added easily and still keep the other components safe. It is excellent for heavy-duty applications.<\/li>\r\n\t<li><b>High Frequency <\/b>- High frequency can be handled by a ceramic PCB with its dimensional and thermal stability. Industries requiring high-frequency data and electrical signal transmissions, such as the medical and aerospace sector, will surely benefit from this.<\/li>\r\n\t<li><b>Cost Efficiency<\/b> - It may not come cheap outright compared to FR-4, but with its improved performance and service life, it will surely last longer. With its simple design and reduced fabrication, the overall system cost is still lower than metal core PCBs.<\/li>\r\n<\/ul>\r\n\r\n<h3>Disadvantages of Ceramic PCBs<\/h3>\r\n\r\n<p>Ceramic printed circuit boards (PCBs) have a number of advantages over other types of PCBs. However, there are also some potential drawbacks that need to be considered and carefully looked at. Maybe, they can be better in the future.<\/p>\r\n\r\n<ul style=\"margin-left: 40px;\">\r\n\t<li><b>Handling <\/b>- Ceramics can be delicate and fragile; therefore, it requires more attention and special handling during assembly and testing.<\/li>\r\n\t<li><b>Affordability<\/b> - Ceramic is a reasonably priced material. However, with all things considered, it is still more expensive than other materials used to make a traditional circuit board. It is a bit more costly in that case as its production requires special equipment.<\/li>\r\n<\/ul>\r\n\r\n<h2><b>When is It Ideal to Use Ceramic PCB?<\/b><\/h2>\r\n\r\n<p>Ceramic PCBs can be used in many applications but are not the best solution for all. With all factors considered, they may not be appropriate in all cases. <\/p>\r\n\r\n<p>It is essential to understand the factors that determine whether a ceramic PCB is a right choice for your project or application. Some factors to consider when deciding whether or not to use ceramic PCBs are their cost, weight, and thermal conductivity.<\/p>\r\n\r\n<p>They are resistant to corrosion, have a low thermal expansion, and can be manufactured with very thin layers and high aspect ratios. Hence, they are much lighter and have better thermal conductivity, making them ideal for applications where size, weight, and heat transfer are of vital concern. <\/p>\r\n\r\n<p>When there is a need for <a href=https://www.nextpcb.com/"https:////www.nextpcb.com//blog//multilayer-printed-circuit-board/">multi-layer boards<\/a>, their high thermal conductivity property will be in significant play. The inner circuit layer\/s and the surface will be spared from hot spots. This makes them ideal for use in applications where high temperatures are a concern, such as automotive or aerospace. Switching to ceramic PCBs may greatly improve machinery's reliability, specifically those used in the military and heavy equipment industrial sectors.<\/p>\r\n\r\n<p>In general, ceramic PCBs may be more expensive than traditional PCBs. Taking the cost into consideration, it offers several benefits that make them an excellent choice for selected applications.<\/p>\r\n\r\n<h2>How is a Ceramic PCB Manufactured?<\/h2>\r\n\r\n<p>Ceramics is not just one single material, as discussed in the earlier part of the article. When making ceramic boards, metals like silver or gold conductive pastes can lay trace connections in all layers. You may check the types of ceramic PCB section above that covers production as well.<\/p>\r\n\r\n<p>In any manufacturing, whatever industry it may be, it always starts with a plan that surely includes the ceramic PCB. Below, we will discuss the general process.<\/p>\r\n\r\n<p style=\"text-align: center\"><img alt=\"Ceramic PCB manufacturing\" src=https://www.nextpcb.com/"//uploads//images//202211//21//1668996148-7466-tJMlwO.jpg/" style=\"width: 339px; height: 148px;\" \/><\/p>\r\n\r\n<h2>Where to Find Ceramic PCB?<\/h2>\r\n\r\n<p>There are many sources of ceramic PCBs, both online and offline. Companies like NextPCB offer ceramic custom boards for electronics hobbyists and professionals alike. Many local electronics stores also carry ceramic PCBs.<\/p>\r\n\r\n<p>You can also find manufacturers online from AliExpress, Alibaba, etc. if you are looking for a variety of affordable options. The world's largest supplier of ceramic PCBs in China. This is because China has an abundant supply of raw materials for manufacturing ceramic PCBs and a high-tech production capability. Many online retailers also sell them. Be cautious though and take due diligence in finding a reputable supplier.<\/p>\r\n\r\n<p>Some ceramic PCBs are sold in bulk, while others are sold individually. The price of ceramic PCB can vary depending on the size of the order, the type of material you want, and the number of pieces. If you are buying online, you also have to consider the shipment cost. The cost of shipping, as usual, is determined by the weight of the package and the distance it has to travel, and the shipping method you choose.<\/p>\r\n\r\n<h2>Conclusion<\/h2>\r\n\r\n<p>A ceramic PCB is a type of electronic connector that is made of ceramic materials. It is mainly used to meet the rigorous demands of the electrical industry. This kind of printed circuit board has been gaining popularity for various reasons, but it is mainly because of the superiority it has over regular or traditional boards. They are made of materials that are not as sensitive to temperature changes, chemicals, and water, consequently becoming a more viable option for PCB designers, thanks to the recent advancements in the market.<\/p>\r\n\r\n<p>We hope you picked up some insights from this article as we walked you through the basic information about ceramic PCBs, their various types and materials, as well as the benefits that ceramic PCB provides, and also some of their disadvantages. We believe this is a great place to start for anyone curious about this industry and what ceramic PCBs are all about.<\/p>\r\n","status":1,"create_time":1668997164,"update_time":1705547082,"clicks":16170,"hits":5,"custom_url":"ceramic-pcbs","related":"","add_uid":111,"publish_uid":0,"attr":0,"type":0,"keywords":"ceramic PCB","comment_count":0,"share_count":0,"need_move":0,"c_time":"2022-11-21 10:19:24","u_time":"2025-06-27 15:43:29","comments_count":0,"is_like":0}">

Ceramic PCB: Its Materials, Types, Benefits and Drawbacks
Posted on January 18, 2024 by NextPCB
Ceramic PCB. What are its materials? Types, Benefits, Drawbacks, Application, Manufacturing, Advantages, and Disadvantages. Read more here.

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Tag: ceramic pcb Ceramic PCB
manufacturing. When circuit boards undergo fabrication, the <a href=https://www.nextpcb.com/"https:////www.nextpcb.com//blog//pcb-trace/">copper traces<\/a> of the board are usually exposed to environmental elements such as air and moisture, resulting in rust.<\/p>\r\n\r\n<p>So, to protect these copper traces on the printed circuit board, thus improving it, PCB manufacturers apply solder masks to protect the circuit boards. This guide shares intriguing details regarding PCB solder mask, their types, and a step-by-step guide to applying PCB solder masks.<\/p>\r\n\r\n<h2>What Is A PCB Solder Mask?<\/h2>\r\n\r\n<p><img alt=\"PCB Solder Mask\" src=https://www.nextpcb.com/"https:////www.nextpcb.com//uploads//images//202303//30//1680168725-9819-DuCRcN.jpg/" style=\"width: 800px; height: 453px;\" \/><\/p>\r\n\r\n<p>Naturally, circuit boards, upon fabrication, often appear in dull colors (grey or brown). However, with the solder mask application on the circuit board, it becomes green (or other <a href=https://www.nextpcb.com/"https:////www.nextpcb.com//blog//pcb-color/">PCB colors<\/a> of choice). This process is a result of a protective layer called a solder mask.<\/p>\r\n\r\n<p>Solder mask is a protective coating applied over the printed circuit board's surface, preventing the board's circuitry from electrical shorts and overall oxidation. The traditional color for solder masks is usually green hence why most PCBs are called <a href=https://www.nextpcb.com/"https:////www.nextpcb.com//blog//green-pcbs-why-are-most-pcbs-green/">green PCBs<\/a>.<\/p>\r\n\r\n<h2>Functions of PCB Solder Mask<\/h2>\r\n\r\n<p>PCB solder mask prevents oxidation, a reaction when a metal is exposed to air in the atmosphere. During oxidation, the metal reacts with air losing its chemical properties and starting to rust. So, to prevent PCB from oxidation, applying a solder mask is crucial.<\/p>\r\n\r\n<p>Also, Solder Mask offers protection from electrical shorts in the Printed Circuit Board. Without the solder mask application, solder paste interacts with the copper traces on the PCB during assembly. So, when components are soldered on the circuit board, there will be shorts leading to design failure.<\/p>\r\n\r\n<h2>Types of PCB Solder Mask<\/h2>\r\n\r\n<p>There are four significant types of PCB solder masks used in the PCB manufacturing process. They include the following:<\/p>\r\n\r\n<h3>Top and Bottom Solder Masks<\/h3>\r\n\r\n<p><a href=https://www.nextpcb.com/"https:////www.nextpcb.com//blog//top-20-pcb-manufacturers-in-the-world/">PCB manufacturers<\/a> and engineers employ these masks to identify openings in the green solder mask, which is already applied on the printed circuit. This solder mask is applied through epoxy liquid or film methods.<\/p>\r\n\r\n<p>After identifying the openings, components are soldered through them on the circuit boards. The solder mask used to determine top board traces is the top-side mask. Similarly, the solder mask employed in bottom board traces is called the bottom-side mask.<\/p>\r\n\r\n<h3>Epoxy Liquid<\/h3>\r\n\r\n<p>In terms of cost, <a href=https://www.nextpcb.com/"https:////www.nextpcb.com//blog//pcb-material/">epoxy is a cheap material<\/a> for solder masks. The epoxy liquid is a polymer that hardens when heated and silkscreened on the printed circuit board.<\/p>\r\n\r\n<p>Silkscreening is a printing technique that utilizes a mesh that identifies open areas that require inking. This process prevents the blocking of component holes on the printed circuit board.<\/p>\r\n\r\n<h3>Liquid Photo Imageable (LPI) Solder Masks<\/h3>\r\n\r\n<p>This kind of solder mask is a combination of two different liquids. These liquids are kept separately and are usually mixed before the application of the solder mask to improve the shelf life of the printed circuit board.<\/p>\r\n\r\n<p>LPI solder mask is available in different PCB colors, which offer differences in designs and applications across the electronic industry.<\/p>\r\n\r\n<h3>Dry Film Solder Masks (DFSM)<\/h3>\r\n\r\n<p>The dry film solder mask application on the PCB board uses vacuum lamination. The dry film is placed over the circuit board, and a vacuum seals the film on the PCB. Since this film is dry, it offers no film irregularities in copper plating.<\/p>\r\n\r\n<p>Flat-printed circuit boards benefit from dry film solder masks, which offer uniform thickness. However, it is pretty expensive compared to LPI solder masks.<\/p>\r\n\r\n<h2>Step-By-Step Process of Applying PCB Solder Mask<\/h2>\r\n\r\n<p>It is normal to think that applying a PCB solder mask is relatively easy. But it is only easy when you use a DIY Solder mask on simple design PCBs. However, <a href=https://www.nextpcb.com/"https:////www.nextpcb.com//blog//pcb-manufacturing/">PCB manufacturing<\/a> and <a href=https://www.nextpcb.com/"https:////www.nextpcb.com//blog//pcb-assembly-process/">assembly <\/a>is a different ball game as PCB trends usually change.<\/p>\r\n\r\n<p>Also, PCB manufacturers require the right equipment, machines, and materials to apply a solder mask on a circuit board effectively. Here are the step-by-step processes to apply solder masks on printed circuit boards.<\/p>\r\n\r\n<h3>Board Cleaning<\/h3>\r\n\r\n<p>Before carrying out any process, the circuit boards must be thoroughly clean and free from dust and moisture.<\/p>\r\n\r\n<h3>Solder Mask Ink Coating<\/h3>\r\n\r\n<p>After thorough board cleaning, the board is placed in a vertical coater containing solder mask ink coating. The ink covers the entire copper traces on the circuit board. The coat's thickness varies on the number of components and the thickness of the printed circuit board.<\/p>\r\n\r\n<h3>Pre Hardening<\/h3>\r\n\r\n<p>After coating, the next step is to place the ink-coated PCB into a dryer, where it is carefully inspected for an even and solid layer. This process also ensures that unwanted coating can be easily removed before the next stage.<\/p>\r\n\r\n<h3>Imaging and Hardening<\/h3>\r\n\r\n<p>Next, imaging is done by utilizing a photo film (transparent) that has circuit images fit on the printed circuit board before exposure to Ultraviolet light. During exposure, the solder mask covered by the transparent film becomes hardened. While the solder mask covered by the circuit images still maintains pre-hardening.<\/p>\r\n\r\n<p>This process must be done with excellent precaution and preciseness by aligning the transparent film perfectly on the circuit board; otherwise, the whole PCB batch becomes obsolete.<\/p>\r\n\r\n<h3>Developing<\/h3>\r\n\r\n<p>In the Developing stages, the circuit board is put into a developer, a machine consisting of high-pressure water sprays. The developer washes away the transparent film and excess unhardened ink coating.<\/p>\r\n\r\n<h3>Final Hardening and Cleaning<\/h3>\r\n\r\n<p>After the developing stage, the board undergoes hardening so that the ink coating becomes hard across the entire surface. Also, the circuit board is then cleaned to remove dust particles from its surface. After the cleaning process, the next step is surface smoothening and assembly of electrical components on the circuit board.<\/p>\r\n\r\n<h2>Conclusion<\/h2>\r\n\r\n<p>Solder masks are essential during PCB fabrication and manufacturing by applying a protective layer on the circuit boards to prevent oxidation and circuit shorts. Also, a solder mask ensures easy soldering of components on the circuit board without causing damage to the copper traces.<\/p>\r\n\r\n<p>Solder masks undergo different processes to ensure that your PCB stands out in its design and application. Your PCB Manufacturer must uphold the importance of solder masks in your PCB design.<\/p>\r\n\r\n<p>At NextPCB, we take PCB solutions and services to the next level with start-of-the-art modern manufacturing facilities. We believe in quality PCBs and seriously handle our manufacturing and assembly process with great care and precision.<\/p>\r\n\r\n<p>Do you have a specific PCB design in mind? Try us today. <a href=https://www.nextpcb.com/"https:////www.nextpcb.com//pcb-quote/">Quote Now<\/a> and get the best quality service.<\/p>\r\n","status":1,"create_time":1668766805,"update_time":1736325233,"clicks":4305,"hits":0,"custom_url":"what-is-a-pcb-solder-mask","related":"","add_uid":111,"publish_uid":0,"attr":0,"type":0,"keywords":"solder mask","comment_count":0,"share_count":0,"need_move":0,"c_time":"2022-11-18 18:20:05","u_time":"2025-06-27 15:19:06","comments_count":0,"is_like":0}">

What Is Solder Mask - PCB Manufacturing & Assembly
Posted on January 08, 2025 by NextPCB
PCB solder mask is a protective coat layer applied on Circuit boards which protects them from corrosion and electrical shorts

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Tag: Solder Mask
first patented<\/a> in 1986 by Hunt, an American company. The hole wall is treated with a dispersed toner suspension and then electroplated. This is the first time that carbon has been applied to the metallization of pores. The process is called "BlackHole." The technology was then resold to <a href=https://www.nextpcb.com/"http:////www.macdermidalpha.com/">MacDermide, where it remains today. MacDermide is in recent years only rapid development, mainly used for the <a href=https://www.nextpcb.com/"https:////www.nextpcb.com//blog//flexible-printed-circuit-board/">flexible board (FPC)<\/a> and BT PCB, for <a href=https://www.nextpcb.com/"https:////www.nextpcb.com//blog//rigid-pcb/">rigid PCB<\/a> cases are not rare. According to the current owners and peer products in the market application situation, NextPCB makes a preliminary analysis and discussion, for the circuit board industry practitioners' reference and correction.<\/p>\r\n\r\n<h2>The Blackhole Process is used for FPC and BT PCB<\/h2>\r\n\r\n<h3>FPC and BT PCB Features<\/h3>\r\n\r\n<p><a href=https://www.nextpcb.com/"https:////www.nextpcb.com//blog//flexible-printed-circuit-board/">Flexible PCB<\/a> or Flex Circuits is the type of PCB or circuit board that has bending ability according to our required and wanted shapes. FPC is mainly made of CU (Copper foil) (E.D. Or R.A. copper foil), A (Adhesive) (acrylic and epoxy resin thermoset adhesives), and PI (Kapton, Polyimide) (polyimine films). FPCB has many advantages, such as space-saving, weight reduction, and high flexibility, and is widely used in production and life. <\/p>\r\n\r\n<p>BT PCB (LED cooling substrate, <a href=https://www.nextpcb.com/"https:////www.nextpcb.com//blog//led-printed-circuit-board/">LED aluminum substrate<\/a>, etc.) mainly refers to a thickness, not more than 1mm, and has bis maleimide triazine as the substrate of the rigid board. These two kinds of substrate have a common point: flexible circuit boards are generally within 0.1 mm. But BT rigid boards are within 1mm, with most through holes and no blind holes and buried holes.<\/p>\r\n\r\n<h3>Principle and Process of Blackhole Metallization<\/h3>\r\n\r\n<h4>Blackhole Metalization Principle<\/h4>\r\n\r\n<p>The principle of the blackhole is to adjust the positive charge of the hole wall through the coulomb force to attract particles in a negatively charged dispersed suspension. After drying, a graphite-covered conductive layer is formed on the pore wall. Then you can directly plate the copper in the acid dielectric. The interaction between the pore wall and particle is essentially a chemical reaction of organic functional groups. The regulator can contain heterocyclic compounds containing nitrogen, and the carbon upper band when the graphite particles contact the pore wall, under appropriate conditions, the carbon ring of regulator a opens and the dehydration cross-linking reaction occurs with b. The graphite particles are then chemically bonded to the pore wall. The structure diagram after the cross-linking reaction is as follows:<\/p>\r\n\r\n<p><img alt=\"The structure diagram after the cross-linking reaction\" src=https://www.nextpcb.com/"//uploads//images//202211//17//1668679808-185-VOvcnw.png/" style=\"width: 800px; height: 377px;\" \/><\/p>\r\n\r\n<h4>Blackhole Metalization Process<\/h4>\r\n\r\n<p>The technological process of the blackhole method:<br \/>\r\nCopper clad laminate → cleaning → black holeization → drying → striping → electro-coppering<br \/>\r\nThe concrete practice is:<br \/>\r\n1. <strong>Clean<\/strong>: the purpose is to greasy dirt and other impurities of removing in the printed board through the hole, in helping and the electric of the resin surface, is beneficial to blackhole liquid and adsorbs fully on the hole wall; This operation is carried out in two steps;<\/p>\r\n\r\n<ul style=\"margin-left: 40px;\">\r\n\t<li>Alkali cleaning: the copper clad laminate that the machine work with is good, immerse to contain in the alkaline bath with a concentration is 5～20% NaOH aqueous slkali and soaked for 5～20 minutes, the temperature remains at 20～60 ℃ of scopes, and after the taking-up, the water flushing is rinsed well with deionized water again;<\/li>\r\n\t<li>Pickling: with the copper-clad laminate (printed board) of alkali cleaning, put into concentration and be 10% dilution heat of sulfuric acid, under room temperature state, flooded 1～3 minutes, after the taking-up, the water flushing is rinsed well with deionized water again;<\/li>\r\n<\/ul>\r\n\r\n<p>2. <strong>Black<\/strong> holeization: the printed board is immersed in the liquid of the blackhole, and the temperature remains at 15～40 °C, flood for 1～10 minute, make black hole liquid equitably coated on the hole wall, and contact well in the dielectric base layer, make and deceive the hole plate;<\/p>\r\n\r\n<p>3. <strong>Dry<\/strong>: will deceive orifice plate and place vacuum or heat drying under the room temperature, the heating-up temperature is incubated for 20～30 minutes 75～120 ℃ of scopes, can use a far infrared drying machine or other drying plants to carry out, and makes through this operation to form a uniform black thin film in the hole;<\/p>\r\n\r\n<p>4. <strong>Striping<\/strong>: through the printed board of the above-mentioned operation, all exposed portions all scribble one deck of black thin film, and this operation is the black thin film of the copper laminar surface will be removed; Carry out in order to follow method:<\/p>\r\n\r\n<ul style=\"margin-left: 40px;\">\r\n\t<li>Mechanical Method is utilized wiping board machine or other instruments, wipes the black thin film that remains in the copper laminar surface;<\/li>\r\n\t<li>Weak etch: 200g\/l sodium peroxydisulfate and a concentration is 0.4～1% sulfuric acid liquid, is mixed with weak corrosive liquid, will deceive the orifice plate and put into weak corrosion liquid bath, at room temperature soaks water flushing immediately after the taking-up about 1 minute; This process should be carried out in the dedicated slot, utilizes circulating pump to filter, and weak corrosive liquid can be recycled.<\/li>\r\n<\/ul>\r\n\r\n<p>5. <strong>Electro-coppering<\/strong>: will deceiving the hole plate, to immerse concentration be to flood in 5% the sulfuric acid solution, after the taking-up, carries out electric plating of whole board in the acid electroplating bath of routine, and Current Control is at 1～1.5A\/dm during plating 2, the time kept 0.5 hours, and thickness of coating reaches 6 μ m and gets the final product.<\/p>\r\n\r\n<h3>Why Blackhole Process Is not Used on Rigid PCB Large Scaly?<\/h3>\r\n\r\n<p>According to the current process practice, the manufacturing of rigid PCB on the market mostly adopts the traditional <a href=https://www.nextpcb.com/"https:////www.nextpcb.com//blog//pth-blackhole-shadow-pcb-hole-metallization-process/">PTH (including horizontal and vertical two kinds), especially the manufacturing of <a href=https://www.nextpcb.com/"https:////www.nextpcb.com//blog//nextpcb-hdi-pcbs/">HDI PCB<\/a>. According to the customer's feedback, we summarize the reasons as follows (welcome to leave your comment in the bottom of the article):<\/p>\r\n\r\n<ul style=\"margin-left: 40px;\">\r\n\t<li>Believe that the reliability of the blackhole process is not good<\/li>\r\n\t<li>HDI board has blind holes, and the toner cannot be evenly distributed in the blind holes, which is easy to break the holes<\/li>\r\n\t<li>The blackhole process is not suitable for part of the high thickness-to-diameter ratio (aspect ratio) of the rigid circuit board board<\/li>\r\n<\/ul>\r\n\r\n<h2>Blackhole Metallization Process Application<\/h2>\r\n\r\n<p>According to the customer situation of the blackhole process, the actual distribution of customers using blackholes for rigid PCB is as follows:<\/p>\r\n\r\n<h3>Blackhole Process is Used for BT PCB<\/h3>\r\n\r\n<p>Because the thickness of the BT board generally does not exceed 1 mm, the aperture is not less than 0.2 mm. The blackhole process of this kind of product adaptability is good, the number of manufacturers using the blackhole process in the current market segment is more and more in the south and central China market.<\/p>\r\n\r\n<h3>Blackhole Process for Simple Rigid PCB<\/h3>\r\n\r\n<p>The reliability and technology are actually better than the traditional PTH and polymer (conductive film), on account of the smaller thickness ratio (aspect ratio) of a simple rigid PCB in the current process practice. However, market acceptance is not high, but the acceptance is increasing. The blackhole process is still in the stage of promotion and persuasion.<\/p>\r\n\r\n<p>The following table is a comparison of the results of the solder float (288℃) of our company's blackhole process for simple rigid boards. The circuit board tested substrate is <a href=https://www.nextpcb.com/"https:////www.nextpcb.com//blog//guide-to-fr-4-printed-circuit-board-material-nextpcb/">FR-4./r/n/r/n
$\"The-solder-float-test-of-rigid-PCB\"$ PCB manufacturer<\/a> should consider the blackhole process for hole metallization (direct plating) during the project reconstruction and expansion.<\/p>\r\n","status":1,"create_time":1668680299,"update_time":1680163592,"clicks":2651,"hits":0,"custom_url":"feasibility-of-applying-blackhole-metallization-process-to-rigid-pcb","related":"","add_uid":111,"publish_uid":0,"attr":0,"type":0,"keywords":"Blackhole, rigid PCB, flexible PCB","comment_count":0,"share_count":0,"need_move":0,"c_time":"2022-11-17 18:18:19","u_time":"2025-06-27 09:54:00","comments_count":0,"is_like":0}">

Feasibility of Applying Blackhole Metallization Process to Rigid PCB
Posted on March 30, 2023 by Sean H.
Blackhole process can meet the requirements of most of the rigid board, flexible board and flex-rigid board. PCB board factories should consider the blackhole process for hole metallization.

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Tag: Rigid PCB Flexible PCB Blackhole
microcontrollers. Most of these devices use wire bonding within their PCBs because it makes sure about the durability and functionality of the components.<\/p>\r\n\r\n<h4>Mobile Phones<\/h4>\r\n\r\n<p>When considering mobile phones the wire bonding can be found in the battery of the mobile phones. In the field of mobile phones, we can consider wire bonding as wire bonding is a technology that uses ultra-sonic, metal-metal friction methods for the welding of the battery cells to make a battery pack. In the early stages of industries like mobile phones, manufacturers were using spot welding to make such kinds of connections between terminals. But with the rising of wire bonding technology, it replaced spot welding.<\/p>\r\n\r\n<p>When considering the manual spot welding for the mobile phone battery packs and other chips, short circuits and issues in the batteries came up. The reason behind that is due to the high-temperature gain at the spot-welding affecting negatively on the battery lifespan and, the loose connections are also a problem that arises in the spot-welding process. Due to the spot-welding loose connections will damage the BMS (Battery Management System).<\/p>\r\n\r\n<p>Using the wire bonding technique replaced the spot welding technique from most industries.<\/p>\r\n\r\n<h4>Electrical Vehicle (EV) Battery Pack<\/h4>\r\n\r\n<p>There are now a few different ways to connect cylindrical cells to the busbar. The more popular connecting techniques are wire bonding, laser welding, spot welding, resistance welding, and spot welding. Ultrasonic energy is used in wire bonding to cause the wire or ribbon to share electrons with the surface, forming an atomic bond. As the ultrasonic procedure eliminates the oxide layer and exposes virgin aluminum to allow the transfer of valence electrons, the self-limiting aluminum oxide aids in optimizing the wire bonding process.<\/p>\r\n\r\n<p><img alt=\"Wire-Bonding-Using-machines\" src=https://www.nextpcb.com/"//uploads//images//202211//17//1668652951-6681-YlxULg.jpg/" style=\"width: 600px; height: 338px;\" \/><\/p>\r\n\r\n<p><img alt=\"Cylindrical Battery wire bonding\" src=https://www.nextpcb.com/"//uploads//images//202211//17//1668652979-4092-hDvHbn.png/" style=\"width: 600px; height: 420px;\" \/><\/p>\r\n\r\n<h4>In the Microcomputers<\/h4>\r\n\r\n<p>Microcomputers are a type of small computers that can perform different functions according to the user requirements. In microcontrollers also, the manufacturers are using wire bonding. This will make the terminal communication more precise and durable for better performance of the microcomputer.  The type of material used for the wire bonding of the microcomputers also affects the performance of the microcontroller. As the signals are the main thing in the microcomputers that use for functioning.<\/p>\r\n\r\n<p><img alt=\"Sensitive wire bonding application\" src=https://www.nextpcb.com/"//uploads//images//202211//17//1668653054-2429-DGnaAm.jpg/" style=\"width: 600px; height: 500px;\" \/><\/p>\r\n\r\n<h3>Why is it Important?<\/h3>\r\n\r\n<p>when considering the wire bonding with the developing PCB industry, it can be seen that most industries are moving towards high-sensitive <a href=https://www.nextpcb.com/"https:////www.nextpcb.com//blog//pcb-manufacturing/">PCB manufacturing<\/a>. So wire bonding is a special case that is common to the <a href=https://www.nextpcb.com/"https:////www.nextpcb.com//blog//7-pcb-industry-trends/">PCB industry<\/a>.<\/p>\r\n\r\n<p>There are reasons why manufacturers should use wire bonding other than stick to old traditional methods. Some of the reasons are as follows:<\/p>\r\n\r\n<ol>\r\n\t<li>One of the main advantages of the wire bonding method is, the stability of the finished product is better than the often-used traditional SMT patch method.<\/li>\r\n\t<li>Corrosion will not take place due to moisture and organic materials. Because of that, the durability is higher than the normal cases.<\/li>\r\n\t<li>The possibility of happening a short circuit is very low.<\/li>\r\n\t<li>Wire Bonding connections have a long period and on the other hand, economically it is good. Moreover, space-saving and good heat dissipation are sided advantages for the users.<\/li>\r\n<\/ol>\r\n\r\n<p>Considering the above cases, it's evident that the primary reason for using this method is its anti-corrosive properties and the long-term stability of the connections. The wire bonding approach also offers many advantages over other previous techniques. In the context of electric vehicle (EV) technology, wire bonding provides low resistance and robust connections for battery packs, ensuring a continuous power supply from the battery packs.<\/p>\r\n\r\n<h2>Main Purpose of Wire Bonding<\/h2>\r\n\r\n<p>The main purpose of wire bonding is to make connections between chips and other connectors. In that case, the reliability and durability of the connection are highly concerned. Encountering all the above-mentioned factors in a profitable ammer is another advantage in wire bonding. Most importantly the wire bonding can apply over the PCBs handling a <a href=https://www.nextpcb.com/"https:////www.nextpcb.com//blog//high-frequency-PCB-Manufacturing/">frequency above GHz.  It has been an essential factor to consider. They are the signals and voltage pulses when comes to the modern technological world.<\/p>\r\n\r\n<p>That's because now everything in the technological world is using electronic voltage signals. Moreover, the computational parts of modern appliances need real-time communication between other parts. So in order to supply, reliable communication between them reliable and durable communication path is essential. Furthermore, the speed of transferring data between the electronic modules is another factor that <a href=https://www.nextpcb.com/"http:////www.nextpcb.com/">PCB manufacturers<\/a> should consider. So in order to supply speedy communication, wire bonding is the best option according to the newest technologies. It helps to minimize the distortion that can happen to the signals.<\/p>\r\n\r\n<p>For that wire, bonding came as a solution that has the ability to cover all mentioned important factors.<\/p>\r\n\r\n<p>Moreover, when considering today's main topic EV, manufacturing companies always keep their attention on the following factors. Mainly if they undergoing the wire bonding technology.<\/p>\r\n\r\n<h3>Flexibility<\/h3>\r\n\r\n<p>The capacity to conduct an in-situ mechanical pull test is provided by wire bonding. In the non-destructive test, a force applies to the bond and evaluates the strength of the bond. This applies for is a pre-set value force. Pull testing can identify weak or non-stick bond failures that cause newborn death. Pull test findings are instantly accessible and can make a database for complete traceability, much like the bond process data.<\/p>\r\n\r\n<p>Stress relief loops between the connecting points use to tolerate thermal strains from the environment and from the product itself. Wire connecting technologies develops for wire diameters ranging from 18 microns on the low side to 600 microns on the high side. To meet the criteria for resistance and conductivity, suitable wire diameters can use. The loop form can dynamically adjust to changes in bond sites for required resistivity or impedance matching.<\/p>\r\n\r\n<p>This is occasionally necessary for electronics operations for fine-tuning accurate resistivity or impedance. Due to their greater cross sections, ribbon bonding methods use to permit higher current transfer, and they design to cover a wide range of sizes.<\/p>\r\n\r\n<h3>In-process Monitoring<\/h3>\r\n\r\n<p>Several electrical and mechanical signals are recorded in real time while the wire bonding operation is taking place. This enables quick checking of the bond terms and a determination of bond quality while the bond transaction is ongoing. Modern data analysis methods allow for the classification and matching of the signs of typical failure mechanisms. Such as contamination or wrong bonds, as well as the storage of suspect bonds for further post-bond examination.<\/p>\r\n\r\n<h3>Ability to Rework<\/h3>\r\n\r\n<p>The possibility to replace weak or unsuccessful wires on a per-wire basis and try rework is provided by wire bonding. When compared to other connection methods, which only provide a single chance of success, the option to redo offers a special advantage.<\/p>\r\n\r\n<p>Above are some special points that consider when wire bonding is taking place. In the industry and it is clear that wire bonding is more advantageous.<\/p>\r\n\r\n<h2>Available methods for wire Bonding<\/h2>\r\n\r\n<p>Most industries use Wire Bonding under three main methods. They are as follows,<\/p>\r\n\r\n<p><img alt=\"Available methods for wire Bonding\" src=https://www.nextpcb.com/"//uploads//images//202211//17//1668653100-8508-kBRmuW.jpg/" style=\"width: 600px; height: 408px;\" \/><\/p>\r\n\r\n<h3>1) Thermocompression Bonding:<\/h3>\r\n\r\n<p><img alt=\"Thermocompression Bonding\" src=https://www.nextpcb.com/"//uploads//images//202211//17//1668653129-3474-RFJKpq.jpg/" style=\"width: 600px; height: 337px;\" \/><\/p>\r\n\r\n<p>A solid phase direct bonding procedure without an intermediary layer is thermo-compression bonding. The principal use of materials like Cu, Au, Al, and Ti is to improve one or both bond partners. Atomic contact, temperature impact, and pressure all contribute to the bond-forming process. A fascinating approach for obtaining wafer-level bonding at low temperatures without the use of an electric field (anodic bonding) or a laborious pre-bond cleaning step is thermo-compression bonding of metals (plasma-assisted silicon direct bonding). Due to electronics considerations, the usage of metals like Al and Cu are at the top of the priority, particularly for 3D integration.<\/p>\r\n\r\n<p>Both the sealing and the electrical connection may be accomplished during one bonding procedure. Although the thermo-compression bonding of gold and copper has been known for a while, we are also using Al-based bonding. Contrary to the Au and Cu-based bonding, the Al thermo-compression bonding is of great interest. Since it can be implemented extremely quickly, even in CMOS processes.<\/p>\r\n\r\n<p>Advantages of the thermo-compression bonding process:<\/p>\r\n\r\n<ul>\r\n\t<li>High fracture toughness<\/li>\r\n\t<li>Conductive to electricity<\/li>\r\n\t<li>Hermetical sealing<\/li>\r\n\t<li>Small bonding frames<\/li>\r\n\t<li>Uniformed deposition<\/li>\r\n<\/ul>\r\n\r\n<h3>2) Thermosonic Bonding:<\/h3>\r\n\r\n<p>A procedure that joins two materials by applying pressure, time, heat, and ultrasonics. To form the connection, the wire is sometimes subjected to heat before being lightly rubbed against a hot surface (at 150 degrees Celsius or less).<\/p>\r\n\r\n<p>This procedure makes use of gold wire and a gold bond surface, and it was first connected to Ball Bonding because Ball Bonding was the first application of ultrasonics as a bonding parameter. Even though the term "Thermosonic Bonding" is now used to describe wedge bonding, there are still some people who will only use it to refer to ball bonding.<\/p>\r\n\r\n<h4>Gold Ball Bonding:<\/h4>\r\n\r\n<p>Copper wire is using for this procedure in recent years, but the equipment needs modifications in order to stop the oxidation of the wire and, in particular, the ball during its production during flame-off.<\/p>\r\n\r\n<p><img alt=\"Gold Wire Bonding\" src=https://www.nextpcb.com/"//uploads//images//202211//17//1668653165-943-VaJeWv.jpg/" style=\"width: 600px; height: 528px;\" \/><\/p>\r\n\r\n<p>Gold Wire bonding is the process of attaching a gold wire to two places in an assembly. To create an electrically conductive channel or connector. The attachment points for the gold wire form using a combination of force, heat, and ultrasonics.<\/p>\r\n\r\n<p>The production of a gold ball at the capillary, the tip of the wire bond instrument, marks the beginning of the attachment point creation process. The tool used to press this ball against the heated assembly surface while also generating ultrasonic motion at a frequency between 60 kHz and 152 kHz.<\/p>\r\n\r\n<p>After the initial bond is complete, the wire will be carefully maneuvered to create the proper loop shape for the assembly's geometry. The second bond, also known as the stitch, is then created on the opposite surface by applying pressure with the wire and tearing it at the bond with a clamp.<\/p>\r\n\r\n<p>When compared to some solders, gold wire bonding provides a connectivity method within packages that are approximately an order of magnitude more electrically conductive. Gold wires are also softer than most and have a higher oxidation tolerance than other wire materials, which is crucial for delicate surfaces.<\/p>\r\n\r\n<p>Depending on the requirements of the assembly, the procedure may also change. A gold ball uses on the second bonding area when working with delicate materials to forge a stronger and "softer" bond that won't scratch the component's surface. A single ball can serve as the beginning point for two bonds in confined settings, generating a "V"-shaped bond. A ball sets on top of a stitch to produce a security bond, enhancing the stability and strength of the wire when a bond between two pieces of wire has to be more robust. Utilizing software on Palomar's wire bond systems, the practically infinite number of applications and variations for wire bonding is possible to carry out.<\/p>\r\n\r\n<h4>Bump Bonding or Stud Bumping:<\/h4>\r\n\r\n<p><img alt=\"Stud bumping in wire bonding\" src=https://www.nextpcb.com/"//uploads//images//202211//17//1668653201-3909-OKovln.jpg/" style=\"width: 600px; height: 400px;\" \/><\/p>\r\n\r\n<p>In flip-chip applications, ball bumping is crucial because it creates crucial interconnects between the chip and substrate. Ball bumping is possible on a wafer or an assembly level, however, it typically carries out on a wafer level.<\/p>\r\n\r\n<p>In that, a ball creates at the capillary and gets deposited onto the surface using a combination of force, ultrasonics, and heat, ball bumping is very similar to the initial step of gold wire bonding. The wire will shear off immediately above the ball, creating a planar bump on the part's surface, as opposed to forming a loop after the ball attaches.<\/p>\r\n\r\n<p>The overall size of the bump is controlled by controlling the ball size, which depends on a trustworthy bonding procedure to maintain a constant wire tail length prior to ball formation. There will be considerable differences in bump sizing if each bump is not regularly executed effectively.<\/p>\r\n\r\n<p>The precise application of force is important in the bumping process since it affects the bump's height and shape. In order to create bumps with a consistent size and planarity, the shearing procedure is using to separate the wire from the ball must be precisely checkout.<\/p>\r\n\r\n<p>It is essential for the assembly procedures that will use these components, later on, to form consistent planar bumps all across a wafer.<\/p>\r\n\r\n<p>The advanced software program "Tailless Smooth Bump" from Palomar offers all the essential settings for producing bumps. It has remarkably constant in size, shape, and planarity for this process. The most effective solution for any ball-bumping application is provided by this software. In conjunction with the dependability and competence of the 8000i wire bonder.<\/p>\r\n\r\n<h4>Wedge Bonding<\/h4>\r\n\r\n<p><img alt=\"Wedge-Bonding-in-the-wire-bonding\" src=https://www.nextpcb.com/"//uploads//images//202211//17//1668653228-0195-quGEQo.jpg/" style=\"width: 600px; height: 500px;\" \/><\/p>\r\n\r\n<p>Without using a ball for the first bond, wedge bonding forms the stitches on both ends using a wedge tool. The connections themselves are narrow and oblong. Both gold and aluminum wire is the best options for wedge bonding, however, aluminum wire at room temperature is more typical.<\/p>\r\n\r\n<p>A ribbon or circular wire is possible to use for bonding during the wedge bonding procedure. The capillary on a ball bonder must be oriented in the direction of the bond, but the wedge bonding tool can rotate to bond from any angle. This enables bonding for a certain assembly from all possible angles.<\/p>\r\n\r\n<h3>3) Ultrasonic Bonding<\/h3>\r\n\r\n<p>The ultrasonic bonding procedure is rising since the 1940s and has had time to develop in a range of sectors. It was initially created for metal welding; however, it was later modified for plastic parts. The thickness of the components that need to be linked determines whether the ultrasonic welding technique is feasible. Thick pieces can typically not be bonded together using ultrasound. The machinery and combined materials will determine the maximum thickness, which is normally a few millimeters. Applications for ultrasonic metal welding are only for malleable metals like nickel, copper, and aluminum. The method widely uses for bond sheet metal, microcircuit connections, foils, ribbons, and meshes.<\/p>\r\n\r\n<p>Ultrasonic bonding needs a spotlessly clean surface free of debris, grease, and other impurities. Corrosion or bond failure might happen if the surface has a small number of polluted particles.<\/p>\r\n\r\n<p>In the case of batteries, to avoid the damages that can happen to the internal parts, cleaning of the batteries should carry out more safely. Therefore, abrasion-producing mechanical techniques are very harmful to use.<\/p>\r\n\r\n<p>Some manufacturers manually prepare surfaces by wiping them down with clean cloths, isopropanol, and acetone. Although they can get fantastic results, this technique is not practical for manufacturers who wish to speed up and optimize their processes. The only method that now perfectly cleans small, localized surfaces while enabling automation is laser cleaning.<\/p>\r\n\r\n<p>The ultrasonic bonding method is common in the industries such as the computer and electrical industry, Aerospace and automotive industry, and mostly in the medical industry.<\/p>\r\n\r\n<p>A crucial technology for the assembly of battery module components is ultrasonic wire bonding. To distribute the current, cells connect to busbars (or current collectors) through wires. In most cases, they are on the top of the module.<\/p>\r\n\r\n<table class=\"blueTable\">\r\n\t<thead>\r\n\t\t<tr>\r\n\t\t\t<th>Wire Bonding<\/th>\r\n\t\t\t<th>Operating Temperature<\/th>\r\n\t\t\t<th>Wire Material<\/th>\r\n\t\t\t<th>Pad Material<\/th>\r\n\t\t\t<th>Note<\/th>\r\n\t\t<\/tr>\r\n\t<\/thead>\r\n\t<tbody>\r\n\t\t<tr>\r\n\t\t\t<td>Thermocompression<\/td>\r\n\t\t\t<td>300-500℃ Au<\/td>\r\n\t\t\t<td>Au<\/td>\r\n\t\t\t<td>Al, Au<\/td>\r\n\t\t\t<td>High pressure, no ultrasonic energy<\/td>\r\n\t\t<\/tr>\r\n\t\t<tr>\r\n\t\t\t<td>Ultrasonic<\/td>\r\n\t\t\t<td>25℃<\/td>\r\n\t\t\t<td>Au, Al<\/td>\r\n\t\t\t<td>Au, Al<\/td>\r\n\t\t\t<td>Low pressure in ultrasonic energy<\/td>\r\n\t\t<\/tr>\r\n\t\t<tr>\r\n\t\t\t<td>Thermosonic<\/td>\r\n\t\t\t<td>100-240℃<\/td>\r\n\t\t\t<td>Au, Cu<\/td>\r\n\t\t\t<td>Al, Au<\/td>\r\n\t\t\t<td>Low pressure in ultrasonic energy<\/td>\r\n\t\t<\/tr>\r\n\t<\/tbody>\r\n<\/table>\r\n\r\n<h2>Materials Available for the Wire Bonding<\/h2>\r\n\r\n<h3>Gold<\/h3>\r\n\r\n<p>Gold is the chosen material for bonding wire due to its many advantages. High electrical conductivity, superior corrosion resistance, and the capacity to get bonds in place in an ambient environment are some of these advantages. The most widely used metal for bonding wire is still gold, which is carefully purified to high purity (99.99 percent gold).<\/p>\r\n\r\n<p><img alt=\"Gold for the wire bonding\" src=https://www.nextpcb.com/"//uploads//images//202211//17//1668653505-7295-kvzoOR.png/" style=\"width: 600px; height: 491px;\" \/><\/p>\r\n\r\n<h4>How to Use Gold Wires for Bonding<\/h4>\r\n\r\n<p>Ball bonds and wedge bonds are the two basic types of wire bonds. Gold wire is quite versatile and can weld to either a ball or a wedge. Below is a description of how to make a gold wire bond.<\/p>\r\n\r\n<ol>\r\n\t<li>The ends of the gold wire locally melt with a tiny flame or spark to create a spherical ball that is rough twice the diameter of the wire. <\/li>\r\n\t<li> The next step is the welding of the spherical ball thermostatically to a metal pad semiconductor.<\/li>\r\n\t<li>As the capillary bonding crosses across to the device package or circuit board's contact pad, a wire loop forms.<\/li>\r\n\t<li>Next, the wire is subject to welding thermostatically to the metalized pad of the device package.<\/li>\r\n\t<li>The sharp edge of the tool is to cut the wire. Its length allows protruding to form the subsequent ball.<\/li>\r\n<\/ol>\r\n\r\n<p>In the electronics industry, there are multiple competing needs for cost reduction, smaller components, and greater system functionality. In the near future, insulated wire bonding technology will employ to assist chip manufacturers and designers in balancing these conflicting objectives. By adding insulation to bare gold bonding wires, short circuits get control, making it possible to realize chip designs that were previously impractical.<\/p>\r\n\r\n<h3>Aluminum<\/h3>\r\n\r\n<p><img alt=\"Aluminum for the wire bonding\" src=https://www.nextpcb.com/"//uploads//images//202211//17//1668653541-002-bzSqIs.jpg/" style=\"width: 600px; height: 300px;\" \/><\/p>\r\n\r\n<p>A crucial distinction between aluminum wire bonding and gold wire bonding is that the surface does not need to be heated to 150°C or even just slightly above ambient temperature. Aluminum bonds are formed with the help of force and ultrasonics. The process for making an aluminum wire bond, which includes two attachment places and a particular loop shape, is the same as for making a gold wire bond. Since the surface does not need to be heated during the attachment steps for the wire, the only elements required for the binding are force and ultrasonics.<\/p>\r\n\r\n<p>Similar to gold wire, aluminum wire offers a reliable electrical conduit for connections between parts of an assembly, but it also has certain important advantages. Aluminum bonding enables the formation of interconnections on assemblies. The bondings are temperature-sensitive and the materials are unable to tolerate the temperatures typically needed for gold bonding. On aluminum surfaces in hermetically sealed containers, aluminum wire is also much more favored over gold wire because the temperatures required for hermetically sealing might weaken the links between aluminum and gold.<\/p>\r\n\r\n<p>Wedge bonders frequently use aluminum wire, which, along with gold wire, represents the two primary material kinds for wire bonding. Due to their distinct qualities, other materials, including certain alloys, employ in some particular wire bond applications. Successful wire bonding depends on the ability to use the right frequency, force, and temperature for any specific material. The wire bond systems at Palomar have it fully incorporated.<\/p>\r\n\r\n<h3>Copper wire<\/h3>\r\n\r\n<p>Because of their affordability and resistance to sweep (the tendency of the wire to move in the plane perpendicular to its length) during plastic encapsulation, copper-ball bonding to IC metallization has recently attracted a lot of attention. The bondability of this system is its main flaw. Because copper is tougher than gold and aluminum, metallization may happen or will push away. Consequently, a tougher metallization is needed. Additionally, because copper oxidizes easily, the ball bonding procedure must be done in an inert environment.<\/p>\r\n\r\n<h2>Process of Wire Bonding and Challenges<\/h2>\r\n\r\n<p>Wire bond manufacture and reliability face a number of difficulties. These difficulties frequently depend on a number of variables, including the material systems, bonding parameters, and use environment. Aluminum-Aluminum (Al-Al), Gold-Aluminum (Au-Al), and Copper-Aluminum (Cu-Al) are three separate wire bond-bond pad metal systems that need various production conditions and perform differently in the same application settings.<\/p>\r\n\r\n<h3>Wire Bond Manufacturing<\/h3>\r\n\r\n<p>Numerous studies are undergoing to evaluate different metal systems, examine important manufacturing parameters, and pinpoint common reliability problems that arise in wire bonding. The application and usage environment will determine the metal system when it comes to material choice. When selecting a choice, the electrical, mechanical, and financial aspects are frequently under the consideration.<\/p>\r\n\r\n<p>For example, a large-diameter aluminum wire bond in a hermetically sealed ceramic box would be necessary for a high-current device for space application. Avoiding gold wire bonds may be necessary if cost is a major restriction. Studies on copper wire bonding in automotive applications currently undergoing. This is only a small sample of extensive research. That did for examing and testing which material systems perform best in various applications.<\/p>\r\n\r\n<p>The bonding parameters are crucial for bond formation and bond quality from a production standpoint. Bond quality can significantly get impacted by a number of variables. They are bond force, ultrasonic energy, temperature, and loop shape, to mention a few. Different wire bonding methods (thermosonic, ultrasonic, and thermocompression) and wire bond types (ball, wedge) have an impact on how susceptible they are to manufacturing flaws and reliability problems. For fine pitch or a complicated design, specific materials and wire sizes are more useful. The stack-up of the barrier layer and metallization will have an impact on the bond formation. Hence the bond pad is also crucial.<\/p>\r\n\r\n<p>Poor bond quality and manufacturing flaws commonly cause failure modes. They are fractures at the ball bond neck, heel cracking (wedge bonds), pad liftoff, pad peel, overcompression, and inappropriate intermetallic formation. To identify manufacturing and quality problems, a combination of destructive physical analysis (DPA), nondestructive testing, and wire bond pull\/shear testing can use as tests.<\/p>\r\n\r\n<h3>Reliability of the Wire Bonding<\/h3>\r\n\r\n<p>Wirebond manufacturers frequently ignore wear-out factors that affect wire bond reliability while concentrating on bond quality. In this situation, knowledge of the application and usage environment can assist in avoiding dependability problems. Elevated temperature, high humidity, and temperature cycling are a few examples of situations that frequently cause wire bond failures.<\/p>\r\n\r\n<p>Excessive intermetallics (IMC) development at high temperatures can lead to brittle areas of fracture. There has been a lot of research done to describe intermetallic development and aging for different metal systems. This is not an issue in metal systems where the wire bond and bond pad are made of the same material as Al-Al. In systems made of different metals, this does become an issue. The brittle intermetallics generated in gold-aluminum IMCs, such as purple plague, are one of the best-known examples. Wire bond failures can cause by diffusion-related problems like Kirkendall voiding and Horsting voiding.<\/p>\r\n\r\n<p>Corrosion can be a problem in areas with high humidity and temperature. Galvanic corrosion is what causes this, which is most prevalent in Au-Al metal systems. Halides like chlorine can speed up this behavior when they are present. When describing this Au-Al corrosion, Peck's law for temperature and humidity also take into consideration frequently. Other metal systems do not use this as frequently.<\/p>\r\n\r\n<p>Due to a mismatch in the coefficient of thermal expansion (CTE) between the epoxy molding compound (EMC), the lead frame, the die, the die adhesive, and the wire bond under temperature cycling, thermomechanical stress will generate in the wire bond. Because of the shear or tensile strains in the wire bond, this causes low cycle fatigue. The fatigue life of wire bonds under such circumstances can predict using a variety of fatigue models.<\/p>\r\n\r\n<p>Having a thorough understanding of metal systems and the usage environment is frequently the most crucial aspect of raising wire bond reliability.<\/p>\r\n\r\n<h2>Testing of Wire Bonds<\/h2>\r\n\r\n<p>Although there are various wire bond pull and shear testing methods, these are more frequently used to assess the manufacturing quality of products than their reliability. They frequently involve monotonic overstress techniques, where the essential results are the peak force and fracture location. The damage in this instance cause due plasticity and does not reflect any wear-out mechanisms that may be visible in an environmental setting.<\/p>\r\n\r\n<h3>Wire Pull Testing<\/h3>\r\n\r\n<p><img alt=\"Wire pull testing\" src=https://www.nextpcb.com/"//uploads//images//202211//17//1668653573-0121-vgSMbJ.jpg/" style=\"width: 600px; height: 448px;\" \/><\/p>\r\n\r\n<p>It entails employing a metal hook to draw a wire up in the z-axis. A specific force applies to the bond during a non-destructive test, or the force can increase during a destructive test until the bond or wire breaks. The results of the analysis used to assess bond strength result in a number of failure modes during the test. A crucial component of the test is the test parameters, such as test speed and tool location, as variations in these factors might result in a variety of failure mechanisms.<\/p>\r\n\r\n<p>It is possible to do the Ribbon bonding using the wire pull testing. It is standard procedure to pull the wire's center during wire pull tests. It's can identify as the mid-span pull. Alternately, if the bond is tested at one of the ends, the hook can be positioned close to that end if that is the failure mode of interest. It's crucial to pull the wires at the same position for comparison when testing numerous samples.<\/p>\r\n\r\n<h4>Mid-Span Break<\/h4>\r\n\r\n<p>Along its length, the wire snaps in the middle. Since the bonds on both ends of the wire are still strong, this result does not represent the bond strength. If the bond's actual load is likely to be similar to the force needed to break it, the outcome might be acceptable.<\/p>\r\n\r\n<h4>Heat Affect Zone Break<\/h4>\r\n\r\n<p>The portion of a wire that is closest to the ball is known as the heat-affected zone (HAZ). Although heat is applied, HAZ's microstructure is disrupted instead of melting. The heat-affected zone (HAZ) is the weakest link in a wire bond, as demonstrated by the pull test in which the wire breaks from the HAZ.<\/p>\r\n\r\n<h4>Heel Break<\/h4>\r\n\r\n<p>The wire breaks at the loop's heel, indicating that this area of the bond is the weakest. The heel strength is the focus of the test; if it is deemed unacceptable, bonding parameters like the bond head force and loop shape may be changed.<\/p>\r\n\r\n<h4>Bond Break<\/h4>\r\n\r\n<p>Due to faulty intermetallic connections, the bond can separate from the neck or heel. This test demonstrates the bond's strength, which may or may not satisfy the criteria of the application.<\/p>\r\n\r\n<h4>Substrate\/Package Bond Pad Break<\/h4>\r\n\r\n<p>A bond pad on the substrate or packaging may lift off the bond during a pull test. This demonstrates how much stronger the bond is than the bond pad.<\/p>\r\n\r\n<h3>Shear Testing<\/h3>\r\n\r\n<p>It entails exerting pressure on the ball bond to move it laterally. The strength of the ball bond is the force responsible for the ball's lateral movement. The two main shear test factors are test speed, which represents how quickly the bond is loaded, and shear height, which is the height at which the ball is pushed by the tool.<\/p>\r\n\r\n<p>The bond failure is the most significant failure that the test can produce, while there are other interesting failure modes as well. A bond can typically get weaker due to subpar material quality, bondage, and improper bonding techniques. Gold and copper balls, solder bumps, and copper pillars can all test with shear testing.<\/p>\r\n\r\n<h3>Peel Testing<\/h3>\r\n\r\n<p>Most of the time peel testing is the best testing method for Ribbon connections. To draw the ribbon up, pull it up in the z-axis while holding one end of the ribbon or wire with tweezers. A force vs. displacement graph created by the peel test shows the strength of the ribbon connectors. A flexible choice for evaluating ribbons is the peel test, which can accommodate a wide range of ribbon sizes and loop topologies.<\/p>\r\n\r\n<h3>Thermal Testing<\/h3>\r\n\r\n<p>A wire-bonded die assembly is heated to a certain temperature or subjected to thermal cycling as part of thermal testing. The goal is to subject the wire bond to thermal testing to see whether it can withstand application requirements. Electronics applications or fabrication procedures like curing an encapsulation might result in thermal stress.<\/p>\r\n\r\n<h3>Microscopic Inspection<\/h3>\r\n\r\n<p>To identify any potential problems with the wire bonds, such as bond break due to metallization lift-off, structural deformity of the ball bond or bump, soft metallization, poor heel stick, and heel cracks. In addition to the standard wire bond tests, the wire bond structures can observe using SEM or the optical profiler. The visual examination is possible to use in conjunction with the wire bonder to spot recurring problems that weaken the bond strength and fix them.<\/p>\r\n\r\n<h2>Final Word<\/h2>\r\n\r\n<p>Wire bonding serves as a means of introducing and removing electrical connections from the main components. There are three types of wire bonding technologies in the industry. They are Hot pressing wire bonding (TC), wedge-wedge ultrasonic wire bonding (US), and heat ultrasonic wire bonding.  They are common technologies in the industry.<\/p>\r\n\r\n<h3>Advantages of wire bonding:<\/h3>\r\n\r\n<ol>\r\n\t<li>Use printed circuit boards to connect extremely complicated circuits at the chip level.<\/li>\r\n\t<li>Often, wire bond applications are the only way to implement sensor solutions.<\/li>\r\n\t<li>Savings in space when relative to packaged chips<\/li>\r\n\t<li>Flexibility in the shape of chips, packages, and substrates<\/li>\r\n\t<li>High reliability<\/li>\r\n\t<li>The connection's capacity can test easily.<\/li>\r\n\t<li>The possibility of various pad metallizations on the chip carrier<\/li>\r\n\t<li>Cost-savings in production<\/li>\r\n\t<li>Process temperature is low.<\/li>\r\n\t<li>The possibility of connection repairs<\/li>\r\n\t<li>handling complex circuits in an easy way<\/li>\r\n<\/ol>\r\n\r\n<p>Above list is the main advantage that we can gain from wire bonding. When referring to wire bonding it is clear that this technology is popular in the domain of microelectronics. The reason behind that is, the wire bonding will give the best quality high effective signal-passing ability to the electronics. After coming through many technologies, in the end, wire bonding came up as the solution. Moreover, wire bonding is mainly using elements such as Aluminum, Gold, and Copper. When considering the usage percentage most industries are using gold for wire bonding. The properties of gold are the main reason for its high usage in the industry.<\/p>\r\n\r\n<p>However, other materials, such as aluminum, copper (Cu), or combinations of such materials (gold wire on aluminum metallization or copper wire on silver metallization), utilize depending on the technique and applications. The most popular method of wire bonding is called ball bonding, which combines thermal energy and ultrasonic vibration with conventional bonding stress. The method requires heat between 100 and 250 °C. However, the evolution of the wire bonding process led to the creation of this technology. By accelerating the procedure and using lower temperatures, adding ultrasonic vibration to the standard bonding load has enhanced the quality of joining.<\/p>\r\n\r\n<h3>Using the wire bond in the industry<\/h3>\r\n\r\n<p>most industries tend to use this technology because it gives better communication and mainly space reduction. So when considering robotics applications, sensor developments, and medical equipment development the size of the equipment should be a factor that the developer should consider. Because of that PCB industries are always looking forward to minimizing the size of their chips and other electronic components. When considering medical equipment with cameras such as a laryngoscope use this wire bonding technology to minimize space usage.<\/p>\r\n\r\n<h3>Tips for Wire Bonding<\/h3>\r\n\r\n<h4>Avoid Chip-to-Chip Connection -<\/h4>\r\n\r\n<p>Wire bonding directly between Integrated Circuits should avoid unless performance demands it. Stitching will transfer mechanical energy to the pad surface, which could lead to breaking beneath or within the pad metallization. Because cracks can indicate a potential reliability problem, the substrate should construct with intermediate bonding pads.<\/p>\r\n\r\n<h4>Don't cross the wires<\/h4>\r\n\r\n<p>Bond wires shouldn't cross over between another die, wire, or bond pads. The wire bond unsupported loop may hang and meet or contact a wire directly beneath it if mechanical stress from an external source is applied, resulting in a short circuit that might harm the entire system.<\/p>\r\n\r\n<h4>Bond pads are special<\/h4>\r\n\r\n<p>The bond pad should be set up to create the shortest wire bond feasible. The overall impedance, inductance, and connection capacitance are all specified by the wire bond length. Long wire bonds might not perform well for a package. Flash gold with aluminum or gold wedge bonding is a particular scenario. Even so, it would be wise to review the integrated circuit package's implementation notes because some integrated circuit manufacturers do not use wedge bonding due to the mechanical force needed to cause die during production.<\/p>\r\n\r\n<p>A via should have a space from the edge of a bond pad by at least 0.005 mm. A connection that has been created close to a substrate discontinuity may lead to material injury from bonding and distributing mechanical energy to the substrate. To allow for wire bonding tolerance, registration, and printing when wire bonding multilayer substrates, the used pad should be at least 10 mm away from the conductor edge.<\/p>\r\n","status":1,"create_time":1668653594,"update_time":1680156514,"clicks":23408,"hits":4,"custom_url":"wire-bonding","related":"","add_uid":111,"publish_uid":0,"attr":0,"type":0,"keywords":"wire bonding","comment_count":0,"share_count":0,"need_move":0,"c_time":"2022-11-17 10:53:14","u_time":"2025-06-27 16:33:13","comments_count":0,"is_like":0}">

Wire Bonding - The Ultimate Guide Is Here - NextPCB
Posted on March 30, 2023 by NextPCB
In simple terms, wire bonding in the pcb is the interconnecting of the internal parts of the chips to the outside of the chip.

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Tag: Wire Bonding
Paul Eisner<\/a> officially invented the PCB manufacturing technique. PCB has become an essential basis for the electronics industry with PCB's rapid development. Although PCB generally only accounts for 5~10 % of the <a href=https://www.nextpcb.com/"https:////www.nextpcb.com//blog//pcb-cost-how-much-does-a-printed-circuit-board-pcb-cost/">cost of the finished circuit board, the reliability of PCB is far more important than a single component. Because if the component is broken, the circuit board can be repaired, but if the PCB is broken, the circuit board can only be scrapped!<\/p>\r\n\r\n<h2>PCB Hole Metallization<\/h2>\r\n\r\n<p><img alt=\"PCB Hole Metallization\" src=https://www.nextpcb.com/"//uploads//images//202303//30//1680144960-8984-RuJXOF.jpg/" style=\"width: 800px; height: 507px;\" \/><\/p>\r\n\r\n<p>Speaking of reliability, this has to bring up the problem of PCB hole metallization. The core function of hole metallization is to realize the conduction between PCB layers by plating copper on the hole wall. It is the core key point that the <a href=https://www.nextpcb.com/"https:////www.nextpcb.com//blog//2-layer-print-circuit-boardpcb-manufacturer/">2-layer PCB<\/a> and the <a href=https://www.nextpcb.com/"https:////www.nextpcb.com//blog//multilayer-printed-circuit-board/">multi-layer board<\/a> can play a role. Therefore, many giants in the electronics industry, such as <a href=https://www.nextpcb.com/"https:////apple.com///">Apple and <a href=https://www.nextpcb.com/"https:////www.Samsung.com/">Samsung attach great importance to it.<\/p>\r\n\r\n<p>But in fact, hole metallization technology is not complicated and can be divided into two simple parts: preparation before copper plating, and copper plating. The quality of copper plating depends on the preparation of copper plating to a large extent.<\/p>\r\n\r\n<p>As a result, practitioners in the industry tend to focus on PCB reliability in the preparation of copper plating. At present, there are three main preparation processes for copper electroplating in the industry: PTH, Blackhole, and Shadow.<\/p>\r\n\r\n<h2>PTH<\/h2>\r\n\r\n<p><strong>Plated Through Hole<\/strong> is a hole metallization process in <a href=https://www.nextpcb.com/"https:////www.nextpcb.com//blog//pcb-manufacturing/">circuit board manufacturing<\/a>, also commonly called <strong>PTH<\/strong>, and is an autocatalytic redox reaction. It is mainly based on the displacement reaction in chemistry to deposit a layer of copper on the pore wall as a conductive lead for subsequent copper plating. If it is conventional copper, its thickness is generally about <strong>0.5 μm<\/strong>. As the most traditional copper plating preparation process, it has the following advantages and disadvantages:<\/p>\r\n\r\n<h3>Advantages of PTH:<\/h3>\r\n\r\n<ul style=\"margin-left: 40px;\">\r\n\t<li>Copper has excellent electrical conductivity (wire inside, the conventional use of copper wire as conductive).<\/li>\r\n\t<li>The thickness can be adjusted in a wide range, and wide adaptability (the lowest in the industry is about <strong>0.3 μm<\/strong>, and the highest is up to <strong>30 μm<\/strong> presently, directly replacing the subsequent copper plating process).<\/li>\r\n\t<li>The process is mature and stable, which can be applied to all types of circuit board products (PCB\/<a href=https://www.nextpcb.com/"https:////www.nextpcb.com//blog//flexible-printed-circuit-board/">FPCB//RFPCB//metal substrate\/<a href=https://www.nextpcb.com/"https:////www.nextpcb.com//blog//ceramic-pcbs/">ceramic substrate<\/a>, etc.).<\/li>\r\n<\/ul>\r\n\r\n<h3>Disadvantages of PTH:<\/h3>\r\n\r\n<ul style=\"margin-left: 40px;\">\r\n\t<li>Containing <a href=https://www.nextpcb.com/"https:////www.cancer.org//healthy//cancer-causes//chemicals//formaldehyde.html/">formaldehyde, adverse to the health of workers.<\/li>\r\n\t<li>Large equipment investment, high production costs, and serious environmental pollution.<\/li>\r\n\t<li>The aging control is short, and the effective time is generally 3-6 hours.<\/li>\r\n<\/ul>\r\n\r\n<h2>Blackhole<\/h2>\r\n\r\n<p>Black holes are one of the direct electroplating technologies. Its main principle is to make the carbon powder adsorbed on the surface of the hole wall to form a conductive layer, which can be used as the conductive lead for subsequent copper plating. Usually, its thickness is <strong>0.5~1 μm<\/strong>. As one of the current mainstream copper plating preparation processes, it has the following advantages and disadvantages:<\/p>\r\n\r\n<h3>Advantages of Blackhole:<\/h3>\r\n\r\n<ul style=\"margin-left: 40px;\">\r\n\t<li>No formaldehyde, small impact on the health of workers, and small pollution to the environment.<\/li>\r\n\t<li>The equipment investment is small, the waste treatment is simpler, and the process cost is lower than that of PTH.<\/li>\r\n\t<li>The potion and process are relatively simple, the timeliness can reach 48 hours, and it is easier to maintain and manage.<\/li>\r\n<\/ul>\r\n\r\n<h3>Disadvantages of Blackhole:<\/h3>\r\n\r\n<ul style=\"margin-left: 40px;\">\r\n\t<li>In terms of conductivity, the conductive toner is weaker than the PTH.<\/li>\r\n\t<li>Its applicability is not as wide as that of PTH. Therefore, although it has been used on a large scale, it is mainly used for <a href=https://www.nextpcb.com/"https:////www.nextpcb.com//blog//2-layer-print-circuit-boardpcb-manufacturer/">2-layer PCB<\/a> in the industry at present. High-end products such as <a href=https://www.nextpcb.com/"https:////www.nextpcb.com//blog//nextpcb-hdi-pcbs/">HDI PCB<\/a> are almost not used.<\/li>\r\n<\/ul>\r\n\r\n<h2>Shadow<\/h2>\r\n\r\n<p>Strictly speaking, Shadow is a further development of the Blackhole process. Their principle, advantages, and disadvantages are similar, but Shadow is better than the black hole. The main difference is that the conductive layer of the Blackhole is carbon powder, while the conductive layer of the Shadow is graphite.<\/p>\r\n\r\n<p>In addition, Blackhole is generally not used for high-end products, or with complex processes. but the black shadow can do that. The PTH process has been partially replaced by Shadow, widely used in high-end circuit boards, such as HDI boards, and <a href=https://www.nextpcb.com/"https:////www.nextpcb.com//blog//ic-substrate/">IC substrates<\/a>.<\/p>\r\n\r\n<h2>Conclusion<\/h2>\r\n\r\n<p>As mentioned above, you may think that the PTH process will be better than Blackhole, Shadow process. The industry generally thinks so, but when it comes to the actual application level, it is not. Because every <a href=https://www.nextpcb.com/"https:////www.nextpcb.com//blog//pcb-manufacturing/">PCB process<\/a> will have its advantages and disadvantages, and then establish its status in practical application. If indeed has been comprehensively backward, that will naturally be eliminated by the industry.<\/p>\r\n\r\n<p>So, <strong>it is considered that the effect of PCB Hole Metallization: PTH > Shadow > Blackhole<\/strong>, can be used as a reference answer, but it can not be used as a final standard answer. Because it also involves the actual situation of each process using the factory, as well as the equipment used in the process, potion, parameters, and so on.<\/p>\r\n\r\n<p>Therefore, in reality, the process is just a means to make products. As long as the products produced can meet the requirements of shipping, and the manufacturer can obtain satisfactory profits, then the process can be adopted.<\/p>\r\n\r\n<p>After factory verification, as a <a href=https://www.nextpcb.com/"http:////www.nextpcb.com/">PCB manufacturer<\/a> focusing on the high-end direction, in order to meet customer demand and achieve highly reliable production, NextPCB decided to adopt the most stable and mature process to ensure better delivery quality.<\/p>\r\n","status":1,"create_time":1668505806,"update_time":1680144973,"clicks":7308,"hits":0,"custom_url":"pth-blackhole-shadow-pcb-hole-metallization-process","related":"","add_uid":111,"publish_uid":0,"attr":0,"type":0,"keywords":"PTH, Blackhole, Shadow, PCB Hole Metallization","comment_count":0,"share_count":0,"need_move":0,"c_time":"2022-11-15 17:50:06","u_time":"2025-06-27 16:15:36","comments_count":0,"is_like":0}">

PTH vs. Blackhole vs. Shadow PCB Hole Metallization Process
Posted on March 30, 2023 by Sean H.
This article will introduce the PTH (Plated Through Hole), Blackhole, Shadow PCB hole metallizatin process and compare them in advantage and disadvantage.

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Tag: PTH Blackhole Shadow PCB Hole Metallization
solder material<\/a> transforms into a liquid state. It is a crucial parameter in the <a href=https://www.nextpcb.com/"https:////www.nextpcb.com//blog//reflow-soldering-and-wave-soldering/">soldering process<\/a>, as it determines the temperature required to melt the solder and join the components together.<\/p>\r\n\r\n<p>Solder is a metal alloy comprised mostly of Lead and Tin. Typically, the melting point of copper could range from 900℃ to 4500℃. These differences are due to varied alloy compositions in the solder. However, due to the varied applications of solder in the PCB industry, solder consists of other alloys of metals such as copper, Silver, Antimony, and Zinc. This different combination of metals gives rise to differences in the melting points of solder.<\/p>\r\n\r\n<p>Here is a Table that shows the different alloy compositions of Solder and their melting point ranges that are common in <a href=https://www.nextpcb.com/"https:////www.nextpcb.com//blog//pcb-manufacturing/">PCB manufacturing<\/a>.<\/p>\r\n\r\n<table class=\"blueTable\">\r\n\t<thead>\r\n\t\t<tr>\r\n\t\t\t<th>Solder Alloy Compositions (% Weight)<\/th>\r\n\t\t\t<th>Metal Composition<\/th>\r\n\t\t\t<th>Range of Melting Point (°C)<\/th>\r\n\t\t<\/tr>\r\n\t<\/thead>\r\n\t<tbody>\r\n\t\t<tr>\r\n\t\t\t<td>95.5% Sn\/3.5% Ag\/1% Zn<\/td>\r\n\t\t\t<td>Tin-Silver-zinc<\/td>\r\n\t\t\t<td>218°C – 221°C<\/td>\r\n\t\t<\/tr>\r\n\t\t<tr>\r\n\t\t\t<td>95% Sn\/5% Ag<\/td>\r\n\t\t\t<td>Tin-Silver<\/td>\r\n\t\t\t<td>221°C – 240°C<\/td>\r\n\t\t<\/tr>\r\n\t\t<tr>\r\n\t\t\t<td>96% Sn\/4% Ag<\/td>\r\n\t\t\t<td>Tin-Silver<\/td>\r\n\t\t\t<td>221°C- 225°C<\/td>\r\n\t\t<\/tr>\r\n\t\t<tr>\r\n\t\t\t<td>97.5% Sn\/2.5% Ag<\/td>\r\n\t\t\t<td>Tin-Silver<\/td>\r\n\t\t\t<td>221°C – 226°C<\/td>\r\n\t\t<\/tr>\r\n\t\t<tr>\r\n\t\t\t<td>97% Sn\/2% Cu\/0.8% Sb\/0.2% Ag<\/td>\r\n\t\t\t<td>Tin-Copper-silver<\/td>\r\n\t\t\t<td>226°C – 228°C<\/td>\r\n\t\t<\/tr>\r\n\t\t<tr>\r\n\t\t\t<td>97% Sn \/ 3% Cu<\/td>\r\n\t\t\t<td>Tin-Copper<\/td>\r\n\t\t\t<td>227°C – 300°C<\/td>\r\n\t\t<\/tr>\r\n\t\t<tr>\r\n\t\t\t<td>95% Sn \/5% Sb<\/td>\r\n\t\t\t<td>Tin-Antimony<\/td>\r\n\t\t\t<td>232°C – 240°C<\/td>\r\n\t\t<\/tr>\r\n\t\t<tr>\r\n\t\t\t<td>91.5% Sn \/8.5% Sb<\/td>\r\n\t\t\t<td>Tin-Antimony<\/td>\r\n\t\t\t<td>232°C – 240°C<\/td>\r\n\t\t<\/tr>\r\n\t\t<tr>\r\n\t\t\t<td>95.6% Sn, 3.5% Ag, 0.9% Cu<\/td>\r\n\t\t\t<td>Tin-Silver-copper<\/td>\r\n\t\t\t<td>217°C<\/td>\r\n\t\t<\/tr>\r\n\t\t<tr>\r\n\t\t\t<td>95.5% Sn,3.9%Ag, 0.6% Cu<\/td>\r\n\t\t\t<td>Tin-Silver-copper<\/td>\r\n\t\t\t<td>217°C<\/td>\r\n\t\t<\/tr>\r\n\t\t<tr>\r\n\t\t\t<td>97% In 3% Ag<\/td>\r\n\t\t\t<td>Indium –Silver<\/td>\r\n\t\t\t<td>143 °C<\/td>\r\n\t\t<\/tr>\r\n\t\t<tr>\r\n\t\t\t<td>65% Sn 25% Ag 10% Sb<\/td>\r\n\t\t\t<td>Tin-Silver- Antimony<\/td>\r\n\t\t\t<td>233°C<\/td>\r\n\t\t<\/tr>\r\n\t\t<tr>\r\n\t\t\t<td>95% Zn 5% Al<\/td>\r\n\t\t\t<td>Zinc - Aluminum<\/td>\r\n\t\t\t<td>382°C<\/td>\r\n\t\t<\/tr>\r\n\t\t<tr>\r\n\t\t\t<td>91% Sn 9% Zn<\/td>\r\n\t\t\t<td>Tin – Zinc<\/td>\r\n\t\t\t<td>199°C<\/td>\r\n\t\t<\/tr>\r\n\t\t<tr>\r\n\t\t\t<td>58% Bi 42% Sn<\/td>\r\n\t\t\t<td>Bismuth – Tin<\/td>\r\n\t\t\t<td>138°C<\/td>\r\n\t\t<\/tr>\r\n\t<\/tbody>\r\n<\/table>\r\n\r\n<h2>Types of Solders<\/h2>\r\n\r\n<p>Solders used in Printed Circuit Board Manufacturing are in two categories:<\/p>\r\n\r\n<ul style=\"margin-left: 40px;\">\r\n\t<li>Eutectic Solder<\/li>\r\n\t<li>Non-Eutectic Solder<\/li>\r\n<\/ul>\r\n\r\n<h3>Eutectic Solder<\/h3>\r\n\r\n<p>Eutectic Solder melts and solidifies at a single temperature. It means that the alloy compositions of the Solder melt at a particular temperature and cool down at a specific temperature.<\/p>\r\n\r\n<h3>Non-Eutectic Solder<\/h3>\r\n\r\n<p>Non-Eutectic Solder cannot melt nor solidify at a given temperature. These alloys of metal require melting at temperature ranges. This solder starts to melt when it reaches its minimum melting point. It melts until it reaches its maximum melting point, thereby becoming molten (liquid form).<\/p>\r\n\r\n<p>The following types of Solder include<\/p>\r\n\r\n<ul style=\"margin-left: 40px;\">\r\n\t<li>Lead-based Solder<\/li>\r\n\t<li>Lead-free Solder<\/li>\r\n\t<li>Flux core Solder<\/li>\r\n\t<li>Silver Alloy Solder<\/li>\r\n<\/ul>\r\n\r\n<p>Let's consider them one at a time<\/p>\r\n\r\n<h4>Lead-based Solder<\/h4>\r\n\r\n<p>In this type of solder, <a href=https://www.nextpcb.com/"https:////en.wikipedia.org//wiki//Lead/">lead is significant in its alloy composition. As such, Lead is usually mixed with other metals to form alloys to reach higher melting points. The composition also improves other physical properties of the solder, like Tensile and Sheer Strength.<\/p>\r\n\r\n<p>The standard type of <a href=https://www.nextpcb.com/"https:////www.nextpcb.com//blog//lead-vs-lead-free-solder/">lead-based solder<\/a> is a mixture of Lead and Tin. Their alloy composition is about <strong>60% Tin<\/strong> and <strong>40% lead<\/strong>. This Tin-Lead Solder melts at around <strong>180°C to 190°C<\/strong>, with Tin being the cause of its lower temperature. However, Tin makes up for it with better tensile strength.<\/p>\r\n\r\n<h4>Lead-free Solder<\/h4>\r\n\r\n<p>Lead harms the environment and human health. While lead-based alloys started the solder revolution in PCB electronics, environmental regulations restricted the inclusion of lead in electronics design. As a result, several compositions of Alloy became lead-free.<\/p>\r\n\r\n<p>In the United States, <a href=https://www.nextpcb.com/"https:////www.nextpcb.com//blog//usa-pcb-manufacturer-in-the-2022/">PCB manufacturers<\/a> that utilize <a href=https://www.nextpcb.com/"https:////www.nextpcb.com//blog//lead-vs-lead-free-solder/">lead-free solder<\/a> get considerable tax benefits. As a result, there are incentives from the government to own and apply lead-free solder in the PCB Industry.<\/p>\r\n\r\n<p>Generally, Lead-free solders have higher melting points than lead-based solders.<\/p>\r\n\r\n<h4>Flux Core Solder<\/h4>\r\n\r\n<p><a href=https://www.nextpcb.com/"https:////www.nextpcb.com//blog//solder-flux/">Flux core solder<\/a> is a spool of wires around a cylindrical device. At its core, there is a reducing agent. During the soldering process, the flux is released, which removes the oxidized layer formed on the metal surface upon contact.<\/p>\r\n\r\n<p>This process allows a cleaner surface and electrical connection. It also improves the wetting properties of the solder. Under the flux core solder, there exist two different types of Solder: Acid core and Rosin core solders.<\/p>\r\n\r\n<h4>Acid Core Solder<\/h4>\r\n\r\n<p>The core of this Solder is an <a href=https://www.nextpcb.com/"https:////www.nextpcb.com//blog//solder-flux/">acid-based flux<\/a> which is aggressive and strong in removing the layer of metallic oxide formed on the metal surface. Its joints are solid and do not break.<\/p>\r\n\r\n<p>Acid core solders are helpful for welding steels and other metals. Also, they are applicable in plumbing to join copper pipes together. However, <a href=https://www.nextpcb.com/"https:////www.nextpcb.com//blog//how-to-remove-solder-from-a-pcb-correctly/">cleaning the flux residue<\/a> after soldering is crucial to prevent corrosion.<\/p>\r\n\r\n<h4>Rosin Core Solder<\/h4>\r\n\r\n<p>While the<a href=https://www.nextpcb.com/"http:////www.nextpcb.com//blog//solder-flux/"> Rosin core solder<\/a> is similar to the Acid core solder, its difference is that it uses mild flux rosin as its core. Rosin residue does not cause corrosion which earns it an excellent advantage over Acid core solder. It is commonly applied in soldering electronic components on Printed Circuit Boards.<\/p>\r\n\r\n<h2>Factors to Consider When Choosing the Best Solder<\/h2>\r\n\r\n<p>While your choice of Solder may vary according to the process you want to utilize soldering, here are some prevalent factors to consider when selecting the best Solder.<\/p>\r\n\r\n<h3>Subsequent Thermal Process<\/h3>\r\n\r\n<p>In <a href=https://www.nextpcb.com/"https:////www.nextpcb.com//blog//pcb-assembly-process/">PCB assembly<\/a>, your PCB may require a <a href=https://www.nextpcb.com/"https:////www.nextpcb.com//blog//reflow-soldering-and-wave-soldering/">reflow process<\/a> after applying a paste mask on the circuit board. This process requires heating the PCB to a higher temperature. Hence, there is a need to use a solder with a higher melting point. However, if there is no need for subsequent heating of your PCB, you can choose solders with lower melting points.<\/p>\r\n\r\n<h3>Use of Lead or No-lead Solder<\/h3>\r\n\r\n<p>While lead-based solders set the trend in the electronic industry, heavy EU regulations on using Lead are rising. They could bring several lawsuits if you use lead-based solder. When considering the kind of solder you want to use for your printed circuit board, ensure you use lead-free solders or other alloy solders that are free of lead.<\/p>\r\n\r\n<h3>Application of Solder Flux<\/h3>\r\n\r\n<p>Flux helps clean the surface area that needs soldering, making it easier to sell on a clean surface and ensuring proper solder joints between components. Rosin core flux is enough If your manufacturing process does not exceed printing circuit boards. However, suppose your design prices range depending on the customer. In that case, it is necessary to have several kinds of solder flux in your manufacturing space.<\/p>\r\n\r\n<h2>Conclusion<\/h2>\r\n\r\n<p>As this guide has shown, solder is an essential process in design and manufacturing, especially in the PCB industry. Based on their alloy composition, these solders have varied melting points. Some have their melting point set at a given temperature (Eutectic), others at temperature ranges (non-Eutectic).<\/p>\r\n\r\n<p>It would help if you considered the needs of your manufacturing process. It will help when you discern what kind of Ssolder you need (Lead-based or lead-free), the required melting point, and the type of flux applicable to your process.<\/p>\r\n\r\n<p>At NextPCB, we offer reliable PCB services and solutions to provide you with the best PCB designs for your electronics. In maintaining global PCB standards and compliance with EU regulations, we strive to use safe materials for the environment and your health.<\/p>\r\n","status":1,"create_time":1668494242,"update_time":1680078122,"clicks":4190,"hits":0,"custom_url":"melting-point-of-solder","related":"","add_uid":111,"publish_uid":0,"attr":0,"type":0,"keywords":"melting point of solder","comment_count":0,"share_count":0,"need_move":0,"c_time":"2022-11-15 14:37:22","u_time":"2025-06-27 15:18:51","comments_count":0,"is_like":0}">

What Is The Melting Point Of Solder?
Posted on March 29, 2023 by NextPCB
The melting point of solder refers to the temperature at which a solid solder material transforms into a liquid state. It is a crucial parameter in the soldering component process.

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Tag: Solder
PCB manufacturer<\/a> with good quality handles and optimizes the <a href=https://www.nextpcb.com/"https:////www.nextpcb.com//blog//7-types-of-bga-ball-grid-array-packages/">BGA pad, the via hole will be treated with special treatment. And the exposure is also part exposure to ensure accurate alignment so that the BGA is full and round.<\/p>\r\n\r\n<p><img alt=\"BGA pad\" src=https://www.nextpcb.com/"//uploads//images//202211//14//1668411547-7227-BezrYc.jpg/" style=\"width: 800px; height: 576px;\" \/><br \/>\r\n <\/p>\r\n\r\n<h2><strong>#4 Check the Ink on the Board<\/strong><\/h2>\r\n\r\n<p><strong>Fourth, check the ink on the board<\/strong>. A good circuit board factory will choose reliable ink brands, and pay great attention to the printing and baking process. The ink is a permanent protective film of PCB, which can protect the line from being easily wiped and damaged. There is no short circuit when insulating, and it is heat resistant, and moisture-proof, preventing solder from adhering to the line and salt spray prevention.<\/p>\r\n\r\n<p>For a reliable circuit board, the ink will be relatively thick. According to the IPC standard, ink thickness needs to be<strong> <\/strong>not less than <strong>20μm<\/strong>. If the solder ink is too thin it will lead to the copper exposure line; The factory with the low process will also have problems such as IC bridge shedding, ink foaming, oil shedding, and plug holes not being full and transparent.<\/p>\r\n\r\n<p><img alt=\"circuit board with reliable ink\" src=https://www.nextpcb.com/"//uploads//images//202211//14//1668411597-076-mQxKEs.jpg/" style=\"width: 800px; height: 547px;\" \/><\/p>\r\n\r\n<p>At present, the most famous ink manufacturers in the world are <a href=https://www.nextpcb.com/"https:////www.taiyoink.com.tw//en-top///">TAIYO, <a href=https://www.nextpcb.com/"http:////www.otcink.com.tw//p.asp?l=3&w=t&id=3&m=3\%22>Onstatic<\/a>, <a href=https://www.nextpcb.com/"http:////en.szrd.com///">Rongda, <a href=https://www.nextpcb.com/"http:////www.kuangshun.com//#\/index\">KuangShun<\/a>, etc. TAIYO PCB ink is the best ink from the visibility and quality of ink, its largest advantages: not easy to drop oil, and can be without discoloration by reflow after 3 times. NextPCB is using the TAIYO ink to maintain consistent high-quality <a href=https://www.nextpcb.com/"https:////www.nextpcb.com//blog//pcb-manufacturing/">PCB manufacturing<\/a>.<\/p>\r\n","status":1,"create_time":1668411701,"update_time":1680072728,"clicks":1953,"hits":0,"custom_url":"how-to-judge-the-quality-of-PCB-at-a-glance","related":"","add_uid":111,"publish_uid":0,"attr":0,"type":0,"keywords":"PCB quality","comment_count":0,"share_count":0,"need_move":0,"c_time":"2022-11-14 15:41:41","u_time":"2025-06-27 15:16:13","comments_count":0,"is_like":0}">

How to Judge the Quality of PCB at a Glance?
Posted on March 29, 2023 by Sean H.
We can judge the PCB quality by 4 aspects: 1.PCB silkscreen 2.PCB pad treatment 3.BGA pad 4.PCB Ink.

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Tag: PCB
multilayer boards<\/a> (Build-up Multilayer, BUM). Compared to conventional boards, HDI boards have the advantages of being "light, thin, short, and small".<\/p>\r\n\r\n<p>HDI's electrical interconnection between the layers of the board is achieved through the conductive <a href=https://www.nextpcb.com/"https:////www.nextpcb.com//blog//through-hole-technology/">through-hole, buried via, and blind via the connection. Different from the ordinary multilayer PCB, HDI boards are designed with a large number of micro-buried blind vias.<br \/>\r\n <br \/>\r\nOrdinary PCB usually is drilled by mechanical method, while HDI PCB drilled by laser. So the number of layers and aspect ratio of HDI PCB is often increased.<\/p>\r\n\r\n<h2>2. High HDI Wiring Density<\/h2>\r\n\r\n<p>HDI board's high density is mainly reflected in the hole, line, pad density, and interlayer thickness.<\/p>\r\n\r\n<p>Micro-Through Via. HDI circuit board contains blind holes and other micro-conductor hole designs. There are main performances in the two aspects. At first, micro-hole and hole-forming technology in diameter of less than <strong>150μm<\/strong>. Second, cost, production efficiency, hole precision control, and other aspects of the high demand. In traditional multilayer circuit boards, there are only through holes without tiny buried blind holes.<\/p>\r\n\r\n<p>Refinement of line width and line spacing. Its main performance in the wire defects and wire surface roughness requirements are increasingly strict. General line width and line spacing of no more than <strong>76.2μm<\/strong>.<\/p>\r\n\r\n<p>The high density of pads. The density of welded joints is greater than 50 per square centimeter.<\/p>\r\n\r\n<p>The thinning of the dielectric material thickness. It is mainly manifested in the trend of the thickness of the interlayer medium to <strong>80μm<\/strong> or below, and the requirement of thickness uniformity is more and more strict, especially for the high-density plate and packaging substrate with characteristic <a href=https://www.nextpcb.com/"https:////www.nextpcb.com//blog//impedance-control-in-pcbs/">impedance control<\/a>.<\/p>\r\n\r\n<p><img alt=\"hdi pcb\" src=https://www.nextpcb.com/"https:////www.nextpcb.com//uploads//images//202404//11//1712805099-794-XbjiMc.png/" style=\"width: 600px; height: 360px;\" \/><\/p>\r\n\r\n<h2>3. HDI PCB with Better Electrical Properties<\/h2>\r\n\r\n<p>HDI PCB can not only make the end product design more miniaturized but also meet higher standards of electronic performance and efficiency at the same time.<\/p>\r\n\r\n<p>The increased interconnect density of HID PCB allows for enhanced signal strength and improved PCB reliability. In addition, HDI boards have better improvements for RFI, EMI, static discharge, thermal conduction, etc. HDI also uses all-digital signal process control (DSP) technology and a number of patented technologies, with a full range of adaptable load capacity and strong short-time overload capability.<\/p>\r\n\r\n<h2>4. HDI PCB has Strict Requirements for Buried and Plug Hole<\/h2>\r\n\r\n<p>As can be seen from the above, both the volume and electrical performance of the circuit board, HDI are better than ordinary PCB. Where there are two sides to the coin, as high-end PCB manufacturing, HDI PCB manufacturing threshold, and process difficulties are much higher than ordinary<span style=\"font-size:11pt\"><span style=\"background:white\"><span style=\"line-height:115%\"><span style=\"font-family:Arial,sans-serif\"><b><span lang=\"EN-US\" style=\"font-size:12.0pt\"><span style=\"line-height:115%\"><span style=\"color:#1f1f1f\">Stack-up of HDI PCB:<\/span><\/span><\/span><\/b><\/span><\/span><\/span><\/span><\/p>\r\n\r\n<p>PCBs. So more problems need to pay attention - especially buried holes plug holes.<\/p>\r\n\r\n<p>The core pain point and difficulty of HDI manufacturing is the buried plugging hole. If the HDI buried hole plugging is not done, there will be major quality problems, including uneven board edges, uneven thickness of the dielectric, pads with pits, and other states.<\/p>\r\n\r\n<ul>\r\n\t<li>The circuit board surface is not flat, the line is not straight in the depression to cause the beach phenomenon, which will cause line gaps, broken lines, and other defects.<\/li>\r\n\t<li>The characteristic impedance will also fluctuate due to the uneven thickness of the dielectric causing signal instability.<\/li>\r\n\t<li>The unevenness of the pad makes the subsequent packaging quality bad and causes the collateral loss of components.<\/li>\r\n<\/ul>\r\n\r\n<h2 style=\"margin-top: 4px; margin-bottom: 4px;\"><span style=\"font-size:20px;\"><span style=\"font-family:Arial,Helvetica,sans-serif;\"><span style=\"background:white\"><span style=\"line-height:115%\"><b><span lang=\"EN-US\"><span style=\"line-height:115%\"><span style=\"color:#1f1f1f\">Comparing HDI PCBs and Traditional PCBsComparing HDI PCBs and Traditional PCBs<\/span><\/span><\/span><\/b><\/span><\/span><\/span><\/span><\/h2>\r\n\r\n<table class=\"Table\" style=\"border-collapse:collapse; border:none\" width=\"563\">\r\n\t<thead>\r\n\t\t<tr>\r\n\t\t\t<td style=\"border-bottom:1px solid #cccccc; width:146px; padding:3px 3px 3px 3px; height:21px; background-color:#d9d9d9; border-top:1px solid #cccccc; border-right:1px solid #cccccc; border-left:1px solid #cccccc\" valign=\"bottom\">\r\n\t\t\t<p><span style=\"font-size:11pt\"><span style=\"line-height:115%\"><span style=\"font-family:Arial,sans-serif\"><span lang=\"EN-US\" style=\"font-size:10.0pt\"><span style=\"line-height:115%\">Feature<\/span><\/span><\/span><\/span><\/span><\/p>\r\n\t\t\t<\/td>\r\n\t\t\t<td style=\"border-bottom:1px solid #cccccc; width:202px; padding:3px 3px 3px 3px; height:21px; background-color:#d9d9d9; border-top:1px solid #cccccc; border-right:1px solid #cccccc; border-left:none\" valign=\"bottom\">\r\n\t\t\t<p><span style=\"font-size:11pt\"><span style=\"line-height:115%\"><span style=\"font-family:Arial,sans-serif\"><span lang=\"EN-US\" style=\"font-size:10.0pt\"><span style=\"line-height:115%\">HDI PCB<\/span><\/span><\/span><\/span><\/span><\/p>\r\n\t\t\t<\/td>\r\n\t\t\t<td style=\"border-bottom:1px solid #cccccc; width:215px; padding:3px 3px 3px 3px; height:21px; background-color:#d9d9d9; border-top:1px solid #cccccc; border-right:1px solid #cccccc; border-left:none\" valign=\"bottom\">\r\n\t\t\t<p><span style=\"font-size:11pt\"><span style=\"line-height:115%\"><span style=\"font-family:Arial,sans-serif\"><span lang=\"EN-US\" style=\"font-size:10.0pt\"><span style=\"line-height:115%\">Traditional PCB<\/span><\/span><\/span><\/span><\/span><\/p>\r\n\t\t\t<\/td>\r\n\t\t<\/tr>\r\n\t<\/thead>\r\n\t<tbody>\r\n\t\t<tr>\r\n\t\t\t<td style=\"border-bottom:1px solid #cccccc; width:146px; padding:3px 3px 3px 3px; height:35px; border-top:none; border-right:1px solid #cccccc; border-left:1px solid #cccccc\" valign=\"bottom\">\r\n\t\t\t<p><span style=\"font-size:11pt\"><span style=\"line-height:115%\"><span style=\"font-family:Arial,sans-serif\"><span lang=\"EN-US\" style=\"font-size:10.0pt\"><span style=\"line-height:115%\">Layer Count<\/span><\/span><\/span><\/span><\/span><\/p>\r\n\t\t\t<\/td>\r\n\t\t\t<td style=\"border-bottom:1px solid #cccccc; width:202px; padding:3px 3px 3px 3px; height:35px; border-top:none; border-right:1px solid #cccccc; border-left:none\" valign=\"bottom\">\r\n\t\t\t<p><span style=\"font-size:11pt\"><span style=\"line-height:115%\"><span style=\"font-family:Arial,sans-serif\"><span lang=\"EN-US\" style=\"font-size:10.0pt\"><span style=\"line-height:115%\">Typically 6-12 or more<\/span><\/span><\/span><\/span><\/span><\/p>\r\n\t\t\t<\/td>\r\n\t\t\t<td style=\"border-bottom:1px solid #cccccc; width:215px; padding:3px 0cm 3px 0cm; height:35px; border-top:none; border-right:1px solid black; border-left:none\" valign=\"bottom\">\r\n\t\t\t<p><span style=\"font-size:11pt\"><span style=\"line-height:115%\"><span style=\"font-family:Arial,sans-serif\"><span lang=\"EN-US\" style=\"font-size:10.0pt\"><span style=\"line-height:115%\">Usually 2-4 layers<\/span><\/span><\/span><\/span><\/span><\/p>\r\n\t\t\t<\/td>\r\n\t\t<\/tr>\r\n\t\t<tr>\r\n\t\t\t<td style=\"border-bottom:1px solid #cccccc; width:146px; padding:3px 3px 3px 3px; height:44px; background-color:#d9d9d9; border-top:none; border-right:1px solid #cccccc; border-left:1px solid #cccccc\" valign=\"bottom\">\r\n\t\t\t<p><span style=\"font-size:11pt\"><span style=\"line-height:115%\"><span style=\"font-family:Arial,sans-serif\"><span lang=\"EN-US\" style=\"font-size:10.0pt\"><span style=\"line-height:115%\">Via Types<\/span><\/span><\/span><\/span><\/span><\/p>\r\n\t\t\t<\/td>\r\n\t\t\t<td style=\"border-bottom:1px solid #cccccc; width:202px; padding:3px 3px 3px 3px; height:44px; background-color:#d9d9d9; border-top:none; border-right:1px solid #cccccc; border-left:none\" valign=\"bottom\">\r\n\t\t\t<p><span style=\"font-size:11pt\"><span style=\"line-height:115%\"><span style=\"font-family:Arial,sans-serif\"><span lang=\"EN-US\" style=\"font-size:10.0pt\"><span style=\"line-height:115%\">Through-hole, Blind vias, Buried vias<\/span><\/span><\/span><\/span><\/span><\/p>\r\n\t\t\t<\/td>\r\n\t\t\t<td style=\"border-bottom:1px solid #cccccc; width:215px; padding:3px 0cm 3px 0cm; height:44px; background-color:#d9d9d9; border-top:none; border-right:1px solid black; border-left:none\" valign=\"bottom\">\r\n\t\t\t<p><span style=\"font-size:11pt\"><span style=\"line-height:115%\"><span style=\"font-family:Arial,sans-serif\"><span lang=\"EN-US\" style=\"font-size:10.0pt\"><span style=\"line-height:115%\">Primarily Through-hole vias<\/span><\/span><\/span><\/span><\/span><\/p>\r\n\t\t\t<\/td>\r\n\t\t<\/tr>\r\n\t\t<tr>\r\n\t\t\t<td style=\"border-bottom:1px solid #cccccc; width:146px; padding:3px 3px 3px 3px; height:35px; border-top:none; border-right:1px solid #cccccc; border-left:1px solid #cccccc\" valign=\"bottom\">\r\n\t\t\t<p><span style=\"font-size:11pt\"><span style=\"line-height:115%\"><span style=\"font-family:Arial,sans-serif\"><span lang=\"EN-US\" style=\"font-size:10.0pt\"><span style=\"line-height:115%\">Line Width & Via Size<\/span><\/span><\/span><\/span><\/span><\/p>\r\n\t\t\t<\/td>\r\n\t\t\t<td style=\"border-bottom:1px solid #cccccc; width:202px; padding:3px 3px 3px 3px; height:35px; border-top:none; border-right:1px solid #cccccc; border-left:none\" valign=\"bottom\">\r\n\t\t\t<p><span style=\"font-size:11pt\"><span style=\"line-height:115%\"><span style=\"font-family:Arial,sans-serif\"><span lang=\"EN-US\" style=\"font-size:10.0pt\"><span style=\"line-height:115%\">Finer lines and smaller vias<\/span><\/span><\/span><\/span><\/span><\/p>\r\n\t\t\t<\/td>\r\n\t\t\t<td style=\"border-bottom:1px solid #cccccc; width:215px; padding:3px 0cm 3px 0cm; height:35px; border-top:none; border-right:1px solid black; border-left:none\" valign=\"bottom\">\r\n\t\t\t<p><span style=\"font-size:11pt\"><span style=\"line-height:115%\"><span style=\"font-family:Arial,sans-serif\"><span lang=\"EN-US\" style=\"font-size:10.0pt\"><span style=\"line-height:115%\">Larger lines and vias<\/span><\/span><\/span><\/span><\/span><\/p>\r\n\t\t\t<\/td>\r\n\t\t<\/tr>\r\n\t\t<tr>\r\n\t\t\t<td style=\"border-bottom:1px solid #cccccc; width:146px; padding:3px 3px 3px 3px; height:50px; background-color:#d9d9d9; border-top:none; border-right:1px solid #cccccc; border-left:1px solid #cccccc\" valign=\"bottom\">\r\n\t\t\t<p><span style=\"font-size:11pt\"><span style=\"line-height:115%\"><span style=\"font-family:Arial,sans-serif\"><span lang=\"EN-US\" style=\"font-size:10.0pt\"><span style=\"line-height:115%\">Functionality<\/span><\/span><\/span><\/span><\/span><\/p>\r\n\t\t\t<\/td>\r\n\t\t\t<td style=\"border-bottom:1px solid #cccccc; width:202px; padding:3px 3px 3px 3px; height:50px; background-color:#d9d9d9; border-top:none; border-right:1px solid #cccccc; border-left:none\" valign=\"bottom\">\r\n\t\t\t<p><span style=\"font-size:11pt\"><span style=\"line-height:115%\"><span style=\"font-family:Arial,sans-serif\"><span lang=\"EN-US\" style=\"font-size:10.0pt\"><span style=\"line-height:115%\">Miniaturization, High performance, Design flexibility<\/span><\/span><\/span><\/span><\/span><\/p>\r\n\t\t\t<\/td>\r\n\t\t\t<td style=\"border-bottom:1px solid #cccccc; width:215px; padding:3px 0cm 3px 0cm; height:50px; background-color:#d9d9d9; border-top:none; border-right:1px solid black; border-left:none\" valign=\"bottom\">\r\n\t\t\t<p><span style=\"font-size:11pt\"><span style=\"line-height:115%\"><span style=\"font-family:Arial,sans-serif\"><span lang=\"EN-US\" style=\"font-size:10.0pt\"><span style=\"line-height:115%\">Standard functionality<\/span><\/span><\/span><\/span><\/span><\/p>\r\n\t\t\t<\/td>\r\n\t\t<\/tr>\r\n\t\t<tr>\r\n\t\t\t<td style=\"border-bottom:1px solid #cccccc; width:146px; padding:3px 3px 3px 3px; height:35px; border-top:none; border-right:1px solid #cccccc; border-left:1px solid #cccccc\" valign=\"bottom\">\r\n\t\t\t<p><span style=\"font-size:11pt\"><span style=\"line-height:115%\"><span style=\"font-family:Arial,sans-serif\"><span lang=\"EN-US\" style=\"font-size:10.0pt\"><span style=\"line-height:115%\">Manufacturing Complexity<\/span><\/span><\/span><\/span><\/span><\/p>\r\n\t\t\t<\/td>\r\n\t\t\t<td style=\"border-bottom:1px solid #cccccc; width:202px; padding:3px 3px 3px 3px; height:35px; border-top:none; border-right:1px solid #cccccc; border-left:none\" valign=\"bottom\">\r\n\t\t\t<p><span style=\"font-size:11pt\"><span style=\"line-height:115%\"><span style=\"font-family:Arial,sans-serif\"><span lang=\"EN-US\" style=\"font-size:10.0pt\"><span style=\"line-height:115%\">More complex and precise<\/span><\/span><\/span><\/span><\/span><\/p>\r\n\t\t\t<\/td>\r\n\t\t\t<td style=\"border-bottom:1px solid #cccccc; width:215px; padding:3px 3px 3px 3px; height:35px; border-top:none; border-right:1px solid #cccccc; border-left:none\" valign=\"bottom\">\r\n\t\t\t<p><span style=\"font-size:11pt\"><span style=\"line-height:115%\"><span style=\"font-family:Arial,sans-serif\"><span lang=\"EN-US\" style=\"font-size:10.0pt\"><span style=\"line-height:115%\">Less complex<\/span><\/span><\/span><\/span><\/span><\/p>\r\n\t\t\t<\/td>\r\n\t\t<\/tr>\r\n\t\t<tr>\r\n\t\t\t<td style=\"border-bottom:1px solid #cccccc; width:146px; padding:3px 3px 3px 3px; height:50px; background-color:#d9d9d9; border-top:none; border-right:1px solid #cccccc; border-left:1px solid #cccccc\" valign=\"bottom\">\r\n\t\t\t<p><span style=\"font-size:11pt\"><span style=\"line-height:115%\"><span style=\"font-family:Arial,sans-serif\"><span lang=\"EN-US\" style=\"font-size:10.0pt\"><span style=\"line-height:115%\">Cost<\/span><\/span><\/span><\/span><\/span><\/p>\r\n\t\t\t<\/td>\r\n\t\t\t<td style=\"border-bottom:1px solid #cccccc; width:202px; padding:3px 3px 3px 3px; height:50px; background-color:#d9d9d9; border-top:none; border-right:1px solid #cccccc; border-left:none\" valign=\"bottom\">\r\n\t\t\t<p><span style=\"font-size:11pt\"><span style=\"line-height:115%\"><span style=\"font-family:Arial,sans-serif\"><span lang=\"EN-US\" style=\"font-size:10.0pt\"><span style=\"line-height:115%\">Potentially higher initial cost<\/span><\/span><\/span><\/span><\/span><\/p>\r\n\t\t\t<\/td>\r\n\t\t\t<td style=\"border-bottom:1px solid #cccccc; width:215px; padding:3px 0cm 3px 0cm; height:50px; background-color:#d9d9d9; border-top:none; border-right:1px solid black; border-left:none\" valign=\"bottom\">\r\n\t\t\t<p><span style=\"font-size:11pt\"><span style=\"line-height:115%\"><span style=\"font-family:Arial,sans-serif\"><span lang=\"EN-US\" style=\"font-size:10.0pt\"><span style=\"line-height:115%\">Lower initial cost<\/span><\/span><\/span><\/span><\/span><\/p>\r\n\t\t\t<\/td>\r\n\t\t<\/tr>\r\n\t<\/tbody>\r\n<\/table>\r\n\r\n<h2 style=\"margin-top: 16px; margin-bottom: 16px;\"><span style=\"font-family:Arial,Helvetica,sans-serif;\"><span style=\"font-size:20px;\"><span style=\"background:white\"><span style=\"line-height:115%\"><b><span lang=\"EN-US\"><span style=\"line-height:115%\"><span style=\"color:#1f1f1f\">Stack-up of HDI PCB:<\/span><\/span><\/span><\/b><\/span><\/span><\/span><\/span><\/h2>\r\n\r\n<p style=\"margin-top:16px; margin-bottom:16px\"><img alt=\"hdi pcb stack-up\" src=https://www.nextpcb.com/"https:////www.nextpcb.com//uploads//images//202404//11//1712804334-6964-gyvTPe.png/" style=\"width: 602px; height: 301px;\" \/><\/p>\r\n\r\n<p style=\"margin-top:16px; margin-bottom:16px\"><span style=\"font-size:11pt\"><span style=\"background:white\"><span style=\"line-height:115%\"><span style=\"font-family:Arial,sans-serif\"><span lang=\"EN-US\" style=\"font-size:12.0pt\"><span style=\"line-height:115%\"><span style=\"color:#1f1f1f\">The stack-up of an HDI PCB is a critical blueprint that defines the arrangement and composition of its various layers. Here's a breakdown of the key components and how they differ from traditional PCBs:<\/span><\/span><\/span><\/span><\/span><\/span><\/span><\/p>\r\n\r\n<ul>\r\n\t<li style=\"margin-top:4px; margin-left:8px\"><span style=\"font-size:11pt\"><span style=\"background:white\"><span style=\"line-height:115%\"><span style=\"font-family:Arial,sans-serif\"><b><span lang=\"EN-US\" style=\"font-size:12.0pt\"><span style=\"line-height:115%\"><span style=\"color:#1f1f1f\">Core:<\/span><\/span><\/span><\/b><span lang=\"EN-US\" style=\"font-size:12.0pt\"><span style=\"line-height:115%\"><span style=\"color:#1f1f1f\"> Similar to traditional PCBs, HDI PCBs often utilize a rigid dielectric core material like FR-4. However, in some high-performance applications, advanced materials with improved thermal properties or higher electrical performance might be used.<\/span><\/span><\/span><\/span><\/span><\/span><\/span><\/li>\r\n\t<li style=\"margin-left:8px\"><span style=\"font-size:11pt\"><span style=\"background:white\"><span style=\"line-height:115%\"><span style=\"font-family:Arial,sans-serif\"><b><span lang=\"EN-US\" style=\"font-size:12.0pt\"><span style=\"line-height:115%\"><span style=\"color:#1f1f1f\">Signal Layers:<\/span><\/span><\/span><\/b><span lang=\"EN-US\" style=\"font-size:12.0pt\"><span style=\"line-height:115%\"><span style=\"color:#1f1f1f\">  This is where HDI PCBs truly stand out. Compared to traditional PCBs with typically 2-4 layers, HDI PCBs boast a significantly higher layer count, often ranging from 6 to 12 or even higher. This allows for a denser routing of electrical signals within the limited space.<\/span><\/span><\/span><\/span><\/span><\/span><\/span><\/li>\r\n\t<li style=\"margin-left:8px\"><span style=\"font-size:11pt\"><span style=\"background:white\"><span style=\"line-height:115%\"><span style=\"font-family:Arial,sans-serif\"><b><span lang=\"EN-US\" style=\"font-size:12.0pt\"><span style=\"line-height:115%\"><span style=\"color:#1f1f1f\">Dielectric Layers:<\/span><\/span><\/span><\/b><span lang=\"EN-US\" style=\"font-size:12.0pt\"><span style=\"line-height:115%\"><span style=\"color:#1f1f1f\"> These ultra-thin insulating layers separate the signal layers and prevent electrical shorts. In HDI PCBs, the dielectric layers need to be even thinner to accommodate the higher layer count while maintaining a compact overall thickness. This presents a significant manufacturing challenge.<\/span><\/span><\/span><\/span><\/span><\/span><\/span><\/li>\r\n\t<li style=\"margin-left:8px\"><span style=\"font-size:11pt\"><span style=\"background:white\"><span style=\"line-height:115%\"><span style=\"font-family:Arial,sans-serif\"><b><span lang=\"EN-US\" style=\"font-size:12.0pt\"><span style=\"line-height:115%\"><span style=\"color:#1f1f1f\">Via Layers:<\/span><\/span><\/span><\/b><span lang=\"EN-US\" style=\"font-size:12.0pt\"><span style=\"line-height:115%\"><span style=\"color:#1f1f1f\"> Vias are the tiny holes that connect different signal layers, enabling electrical communication throughout the PCB. Here's where HDI PCBs truly differentiate themselves:<\/span><\/span><\/span><\/span><\/span><\/span><\/span>\r\n\t<ul>\r\n\t\t<li style=\"margin-left:8px\"><span style=\"font-size:11pt\"><span style=\"line-height:115%\"><span style=\"font-family:Arial,sans-serif\"><b><span lang=\"EN-US\" style=\"font-size:12.0pt\"><span style=\"line-height:115%\"><span style=\"color:#1f1f1f\">Via Types:<\/span><\/span><\/span><\/b><span lang=\"EN-US\" style=\"font-size:12.0pt\"><span style=\"line-height:115%\"><span style=\"color:#1f1f1f\"> Traditional PCBs typically use through-hole vias, which are drilled all the way through the board. HDI PCBs, on the other hand, utilize various via types to optimize space and performance:<\/span><\/span><\/span><\/span><\/span><\/span>\r\n\t\t<ul>\r\n\t\t\t<li style=\"margin-left:8px\"><span style=\"font-size:11pt\"><span style=\"line-height:115%\"><span style=\"font-family:Arial,sans-serif\"><b><span lang=\"EN-US\" style=\"font-size:12.0pt\"><span style=\"line-height:115%\"><span style=\"color:#1f1f1f\">Blind Vias:<\/span><\/span><\/span><\/b><span lang=\"EN-US\" style=\"font-size:12.0pt\"><span style=\"line-height:115%\"><span style=\"color:#1f1f1f\"> These vias connect internal layers without extending to the surface layers. This allows for cleaner surface routing and higher component density.<\/span><\/span><\/span><\/span><\/span><\/span><\/li>\r\n\t\t\t<li style=\"margin-left:8px\"><span style=\"font-size:11pt\"><span style=\"line-height:115%\"><span style=\"font-family:Arial,sans-serif\"><b><span lang=\"EN-US\" style=\"font-size:12.0pt\"><span style=\"line-height:115%\"><span style=\"color:#1f1f1f\">Buried Vias:<\/span><\/span><\/span><\/b><span lang=\"EN-US\" style=\"font-size:12.0pt\"><span style=\"line-height:115%\"><span style=\"color:#1f1f1f\"> These vias are completely encased within the core material, further maximizing surface area for routing.<\/span><\/span><\/span><\/span><\/span><\/span><\/li>\r\n\t\t<\/ul>\r\n\t\t<\/li>\r\n\t\t<li style=\"margin-left:8px\"><span style=\"font-size:11pt\"><span style=\"line-height:115%\"><span style=\"font-family:Arial,sans-serif\"><b><span lang=\"EN-US\" style=\"font-size:12.0pt\"><span style=\"line-height:115%\"><span style=\"color:#1f1f1f\">Via Size:<\/span><\/span><\/span><\/b><span lang=\"EN-US\" style=\"font-size:12.0pt\"><span style=\"line-height:115%\"><span style=\"color:#1f1f1f\"> Due to the increased layer count and need for dense routing, HDI PCBs employ significantly smaller vias compared to traditional PCBs. This requires high-precision drilling techniques like laser drilling to achieve the necessary accuracy and maintain reliable electrical connections.<\/span><\/span><\/span><\/span><\/span><\/span><\/li>\r\n\t<\/ul>\r\n\t<\/li>\r\n<\/ul>\r\n\r\n<p style=\"margin-top:16px; margin-bottom:16px\"><b><span lang=\"EN-US\" style=\"font-size:12.0pt\"><span style=\"line-height:115%\"><span style=\"font-family:"Arial",sans-serif\"><span style=\"color:#1f1f1f\">Surface Layers:<\/span><\/span><\/span><\/span><\/b><span lang=\"EN-US\" style=\"font-size:12.0pt\"><span style=\"line-height:115%\"><span style=\"font-family:"Arial",sans-serif\"><span style=\"color:#1f1f1f\"> Similar to traditional PCBs, HDI PCBs have top and bottom surface layers that provide connection points for electronic components through solder pads. However, due to the higher density of components often used in HDI PCBs, the surface design needs to be meticulously planned to ensure proper routing and component placement<\/span><\/span><\/span><\/span><\/p>\r\n\r\n<h2 style=\"margin-top: 16px; margin-bottom: 16px;\"><span style=\"font-size:20px;\"><span style=\"font-family:Arial,Helvetica,sans-serif;\"><span style=\"background:white\"><span style=\"line-height:115%\"><b><span lang=\"EN-US\"><span style=\"line-height:115%\"><span style=\"color:#1f1f1f\">Manufacturing Process of HDI PCBs:<\/span><\/span><\/span><\/b><\/span><\/span><\/span><\/span><\/h2>\r\n\r\n<p><img alt=\"hdi pcb structure diagram\" src=https://www.nextpcb.com/"https:////www.nextpcb.com//uploads//images//202404//11//1712804408-7261-XtSrOn.png/" style=\"width: 602px; height: 336px;\" \/><\/p>\r\n\r\n<p style=\"margin-top:16px; margin-bottom:16px\"><span style=\"font-size:11pt\"><span style=\"background:white\"><span style=\"line-height:115%\"><span style=\"font-family:Arial,sans-serif\"><span lang=\"EN-US\" style=\"font-size:12.0pt\"><span style=\"line-height:115%\"><span style=\"color:#1f1f1f\">The fabrication of HDI PCBs is a complex and precise process, requiring advanced technology and expertise. Here's how it differs from traditional PCBs:<\/span><\/span><\/span><\/span><\/span><\/span><\/span><\/p>\r\n\r\n<ul>\r\n\t<li style=\"margin-top:4px; margin-left:8px\"><span style=\"font-size:11pt\"><span style=\"background:white\"><span style=\"line-height:115%\"><span style=\"font-family:Arial,sans-serif\"><b><span lang=\"EN-US\" style=\"font-size:12.0pt\"><span style=\"line-height:115%\"><span style=\"color:#1f1f1f\">Lamination:<\/span><\/span><\/span><\/b><span lang=\"EN-US\" style=\"font-size:12.0pt\"><span style=\"line-height:115%\"><span style=\"color:#1f1f1f\"> Similar to traditional PCBs, multiple layers are laminated together using heat and pressure. However, the use of thinner dielectric layers and precise alignment of blind and buried vias in HDI PCBs demands a higher degree of control and precision during this stage.<\/span><\/span><\/span><\/span><\/span><\/span><\/span><\/li>\r\n\t<li style=\"margin-left:8px\"><span style=\"font-size:11pt\"><span style=\"background:white\"><span style=\"line-height:115%\"><span style=\"font-family:Arial,sans-serif\"><b><span lang=\"EN-US\" style=\"font-size:12.0pt\"><span style=\"line-height:115%\"><span style=\"color:#1f1f1f\">Drilling:<\/span><\/span><\/span><\/b><span lang=\"EN-US\" style=\"font-size:12.0pt\"><span style=\"line-height:115%\"><span style=\"color:#1f1f1f\"> Traditional PCBs utilize mechanical drilling for vias. However, the smaller via sizes in HDI PCBs necessitate the use of high-precision laser drilling to achieve the required accuracy and minimal hole size.<\/span><\/span><\/span><\/span><\/span><\/span><\/span><\/li>\r\n\t<li style=\"margin-left:8px\"><span style=\"font-size:11pt\"><span style=\"background:white\"><span style=\"line-height:115%\"><span style=\"font-family:Arial,sans-serif\"><b><span lang=\"EN-US\" style=\"font-size:12.0pt\"><span style=\"line-height:115%\"><span style=\"color:#1f1f1f\">Plating:<\/span><\/span><\/span><\/b><span lang=\"EN-US\" style=\"font-size:12.0pt\"><span style=\"line-height:115%\"><span style=\"color:#1f1f1f\"> The via walls in both traditional and HDI PCBs are metalized to create conductive pathways. However, HDI PCBs might utilize specialized plating techniques due to the smaller via size and potential challenges with aspect ratio (via depth vs. diameter).<\/span><\/span><\/span><\/span><\/span><\/span><\/span><\/li>\r\n\t<li style=\"margin-left:8px\"><span style=\"font-size:11pt\"><span style=\"background:white\"><span style=\"line-height:115%\"><span style=\"font-family:Arial,sans-serif\"><b><span lang=\"EN-US\" style=\"font-size:12.0pt\"><span style=\"line-height:115%\"><span style=\"color:#1f1f1f\">Patterning:<\/span><\/span><\/span><\/b><span lang=\"EN-US\" style=\"font-size:12.0pt\"><span style=\"line-height:115%\"><span style=\"color:#1f1f1f\"> This stage involves creating the desired circuit pattern on the surface layers. While the basic photolithography process remains similar to traditional PCBs, HDI PCBs require higher resolution photoresists and stricter control measures due to the finer line widths and smaller features.<\/span><\/span><\/span><\/span><\/span><\/span><\/span><\/li>\r\n\t<li style=\"margin-left:8px\"><span style=\"font-size:11pt\"><span style=\"background:white\"><span style=\"line-height:115%\"><span style=\"font-family:Arial,sans-serif\"><b><span lang=\"EN-US\" style=\"font-size:12.0pt\"><span style=\"line-height:115%\"><span style=\"color:#1f1f1f\">Surface Finishing:<\/span><\/span><\/span><\/b><span lang=\"EN-US\" style=\"font-size:12.0pt\"><span style=\"line-height:115%\"><span style=\"color:#1f1f1f\"> Both types of PCBs undergo surface finishing for protection and solderability. However, HDI PCBs might require specialized surface treatments due to the potential for exposed dielectric material from blind and buried vias.<\/span><\/span><\/span><\/span><\/span><\/span><\/span><\/li>\r\n\t<li style=\"margin-left:8px\"><span style=\"font-size:11pt\"><span style=\"background:white\"><span style=\"line-height:115%\"><span style=\"font-family:Arial,sans-serif\"><b><span lang=\"EN-US\" style=\"font-size:12.0pt\"><span style=\"line-height:115%\"><span style=\"color:#1f1f1f\">Electrical Testing:<\/span><\/span><\/span><\/b><span lang=\"EN-US\" style=\"font-size:12.0pt\"><span style=\"line-height:115%\"><span style=\"color:#1f1f1f\"> Similar to traditional PCBs, rigorous electrical testing is performed to ensure proper functionality and identify any defects. However, the higher density and complexity of HDI PCBs might require more advanced testing procedures to ensure all connections and signal integrity meet specifications.<\/span><\/span><\/span><\/span><\/span><\/span><\/span><\/li>\r\n\t<li style=\"margin-bottom:4px; margin-left:8px\"><span style=\"font-size:11pt\"><span style=\"background:white\"><span style=\"line-height:115%\"><span style=\"font-family:Arial,sans-serif\"><b><span lang=\"EN-US\" style=\"font-size:12.0pt\"><span style=\"line-height:115%\"><span style=\"color:#1f1f1f\">Assembly:<\/span><\/span><\/span><\/b><span lang=\"EN-US\" style=\"font-size:12.0pt\"><span style=\"line-height:115%\"><span style=\"color:#1f1f1f\"> The final stage involves soldering electronic components onto the surface pads. While the basic assembly process might be similar, the higher density of components in HDI PCBs can require more precise placement techniques and potentially specialized soldering equipment.<\/span><\/span><\/span><\/span><\/span><\/span><\/span><\/li>\r\n<\/ul>\r\n\r\n<h2><span style=\"font-size:20px;\"><span style=\"font-family:Arial,Helvetica,sans-serif;\">HDI PCB Main application areas<\/span><\/span><\/h2>\r\n\r\n<p><span style=\"font-size:16px;\"><span style=\"font-family:Arial,Helvetica,sans-serif;\">HDI PCBs are used in consumer electronics, telecommunications, automotive, medical devices, aerospace, industrial equipment, and IoT devices. They enable compact, high-performance electronic systems with improved reliability. HDI technology supports miniaturization, high wiring densities, and signal integrity, making it essential for modern electronics.<\/span><\/span><\/p>\r\n\r\n<p> <\/p>\r\n\r\n<h2>Conclusion<\/h2>\r\n\r\n<p>Not all board factories have the ability to do well in HDI, but NextPCB has been working on this for over 15 years. Today, NextPCB HDI has its own complete system, the entire process is not outsourced, spending a lot of money to purchase advanced equipment, and all quality acceptance standards have been used IPC2 standards, such as hole copper thickness ≧ 20μm, to ensure high reliability.<\/p>\r\n","status":1,"create_time":1668405897,"update_time":1712805205,"clicks":4512,"hits":4,"custom_url":"4-main-difference-between-hdi-pcb-and-ordinary-pcb","related":"","add_uid":111,"publish_uid":0,"attr":0,"type":0,"keywords":"HDI pcb","comment_count":0,"share_count":0,"need_move":0,"c_time":"2022-11-14 14:04:57","u_time":"2025-06-27 15:31:25","comments_count":0,"is_like":0}">

4 Main Difference Between HDI PCB and Ordinary PCB
Posted on April 11, 2024 by Sean H.
HDI (High-Density Interconnect Board) is a compact board designed for small-volume users. Compared to ordinary PCB, the most significant feature of HDI is the high density of wiring.

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Tag: HDI PCB
PCB manufacturers<\/a> can process the multilayers in odd and even numbers as long as within the process capability.<\/p>\r\n\r\n<p>However, whether online or offline, only order numbers are large enough or customers are willing to pay enough money, PCB foundries are willing to accept odd-layer boards. Otherwise, they generally do not receive.<\/p>\r\n\r\n<p>Here are the main three reasons to choose layers in even numbers: manufacturing cost, time cost, and quality.<\/p>\r\n\r\n<h2>Manufacturing Cost<\/h2>\r\n\r\n<p><img alt=\"PCB Manufacturing Cost\" src=https://www.nextpcb.com/"//uploads//images//202303//29//1680057217-9028-RTiaCU.jpg/" style=\"width: 800px; height: 534px;\" \/><\/p>\r\n\r\n<p>First, odd-layer PCBs need to add a non-standard laminated core layer bonding process on top of the nuclear structure process, so the processing cost of odd-layer PCBs is significantly higher than even-layer PCBs.<\/p>\r\n\r\n<p>Second, for many foundries, even-layer PCBs are general designs, while odd-layer PCBs are special designs. The special design means that it needs to be paired with a special production process, matching specific or even completely different production parameters, which requires a lot of trial and error costs.<\/p>\r\n\r\n<p>Finally, the special design is often not the common process of the PCB Manufacturer. So production often requires the designation of experienced engineers dedicated to following up resulting in the rise of labor costs. And the successful implementation of special design also requires production, process, quality, and other departments to discuss together and work together, otherwise, it is easy to make mistakes.<\/p>\r\n\r\n<p>All of the above, results in a very high cost of special design boards. So the odd-layer boards will be far more expensive than the conventional even-layer boards, which in turn leads to customers not accepting odd layers, choosing to use conventional even-layer.<\/p>\r\n\r\n<p>Related Article: <a href=https://www.nextpcb.com/"https:////www.nextpcb.com//blog//pcb-cost-how-much-does-a-printed-circuit-board-pcb-cost/">PCB cost: How Much Does a Printed Circuit Board (PCB) Cost?<\/a><\/p>\r\n\r\n<h2>Time Cost<\/h2>\r\n\r\n<p><img alt=\"PCB Manufacturing Time Cost\" src=https://www.nextpcb.com/"//uploads//images//202303//29//1680057450-2249-MadClp.jpg/" style=\"width: 800px; height: 450px;\" \/><\/p>\r\n\r\n<p>In addition to the monetary cost, odd-layer boards take more time to produce than even-layer boards in practice.<\/p>\r\n\r\n<p>On the one hand, the special design means that it has a lot of places where the usual familiar production is not the same. For odd-layer PCBs, PCB manufacturers need to do a lot of targeted pre-arrangement to ensure smooth production. And more preparation work will take more time.<\/p>\r\n\r\n<p>On the other hand, the special design is a new process to work. So the factory workers will be very unskilled, leading to further lengthening of production time.<\/p>\r\n\r\n<p>So maybe the fastest lead time for a <a href=https://www.nextpcb.com/"https:////www.nextpcb.com//blog//4-layer-pcb/">4-layer board<\/a> with a universal design is only 2 days (like NextPCB), but for a 5-layer board with a special design, it takes 5 days, or even longer. Therefore, special design products in large quantities, even if the PCB manufacturer is willing to take the order, customers themselves often give up because of the long delivery time.<\/p>\r\n\r\n<h2>Quality<\/h2>\r\n\r\n<p><img alt=\"High Quality PCBs\" src=https://www.nextpcb.com/"//uploads//images//202303//29//1680057783-7058-GIDmUP.jpg/" style=\"width: 800px; height: 553px;\" \/><\/p>\r\n\r\n<p>For an odd layer such as a special design of the board, the above-mentioned cost and time factors can be solved with money and patience. But the most important PCB quality is not ensured.<\/p>\r\n\r\n<p>To ensure quality is the best reason for not using odd-layer design PCBs:<\/p>\r\n\r\n<p><strong>Reason 1: odd-layer PCBs are easier to bend<\/strong>. When the PCB is cooled by the multilayer bonding process, the PCB bends due to inconsistent lamination tension between the core structure and the foil-laying structure. The key to eliminating bending is to use a balanced stack of layers, and even if layers of PCB are symmetrical, the degree of warpage can be controlled to less than <strong>0.7%<\/strong>. But odd-layer PCB, especially when the size is large, warpage will exceed 0.7%.<\/p>\r\n\r\n<p><strong>Reason 2: Even-number of layers of the stacked design is conducive to improving the PCB anti-interference ability<\/strong>. PCB signal layer and ground layer (or power supply layer) generally appear in pairs, which can shield the device signal interference. Such as the common <a href=https://www.nextpcb.com/"https:////www.nextpcb.com//blog//high-quality-6-layer-pcb-manufacturer/">6-layer board<\/a> layer order: SIG-GND-SIG-PWR-GND-SIG.<\/p>\r\n\r\n<p><strong>Reason 3: A core board is copper on both sides which can draw lines, made into an odd number of layers means that there is a wasting empty one<\/strong>. Therefore, for any EMI engineer, this layer will be designed as a power layer or ground layer to play a <a href=https://www.nextpcb.com/"https:////www.nextpcb.com//blog//printed-circuit-board-shielding/">shielding role<\/a>.<\/p>\r\n\r\n<p>In addition, special processes are difficult to ensure the yield, so the yield of odd-layer PCBs tends to be lower than the even layer. Moreover, it is also difficult to ensure quality control without defects in the production process. Regardless of which PCB manufacturer, yield, and quality growth, a longer process is required. <\/p>\r\n\r\n<h2>Conclusion<\/h2>\r\n\r\n<p>The PCB manufacturer does not like the effort, the customer is not willing to invest too much in certain parts of the product, so gradually formed an implicit rule: the production of the product by the lamination method. PCB manufacturers and customer default to using the accumulation method to produce <a href=https://www.nextpcb.com/"https:////www.nextpcb.com//blog//multilayer-printed-circuit-board/">high multi-layer boards<\/a>, the board are designed into an even number of layers, so as to reduce the price and get high-quality products.<\/p>\r\n","status":1,"create_time":1668159189,"update_time":1680058747,"clicks":1446,"hits":0,"custom_url":"why-is-option-of-selecting-count-of-layers-mostly-even","related":"","add_uid":111,"publish_uid":0,"attr":0,"type":0,"keywords":"PCB layers","comment_count":0,"share_count":0,"need_move":0,"c_time":"2022-11-11 17:33:09","u_time":"2025-06-27 09:53:48","comments_count":0,"is_like":0}">

Why Is the Option of Selecting the Count of Layers Mostly Even?
Posted on March 29, 2023 by Sean H.
This articles will introduce the reason why option of selecting the count of layers mostly even, including: manufacturing cost, time cost, quality.

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Tag: PCB Layers
PCB manufacturing<\/a>  We share the super practical PCB procurement guide. 10 tips to reduce the cost of PCB are follow:<\/p>\r\n\r\n<h2>#1. Substrate<\/h2>\r\n\r\n<p>A PCB substrate is a dielectric material most commonly composed of epoxy resin and glass fiber weave (sometimes unwoven) which is used to hold the traces and components in PCB stack-up. These materials may be supplemented by ceramics to increase the dielectric constant. The substrate material chosen will determine the mechanical, thermal, and chemical properties of a circuit board. <\/p>\r\n\r\n<p><img alt=\"Substrate\" src=https://www.nextpcb.com/"//uploads//images//202211//11//1668148259-2062-OZGiQr.png/" style=\"width: 800px; height: 276px;\" \/><\/p>\r\n\r\n<p>Different brands of plates, the price is not the same. For example, <strong><a href=https://www.nextpcb.com/"http:////www.goldenmax.cn///">GDM <\/a>will be cheaper than the <a href=https://www.nextpcb.com/"https:////www.kblaminates.com//en///">KINGBOARD, <a href=https://www.nextpcb.com/"https:////www.syst.com.cn///">SYTECH, <a href=https://www.nextpcb.com/"https:////www.syst.com.cn///">Nan Ya<\/a> when substrate TG value more than 150℃, Pre-preg sheet thickness more than 0.2mm with multilayer board. But GDM iis generally used to do more single-sided, not recommended for multilayer boards<\/strong>. There are also some unknown miscellaneous plates, cheaper, can also be used but with relatively poor performance, the probability of quality problems will be relatively high.<\/p>\r\n\r\n<p>If you order multilayer PCBs which are more than <a href=https://www.nextpcb.com/"https:////www.nextpcb.com//blog//high-quality-8-layer-printed-circuit-board-manufacturing/">8-layer, you need to use a better performance of the board, it is recommended to use the <strong>TG170<\/strong> better, more cost-effective.<\/p>\r\n\r\n<h2>#2. Ink<\/h2>\r\n\r\n<p>PCB ink is the ink used for Printed Circuit Board (PCB), where the important physical properties are the ink's viscosity, thixotropy and fineness. These physical properties need to be known in order to improve the ability to use the ink.<\/p>\r\n\r\n<p><img alt=\"PCB Ink\" src=https://www.nextpcb.com/"//uploads//images//202211//11//1668148464-1804-omZcKu.jpg/" style=\"width: 700px; height: 444px;\" \/><\/p>\r\n\r\n<p>There are 2 factors that need to be considered: color and brand. <\/p>\r\n\r\n<p>Color, the most common is green oil, but if you want to use special colors of ink, such as blue oil, white oil, yellow oil, black oil, etc., will generally increase the price.<\/p>\r\n\r\n<p>Brand-wise, the best one is currently <a href=https://www.nextpcb.com/"https:////www.taiyoink.com.tw//products///">TAIYO ink<\/strong><\/a>, which mainly shows high viscosity, stable dielectric constant, good insulation and oxidation resistance, but it is more expensive. Other brands of ink will be relatively cheaper, but the quality is not particularly stable. If it is used in bulk for products, we recommend using TAIYO ink, the quality is stable, and the products run relatively stable.<\/p>\r\n\r\n<h2>#3. Film<\/h2>\r\n\r\n<p>PCB films are acidic or alkaline protective coating to transfer the circuit patterns to CCL, they are usually divided into negative film and positive films.<\/p>\r\n\r\n<p><img alt=\"PCB Film\" src=https://www.nextpcb.com/"//uploads//images//202211//11//1668148549-4906-qlkZDH.png/" style=\"width: 800px; height: 600px;\" \/><\/p>\r\n\r\n<p>If there are small boards, line width pitch 5\/5 mil or more batch board, the manufacturer will choose to use film for the sake of capacity. And the larger the board size, <strong>the higher the filming cost, generally the minimum cost is between $16-32<\/strong>. (Small batch prototype production usually uses the LDI exposure machines rather than film. And batch for the pursuit of capacity will first use film, and then use LED traditional exposure.)<\/p>\r\n\r\n<h2>#4. Line Width & Spacing<\/h2>\r\n\r\n<p><img alt=\"Line Width & Spacing\" src=https://www.nextpcb.com/"//uploads//images//202211//11//1668148612-2547-wIRGBS.png/" style=\"width: 600px; height: 500px;\" \/><\/p>\r\n\r\n<p><strong>The thinner the line, the higher the price<\/strong>. When the width or spacing of line spacing is lower than 5\/5 mil, generally the price will increase. Because of the thinner line, the accuracy requirement of the equipment and the quality of the chemical solution will be higher. At the same time, the yield will be relatively low, resulting in higher costs.<\/p>\r\n\r\n<h2>#5. Drilling<\/h2>\r\n\r\n<p><img alt=\"PCB Drilling\" src=https://www.nextpcb.com/"//uploads//images//202211//11//1668148671-2949-fugXAL.jpg/" style=\"width: 800px; height: 660px;\" \/><\/p>\r\n\r\n<p><strong>The smaller the hole the higher the price<\/strong>, the diameter of less than 0.3mm will increase the price. <strong>The more holes the higher the price will be<\/strong>. There are other special holes which will also increase the cost, such as half-hole, greater than 6.0mm PTH hole, etc.. Because the hole is small, only one board can be drilled at a time when punching holes in the PCB material, which is less efficient, and the possibility of breaking the drill nozzle is also greater, leading to higher costs.<\/p>\r\n\r\n<h2>#6. Copper Thickness<\/h2>\r\n\r\n<p>Generally, most PCBs are manufactured using a copper thickness from 1 oz. to 3 oz. <\/p>\r\n\r\n<p><img alt=\"Copper Thickness\" src=https://www.nextpcb.com/"//uploads//images//202211//11//1668148746-3446-sQDpPZ.jpg/" style=\"width: 600px; height: 402px;\" \/><\/p>\r\n\r\n<p><strong>Surface copper ≥ 2oz copper thickness, hole copper greater than 25μm board will increase the cost.<\/strong> Because the price of copper itself is more expensive, the thicker the copper price will be higher. In addition, the cost of extra electric copper, resulting in an overall price increase.<\/p>\r\n\r\n<h2>#7. Board Thickness<\/h2>\r\n\r\n<p><img alt=\"Board Thickness\" src=https://www.nextpcb.com/"//uploads//images//202211//11//1668148778-5927-VEdqYy.jpg/" style=\"width: 640px; height: 280px;\" \/><\/p>\r\n\r\n<p>PCB price difference of the Board thickness is not significant in 1.2 and 1.6mm. But <strong>if the board thickness is not less than 2.0mm, its cost will increase accordingly<\/strong>. The thicker the board represents the more sheets of glass fiber cloth, so the cost will increase.<\/p>\r\n\r\n<h2>#8. Routing Slot<\/h2>\r\n\r\n<p>A routing slot is a hole that is too big to be formed by normal drilling methods in the circuit board.<\/p>\r\n\r\n<p><img alt=\"Routing Slot\" src=https://www.nextpcb.com/"//uploads//images//202211//11//1668148848-4362-nyKLcC.png/" style=\"width: 800px; height: 530px;\" \/><\/p>\r\n\r\n<p><strong>The cost will increase for more gong slots and the size of gong slots below 1.0mm<\/strong>. This is because the board with more gong slots is mostly shaped, resulting in the processing length being elongated, and in addition, if the width of the slot is smaller, the processing cannot be too fast, and it is easy to break the milling cutter, so the processing efficiency is lower and the natural production cost increases.<\/p>\r\n\r\n<h2>#9. Surface Finish<\/h2>\r\n\r\n<p>Common surface finish processes are: OSP (antioxidant), Immersion Tin (Sn), lead-free Immersion Tin (environmental protection), Electrolytic Hard Gold, Electroless Nickel Immersion Gold (ENIG) and some combination of processes. The price of the above process is more expensive, i.e.: <strong>OSP (anti-oxidation) ＜Immersion Tin (Sn) ＜lead-free Immersion Tin ＜Electrolytic Hard Gold ＜ENIG<\/strong>.<\/p>\r\n\r\n<p><img alt=\"Surface Finish\" src=https://www.nextpcb.com/"//uploads//images//202211//11//1668148898-2194-eOoCxp.jpg/" style=\"width: 615px; height: 339px;\" \/><\/p>\r\n\r\n<p>It is worth mentioning that generally the immersion Tin is used more often as the high cost performance. But some manufacturers' OSP process is even more expensive than immersion Tin! This is because for cost reasons, the prototype factory will be a number of customers of the same process of the board together for shipment, but because OSP is difficult to tin so fewer customers need, which leads to OSP process of the board patchwork difficulties, can only be shipped separately, so the price will rise a few dozen dollars.<\/p>\r\n\r\n<h2>#10. Mold Fee and Test Fee<\/h2>\r\n\r\n<p><strong>Mold costs<\/strong>: If it is a prototype or small batch, the general board factory is used to drill and mill the shape, without additional milling fees. However, if it is a large volume, you need to open a mold to punch the board, resulting in a set of mold costs, the board factory generally quoted in more than $160.<\/p>\r\n\r\n<p><strong>Test fee<\/strong>: If it is a sample or small batch, generally use the flying probe test, the cost varies from $16-64 (depends on the number of test points to determine the file). If it is a large volume to open the test frame to test, high efficiency and lower overall cost! Test rack costs are generally between $160-210. <\/p>\r\n\r\n<h2>Conclusion<\/h2>\r\n\r\n<p>Unless the product itself is not required, the manufacturing board should be considered the cost, the above 10 aspects should be considered in place. Otherwise, once the whole product project is done in large quantities, it is possible to find a loss! <br \/>\r\nTo do a good job, an artisan needs the best tools. Therefore, we recommend a free <a href=https://www.nextpcb.com/"https:////www.nextpcb.com//nextdfm/">PCB design analysis software for manufacturability(DFM)<\/a> which can be a key analysis of PCB price and cost warning, as one of the references when you do cost optimization.<\/p>\r\n","status":1,"create_time":1668148991,"update_time":1668149095,"clicks":2335,"hits":6,"custom_url":"10-tips-to-save-your-money-on-pcb","related":"","add_uid":111,"publish_uid":0,"attr":0,"type":0,"keywords":"pcb cost","comment_count":0,"share_count":0,"need_move":0,"c_time":"2022-11-11 14:43:11","u_time":"2025-06-27 14:13:57","comments_count":0,"is_like":0}">

PCB Cost - 10 Tips to Save Your Money on PCB
Posted on November 11, 2022 by Sean H.
This article will tell you how to save pcb cost in substrate, ink, fim, line widh, drilling hole, copper thickness, thickness, slot, surface finish and mold.

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Tag: PCB Cost

PCB manufacturing<\/a>. Your consumer electronics would only function properly with a proper circuit board assembly. There is an urgent need to understand PCB Assembly and its steps.<\/p>\r\n\r\n<p>Printed Circuit Board Assembly is putting together essential components on a fabricated circuit board to create a functional circuit board. The more components on the circuit board, the more complex the assembly process becomes.<\/p>\r\n\r\n<p>NextPCB provides an ultimate guide to the step-by-step Printed Circuit Board Assembly process in this post. Also, it discusses the kinds of PCB mounting technology in the Assembly process and essential components that are common in PCB Assembly process.<\/p>\r\n\r\n<p><iframe allow=\"accelerometer; autoplay; clipboard-write; encrypted-media; gyroscope; picture-in-picture; web-share\" allowfullscreen=\"\" frameborder=\"0\" height=\"500\" referrerpolicy=\"strict-origin-when-cross-origin\" scrolling=\"no\" src=https://www.nextpcb.com/"https:////www.youtube.com//embed//vPocwqOSLXg/" title=\"PCB Assembly Process in a State-of-the-Art Factory in China\" width=\"800\"><\/iframe><\/p>\r\n\r\n<h2>Printed Circuit Assembly Technology<\/h2>\r\n\r\n<p>The PCB industry is always dynamic in providing quality PCB Manufacturing and Assembly processes. When it comes to the Assembly process, there are two mounting technologies that PCB Manufacturers employ: Surface Mount Technology (SMT) and Through-Hole Technology (THT). Let’s examine each of these mounting technologies and their differences.<\/p>\r\n\r\n<h3>Surface Mount Technology<\/h3>\r\n\r\n<p>SMT is undoubtedly one of the best Printed Circuit Board Assembly technologies in the PCB Industry. With <a href=https://www.nextpcb.com/"https:////www.nextpcb.com//blog//ultimate-guide-to-smt-pcb-assembly/">surface mount Technology<\/a>, the manufacturing process of Small-sized yet functional PCBs is achievable.<\/p>\r\n\r\n<p>Also, the <a href=https://www.nextpcb.com/"https:////www.nextpcb.com//blog//ultimate-guide-to-smt-pcb-assembly/">Surface Mount Technology<\/a> allows small components like resistors, diodes, and integrated circuits carefully mount on the surface of the PCB. <a href=https://www.nextpcb.com/"https:////www.nextpcb.com//blog//ultimate-guide-to-smt-pcb-assembly/">Surface mount technology<\/a> is low-cost, faster, and offers higher accuracy in the production process.<\/p>\r\n\r\n<p>However, Surface Mount Technology has a significant drawback. It is not ideal for circuits prone to frequent vibrations and stress, which would lead to the components falling off the circuit boards.<\/p>\r\n\r\n<p>The Assembly Process involved in Surface Mount Technology includes:<\/p>\r\n\r\n<ol>\r\n\t<li>Surface Mount Technology Printing: This process is vital in Surface Mount Technology. SMT printing involves printing solder paste on the circuit board using a stencil.<\/li>\r\n\t<li>Pick and Placement of Components: The components are first picked and placed on the solder paste on the Printed Circuit Board.<\/li>\r\n\t<li>Reflow Soldering: This process involves passing the Printed Circuit Board to high temperatures to ensure a tight connection between the circuit board and its electronic components.<\/li>\r\n<\/ol>\r\n\r\n<p><img alt=\"Standard production line for smt\" src=https://www.nextpcb.com/"https:////www.nextpcb.com//uploads//images//202404//08//1712557711-998-qASVIZ.png/" style=\"width: 1116px; height: 431px;\" \/><\/p>\r\n\r\n<h3 style=\"text-align: center;\"> Surface mount standard assembly line<\/h3>\r\n\r\n<h3>Through-Hole Technology<\/h3>\r\n\r\n<p>Through-Hole technology shines excellently in circuits subjected to frequent mechanical stress and vibrations. This technology requires precise drilling of holes on the Printed Circuit Board for components with leads firmly attached.<\/p>\r\n\r\n<p>Through-Hole Technology is great for large components such as capacitors, relays, plug connectors, and electromechanical coils that fit into the board. These components use the holes to pass signals from one side of the board to the other.<\/p>\r\n\r\n<p>However, This Technology is more expensive than SMT. It is a less reliable method as the holes need to be precise, or the assembly process could lead to design and functional errors during testing.<\/p>\r\n\r\n<p>The Assembly process involved in the Through-Hole Technology includes:<\/p>\r\n\r\n<ol>\r\n\t<li>Drilling: drilling of the circuit board to create holes for easy fixing of the components' leads into the circuit board.<\/li>\r\n\t<li>Pick and Place components: This process ensures the attachment of the components' leads into the circuit boards<\/li>\r\n\t<li>Wave soldering: Since holes are on the circuit board, the conventional solder paste method will not work. Instead, THT components require a unique soldering technique called wave soldering.      The circuit board firmly attaches on a conveyor belt that runs into an industrial oven where molten solder washes over the bottom of the PCB. This process ensures permanent fixing of all the leads of the components on the other side of the circuit board.<\/li>\r\n\t<li>Final inspection and packaging: After the soldering process, the next process is final inspection of the PCBs to ensure no defects on the circuit board and its components. Also, the Printed Circuit Boards pass through the necessary test before packaging and shipment to their customers.<\/li>\r\n<\/ol>\r\n\r\n<h2>Printed Circuit Board Assembly Step-By-Step <\/h2>\r\n\r\n<p>Printed Circuit Boards are the heart of all electronic devices regardless of their operations and functions. As such, there is a need to carefully follow the outlined steps involved in the PCB Assembly Process.<\/p>\r\n\r\n<p><a href=https://www.nextpcb.com/"https:////www.nextpcb.com//blog//pcb-assembly--a-comprehensive-guide/">Printed Circuit Board Assembly<\/a> takes place after PCB Manufacturing; that is, a bare circuit before placing any component on it. The circuit board will have the required layers (single, Double-sided, multi-layer) and copper traces.<\/p>\r\n\r\n<p><img alt=\"pcb assembly process flow chart\" src=https://www.nextpcb.com/"https:////www.nextpcb.com//uploads//images//202403//15//1710474814-9979-oxfseI.png/" style=\"width: 1241px; height: 489px;\" \/><\/p>\r\n\r\n<p style=\"text-align: center;\">pcb assembly process flow chart<\/p>\r\n\r\n<p>Here are the required steps in the PCB Assembly Process:<\/p>\r\n\r\n<h3>Step 1: Solder Paste Stenciling<\/h3>\r\n\r\n<p>The first PCB assembly process is solder paste application to the bare circuit board. This solder pasting aims to fill the circuit board with enough paste to fix electrical components quickly.<\/p>\r\n\r\n<p>This process requires a stainless-steel stencil with the same shape, width, and size as the bare Printed Circuit Board. It is usually made of brass or common material, stainless steel.<\/p>\r\n\r\n<p>The Stencil follows the set PCB design and has holes that will be filled with solder paste. This Stencil is then carefully fit on top of the bare circuit board, which covers areas that do not require solder paste.<\/p>\r\n\r\n<p>After fitting the stencil on the circuit board, a solder paste applicator will distribute the solder paste evenly to the uncovered spaces. Then, the PCB assembly team will check if the solder paste evenly distributes on the circuit board via the Stencil.<\/p>\r\n\r\n<p>For a <a href=https://www.nextpcb.com/"https:////www.nextpcb.com//blog//2-layer-print-circuit-boardpcb-manufacturer/">double-sided circuit board<\/a>, each side will have a stencil for even distribution of solder paste<\/p>\r\n\r\n<h3>Step 2: Pick and Place components.<\/h3>\r\n\r\n<p>Once the solder paste evenly distributes on the bare Printed Circuit Boards, the next step is picking and placing components on the circuit board. The required components undergo thorough inspections to check for defects or malfunctions before placement.<\/p>\r\n\r\n<p>With advanced technology, this process is automated as Pick & Place machines will pick specific components and place them on their required paste. The automation ensures maximum efficiency and accuracy.<\/p>\r\n\r\n<p>Upon placement of the components, the Circuit board assembly team will inspect the PCBs of the solder paste enough to hold the components in place. This process takes place several times to ensure that no component is loose on the circuit board.<\/p>\r\n\r\n<p>For a double-sided PCB, the step is the same; the components fixed on one side will undergo thorough checks then the other side with its components will also go through similar inspections.<\/p>\r\n\r\n<p>Some pick-and-place machines put small amounts of adhesive to secure the components further. Yet, it can be disadvantageous, especially if the components’ placement is misaligned from the original PCB design specification.<\/p>\r\n\r\n<p>Regardless of the Assembly technology, this pick-and-place process is necessary and automated for better accuracy.<\/p>\r\n\r\n<h3>Step 3: Reflow Soldering<\/h3>\r\n\r\n<p>The third step is Reflow Soldering. This process involves passing the circuit board through varying temperatures to melt and resolve the solder.<\/p>\r\n\r\n<p>The circuit boards with their required components will pass through an industrial oven or furnace that heats the solder and then melts it to ensure a proper connection between the components and the board.<\/p>\r\n\r\n<p>The <a href=https://www.nextpcb.com/"https:////www.nextpcb.com//blog//high-temperature-pcb/">PCB temperature<\/a> could be as high as 245<span style=\"font-size: 10.8333px;\">℃<\/span>. A primary concern regarding this process is that the components affixed to the circuit boards must withstand these high temperatures for some time.<\/p>\r\n\r\n<p>After, the printed circuit boards moves to an industrial cooler, which lowers the circuit board’s temperature and solidifies the liquid solder paste, further fixing the components on the board.<\/p>\r\n\r\n<p>For double-sided circuit boards, it is necessary to use a unique adhesive to hold the other side components in place to prevent them from falling off. This process takes about ten minutes (usually less).<\/p>\r\n\r\n<p>                                                <img alt=\"Reflow soldering working principle diagram\" src=https://www.nextpcb.com/"https:////www.nextpcb.com//uploads//images//202404//08//1712557837-319-OLTGmw.png/" style=\"width: 522px; height: 275px;\" \/><\/p>\r\n\r\n<p style=\"text-align: center;\">Reflow soldering working principle diagram<\/p>\r\n\r\n<h3>Step 4: X-ray Inspection and Quality Control<\/h3>\r\n\r\n<p>After the Printed Circuit Board is at room temperature, it undergoes two inspections.<\/p>\r\n\r\n<ol>\r\n\t<li>The manual inspection checks the circuit board for any misalignment of components during the third stage or the circuit board’s fault.<\/li>\r\n\t<li>The x-ray inspection is where the circuit boards pass through an x-ray machine to check for inner layer defects.<\/li>\r\n<\/ol>\r\n\r\n<p>The manual inspection could cause eye fatigue and strain, especially if a circuit board holds hundreds of components.<\/p>\r\n\r\n<p>The x-ray inspection, however, enables easy detection as the machine captures an image of the solder joints to determine the quality of the solder joints is comparable to industry standards. Also, x-ray inspection can help identify if the solder past is insufficient, there are misaligned components, or there is an incomplete reflow process.<\/p>\r\n\r\n<h3>Step 5: Final inspection and Functional Testing.<\/h3>\r\n\r\n<p>The first final stage of the Printed Circuit Board Assembly Process is the final inspection. The final inspection ensures that the circuit board, the solder paste points, and the components conform with the desired PCB specifications. Also, thorough cleaning of the printed circuit boards to remove debris or excess solder.<\/p>\r\n\r\n<p>After the final inspection, functional tests are necessary to test the Printed Circuit Boards and their soldered components for functionality.<\/p>\r\n\r\n<p>Employing Automated Optical Inspection can subject your PCB to real-world testing via simulations to ensure that it provides quality operations to consumers in electronic devices.<\/p>\r\n\r\n<p>Also, in-circuit Testing is another intensive test that ensures that each component is functional and offer no errors on the Printed Circuit Boards. However, the in-circuit test is time-consuming and could add to the manufacturing costs. Still, clients can request this test for their PCB, fully aware that they will pay the extra charges.<\/p>\r\n\r\n<p>The functional test determines the success or failure rate of the Printed Circuit Board assembly. Hence, a Printed Circuit Board will not get to packaging and shipment if it fails in any required functional tests.<\/p>\r\n\r\n<h2><span style=\"font-size: 2rem;\">Printed Circuit Board Assembly Process: Factors That could affect Quality <\/span><\/h2>\r\n\r\n<h3>Moisture<\/h3>\r\n\r\n<p>Moisture is threatening PCB electronics assembly. It may seep into the PCB manufacturing process or during the assembly phase. In any case, moisture can affect the lifespan of the circuit board and its components due to condensation.<\/p>\r\n\r\n<p>This phenomenon, condensation, occurs when these circuit boards are in containers with lower temperatures than the surroundings. To ensure quality PC Board Assembly Processes, practical anti-moisture evaluation should be available during components’ selection.<\/p>\r\n\r\n<h3>Temperature<\/h3>\r\n\r\n<p>It is a known fact that PCB electronic devices are widely used in various sectors such as automotive, medical, industrial, and transportation. These printed circuit boards operate in harsh conditions, especially high temperatures. These high temperatures could prevent the components from functioning correctly.<\/p>\r\n\r\n<p>PCB Manufacturers must note the effects of high temperatures on their electronics. Also, they can specify the temperature range of these products during packaging and shipping.<\/p>\r\n\r\n<p>Due to advancements in PCB trends, thermal-resistant materials are employed in designing active and passive PCB components to ensure they operate within temperature ranges in their respective industry.<\/p>\r\n\r\n<h3>Mechanical Stress<\/h3>\r\n\r\n<p>As earlier stated, PCBs are useful in various applications and sectors, often requiring operating them at high vibrations or frequencies. It is noteworthy that high vibrations or shocks could break the circuit board hence the circuitry and mechanical components found within the printed circuit board.<\/p>\r\n\r\n<p>The through-hole technology effectively deals with PCBs often associated with shocks and high vibrations to combat this problem. This PCB assembly technology ensures that components are permanently fixed into the circuit board.<\/p>\r\n\r\n<h3>The period cycle of components<\/h3>\r\n\r\n<p>Due to rapid changes in modern electronic technology, components have limited lifespans, becoming obsolete when new components hit the PCB market. These old components become obsolete and have reached their End of Life stages.<\/p>\r\n\r\n<p>When components become obsolete, there is an increased chance that the PCB starts to malfunction due to mechanical and physical stress, thereby reducing its efficiency and reliability. Also, when new PCB technologies arise, these obsolete components may have difficulty meeting the new performance requirements and hence have a greater chance of failure.<\/p>\r\n\r\n<p>To ensure consumers know their PCB expiration date, PCB manufacturers must carefully explain to them the new alternative devices to opt for when their PCB exceeds the expiry date.<\/p>\r\n\r\n<p style=\"text-align:justify\"><span style=\"font-size:36px;\"><strong><span style=\"font-family:Calibri\"><span style=\"font-family:宋体\"><font face=\"Calibri\">Why is PCB Assembly Expensive and How Can You Reduce Costs?<\/font><\/span><\/span><\/strong><\/span><\/p>\r\n\r\n<p style=\"text-align:justify\"><span style=\"font-size:14px;\"><span style=\"font-family:Arial,Helvetica,sans-serif;\">PCB assembly can be costly due to factors like the price of high-quality components, the labor involved, and the advanced equipment required for production and testing. Low-volume runs also drive up per-unit costs, and specialized processes like prototyping and customization add to the expense.<\/span><\/span><\/p>\r\n\r\n<p style=\"text-align:justify\"><span style=\"font-size:14px;\"><span style=\"font-family:Arial,Helvetica,sans-serif;\">However, there are ways to cut down on these costs. By optimizing your design for manufacturability (DFM), using standard components, increasing production volume, and choosing cost-effective manufacturers, you can save significantly. Additionally, panelization, reducing board complexity, and establishing long-term partnerships with manufacturers can lead to more efficient production and lower costs.<\/span><\/span><\/p>\r\n\r\n<p style=\"text-align:justify\"><span style=\"font-size:14px;\"><span style=\"font-family:Arial,Helvetica,sans-serif;\">1. Optimize Design for Manufacturability (DFM):<\/span><\/span><\/p>\r\n\r\n<p style=\"text-align:justify\"><span style=\"font-size:14px;\"><span style=\"font-family:Arial,Helvetica,sans-serif;\">One of the most effective ways to reduce PCB assembly costs is by simplifying the PCB layout and designing the board for efficient manufacturing. This includes avoiding unnecessary layers, minimizing complex routing, and using standardized footprints for components. DFM ensures that your design is easier to assemble, reducing the risk of errors during production and lowering overall costs. Consulting with your manufacturer during the design phase can help identify areas for optimization.<\/span><\/span><\/p>\r\n\r\n<p style=\"text-align:justify\"><a href=https://www.nextpcb.com/"https:////www.nextpcb.com//free-online-gerber-viewer.html/"> $\"hq$ quote now<\/a> and enjoy an unbeatable customer experience from us.<\/p>\r\n","status":1,"create_time":1668063503,"update_time":1732697427,"clicks":17761,"hits":10,"custom_url":"pcb-assembly-process","related":"","add_uid":111,"publish_uid":0,"attr":0,"type":0,"keywords":"PCB assembly process, printed circuit board assembly process","comment_count":0,"share_count":0,"need_move":0,"c_time":"2022-11-10 14:58:23","u_time":"2025-01-14 14:40:20","comments_count":0,"is_like":0}">

PCB Assembly Process - Ultimate Guide Is Here - NextPCB
Posted on November 27, 2024 by NextPCB
Printed Circuit Board assembly involves solder pasting, pick & place components, reflow soldering, x-ray inspection, and quality control.

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Tag: PCB Assembly Process

PCB Manufacturing<\/a>. When you see a green coat applied atop your Printed Circuit Board, that is a solder mask.<\/p>\r\n\r\n<p>Paste Mask adds solder paste on the printed circuit to allow firm fixing of the components.<\/p>\r\n\r\n<p>Often at times, it needs to be clarified to note the difference between a Solder mask and a paste mask. This guide will detail the types, functions, and differences between these two processes.<\/p>\r\n\r\n<h2>What is PCB Solder Mask?<\/h2>\r\n\r\n<p>Solder mask is usually applied in the final stages of Printed Circuit Board Manufacturing. During the PCB assembly process, the copper traces are exposed, thereby running the risk of oxidation and rust. Hence,  the application of solder mask prolongs the circuit' board life cycle.<\/p>\r\n\r\n<p>Also, it is usually a thin layer applied to the PCB's copper traces, traditionally made of polymer, to prevent oxidation, rust, and dirt when exposed to the environment. It is essentially the sheet that covers the whole PCB giving it a shiny appearance.<\/p>\r\n\r\n<h2>Function of Solder Masks<\/h2>\r\n\r\n<p>Here are the following functions that solder masks offer to Printed Circuit Boards.<\/p>\r\n\r\n<ul>\r\n\t<li>Protection of the Printed Circuit Board against oxidation<\/li>\r\n\t<li>It offers protection from external heat.<\/li>\r\n\t<li>The solder mask prevents accidental circuit bridging due to soldering<\/li>\r\n\t<li>It offers protection from electrostatic discharge from the Printed Circuit Board.<\/li>\r\n\t<li>Prevention of dust from interfering with essential components in the circuit.<\/li>\r\n<\/ul>\r\n\r\n<h2>Types Of Solder Mask<\/h2>\r\n\r\n<p>There are varied kinds of solder Masks available in PCB manufacturing. However, PCB Manufacturers make use of four significant types. They include the following:<\/p>\r\n\r\n<ul>\r\n\t<li>Epoxy Liquid<\/li>\r\n\t<li>Top and Bottom<\/li>\r\n\t<li>Liquid Photo-imageable<\/li>\r\n\t<li>Dry Film Photo-imageable<\/li>\r\n<\/ul>\r\n\r\n<p>Suppose you are new to PCB Manufacturing. In that case, it is vital to consider the differences in types and see how you can apply them. Let's explain them briefly so you can discern these types and see which you can use for your Printed Circuit Board.<\/p>\r\n\r\n<h3>Epoxy Liquid Solder Mask<\/h3>\r\n\r\n<p>This kind of Solder mask is the cheapest kind available in the market. Epoxy is applied on the PCB board through Silkscreen. Silkscreen allows ink to be transferred to the open areas on the circuit board.<\/p>\r\n\r\n<h3>Top and Bottom Solder Mask<\/h3>\r\n\r\n<p>PCB manufacturers employ this solder mask to identify the kind applied to the top and bottom of the Printed Circuit Board. It is usually made of epoxy.<\/p>\r\n\r\n<h3>Liquid Photo-imageable Solder Mask<\/h3>\r\n\r\n<p>Usually called LPSM, it comes from ink formulation using a liquid solder resist. The LPSM process is often sprayed over the surface, which is faster and cheaper. Upon completion of the LPSM process, the circuit is cleaned to ensure no dirt or dust is trapped in the hardened solder resist.<\/p>\r\n\r\n<h3>Dry Film Photo-imageable Solder Mask (DFSM)<\/h3>\r\n\r\n<p>The DFSM is pretty similar to the LPSM. However, the dry film is applied using a vacuum lamination process instead of liquid solder resist. It ensures that no bubbles are trapped under the film.<\/p>\r\n\r\n<p>When the dry film is exposed and fully developed, the circuit board creates a pattern for easy fixing and soldering the PCB components onto the circuit board.<\/p>\r\n\r\n<h2>Pros<\/h2>\r\n\r\n<ul>\r\n\t<li>It prevents oxidation, dust, and dirt on the circuit board.<\/li>\r\n\t<li>It is primarily green; hence they cut across varied applications of green PCB.<\/li>\r\n\t<li>prevention of accidental bridging during assembly.<\/li>\r\n<\/ul>\r\n\r\n<h2>Cons<\/h2>\r\n\r\n<ul>\r\n\t<li>It is not applicable in hand-soldered PCB assemblies.<\/li>\r\n\t<li>During exposure, ink usually overflows on the Circuit board.<\/li>\r\n\t<li>High temperature in the reflow oven affects it.<\/li>\r\n<\/ul>\r\n\r\n<h2>What is PCB Paste Mask?<\/h2>\r\n\r\n<p><img alt=\"\" src=https://www.nextpcb.com/"//uploads//images//202211//10//1668062108-6295-SNWkLY.jpg/" style=\"width: 400px; height: 278px;\" \/><\/p>\r\n\r\n<p>Paste masks are stencils which have hole openings for easy deposition of solder paste[\/caption]<\/p>\r\n\r\n<p>PCB paste mask refers to the technique or patterns applied on the Printed Circuit Board. They are stencils applied during PCB assembly with punched holes corresponding to the solder points on the printed Circuit Board.<\/p>\r\n\r\n<p>Stencils allow solder paste to be easily applied on the circuit boards, enabling essential components to fix on the PCB. Hence, the paste masks' size must equal that of the Printed Circuit Boards.<\/p>\r\n\r\n<p>A solder paste layer is used to determine the exposed copper on the bare Printed Circuit Board and is in Gerber files. A solder paste layer is called <a href=https://www.nextpcb.com/"https:////www.nexpcb.com//blog//how-to-get-a-professional-pcb-stencil/">a stencil file<\/a>. The stencil file is one for a single-layer printed circuit board. For a double-sided circuit board, it needs two stencil files.<\/p>\r\n\r\n<h2>Function Of PCB Paste Masks<\/h2>\r\n\r\n<ul>\r\n\t<li>Paste masks enable easy component soldering on the printed circuit board.<\/li>\r\n\t<li>To allow for possible reflow soldering process during PCB Assembly.<\/li>\r\n\t<li>It makes surface mount technology possible during PCB assembly<\/li>\r\n<\/ul>\r\n\r\n<h2>Types Of Paste Mask<\/h2>\r\n\r\n<p>The Top and Bottom Paste Masks are the two kinds of Past masks or Stencils in the PCB industry. Let's consider the difference between them.<\/p>\r\n\r\n<h3>Top Paste Mask<\/h3>\r\n\r\n<p>This Paste mask is found on the top side part of the printed circuit board. Top Paste Mask is also known as the component side. <a href=https://www.nextpcb.com/"https:////www.nextpcb.com//blog//ultimate-guide-to-smt-pcb-assembly/">Surface Mount Technology (SMT)<\/a> employs this Paste Mask, where the components are fixed on the circuit board.<\/p>\r\n\r\n<h3>Bottom Paste Mask<\/h3>\r\n\r\n<p>The bottom Paste mask is found on the bottom side of the printed circuit board. It is also known as the solder side. Through-Hole Technology (THT) utilizes it, where components have leads that permanently attach to the circuit board longer.<\/p>\r\n\r\n<h2>Pros<\/h2>\r\n\r\n<ol>\r\n\t<li>It reduces the reflection of light in PCBs<\/li>\r\n\t<li>Paste masks are made on the circuit board's top and bottom sides.<\/li>\r\n<\/ol>\r\n\r\n<h2>Cons<\/h2>\r\n\r\n<ol>\r\n\t<li>It is not liquid, as it would require extra heat to melt it before being applied to the Printed Circuit Board.<\/li>\r\n\t<li>PCB Assembly expertise is required for accurate solder deposition.<\/li>\r\n<\/ol>\r\n\r\n<h2>Differences Between Solder Mask and Paste Mask<\/h2>\r\n\r\n<p>Here are some essential differences between Solder Mask and Paste Mask on Printed Circuit Board:<\/p>\r\n\r\n<ul>\r\n\t<li>The hole openings on the solder mask layer have no mask ink. However, there are hole openings on the paste mask layer.<\/li>\r\n\t<li>Solder mask is applied during bare circuit board manufacturing, while paste mask is employed in PCB Assembly.<\/li>\r\n\t<li>Solder masks are available in different PCB colors, while paste masks are usually grey.<\/li>\r\n\t<li>The solder masks are part of the circuit board, while the paste mask is used in stencils.<\/li>\r\n\t<li>Application of ink is made by solder mask, while for paste mask, it applies solder paste on the circuit board.<\/li>\r\n<\/ul>\r\n\r\n<h2>Conclusion<\/h2>\r\n\r\n<p>Solder Mask are applied during PCB Manufacturing, preventing oxidation, rust, and dirt on your circuit board. However, Paste Masks are employed in PCB Assembly, which applies solder pastes on the circuit board to ensure permanent fixing of components on the circuit board.<\/p>\r\n\r\n<p>The solder and paste masks are essential to ensure printed circuit boards' longevity. Take note of these applications when you send your PCB designs to your PCB Manufacturer.<\/p>\r\n\r\n<p>However, NextPCB ensures no compromise on your circuit boards by applying solder and paste masks during PCB Manufacturing and Assembly process. Consider it your final stop for your PCB solutions as NextPCB engages you in a quality PCB service that brings your PCB designs to life.<\/p>\r\n","status":1,"create_time":1668062280,"update_time":1668062307,"clicks":10324,"hits":0,"custom_url":"solder-mask-vs-paste-mask-differences-and-functions","related":"","add_uid":111,"publish_uid":0,"attr":0,"type":0,"keywords":"solder mask, paste mask","comment_count":0,"share_count":0,"need_move":0,"c_time":"2022-11-10 14:38:00","u_time":"2025-06-27 16:31:45","comments_count":0,"is_like":0}">

Solder Mask Vs Paste Mask: Differences And Functions
Posted on November 10, 2022 by NextPCB
Solder Mask is an essential process of in PCB Manufacturing while Paste Mask are applied during PCB Assembly. Find out more.

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Tag: solder mask Solder Mask Paste Mask

Boolean equations or a Karnaugh map<\/a>. This programmable memory has enabled users with more flexibility in modifying chip functionality in the field.<\/p>\r\n\r\n<p>The man who introduced the first FPGA is Mr. Ross Freeman, an American inventor, electrical engineer and one of the official founders of Xilinx, now AMD Xilinx Inc. He worked as a Director of Engineering for the Components Division of a semiconductor manufacturing company.<\/p>\r\n\r\n<p>The company he used to work for did not fully support his concept of a new hardware-programmable device. Hence, along with his colleagues, they founded their own company, Xilinx, in February 1984 and released the very first FPGA, XC2064, the following year, 1985. It is still one of the leading key players in the FPGA industry to date.<\/p>\r\n\r\n<h2>FPGA and Technology<\/h2>\r\n\r\n<p>FPGAs are mainly used to design and test integrated circuits and electronic systems. The industry has revolutionized system design from the ground up by introducing programmable logic gates and configuration memory.<\/p>\r\n\r\n<p>Currently, FPGAs are the preferred way to build complex systems with complex designs. FPGA-based systems can be used for tasks that require <a href=https://www.nextpcb.com/"https:////www.nextpcb.com//news//why-does-nextpcb-make-a-highreliability-and-highsystem-board/">high performance or high reliability<\/a>, such as military and aerospace applications, or for highly demanding tasks, such as data mining, financial modelling, machine vision, speech recognition, artificial intelligence (AI), or bioinformatics.<\/p>\r\n\r\n<h3>How does FPGA impact your company?<\/h3>\r\n\r\n<p>Many companies utilize FPGA because of their ability to process data faster than traditional processors. Companies use it for a variety of different tasks, including:<\/p>\r\n\r\n<ul>\r\n\t<li>Increasing the speed of the data processing in an organization.<\/li>\r\n\t<li>Creating new applications and services that traditional processors are not able to do.<\/li>\r\n\t<li>Reducing the cost of processing data by using fewer resources than with conventional chips.<\/li>\r\n\t<li>Simplifying the development process by enabling developers to code in a high-level language rather than low-level machine code.<\/li>\r\n<\/ul>\r\n\r\n<h3>Problems addressed and solutions offered by the FPGA industry<\/h3>\r\n\r\n<p><strong>Flexibility:<\/strong> FPGAs provide an alternative to traditional hardware engineering techniques by allowing designers to implement any logical function without knowing the underlying hardware. It may be programmed and reprogrammed to meet current requirements, enabling you to offload resource-intensive operations to hardware, increasing its performance.<\/p>\r\n\r\n<p>Because the functionality is not in the module itself but in the configuration, using FPGA allows you to be independent of component providers. This may be coded so that it can be performed on various FPGAs without any modifications.<\/p>\r\n\r\n<p><strong>Efficiency:<\/strong> Standard components frequently trade performance and compatibility to reach the largest feasible user group. FPGAs enable the development of systems precisely tuned to the intended function and operate seamlessly.<\/p>\r\n\r\n<p>They are suited for use in time-sensitive systems. Unlike software-based solutions with real-time operating systems, FPGAs may provide clear indicators. Because of the flexibility, even complex computations may be completed in record time.<\/p>\r\n\r\n<p><strong>Timescale:<\/strong> FPGAs also enable designers to create systems with a much smaller time-to-market and less need for costly upfront design cycles.<\/p>\r\n\r\n<p>The usage of FPGA considerably speeds up prototyping since the design of the IP cores is part of hardware engineering. It is feasible to do tedious functions such as commissioning and troubleshooting alongside development.<\/p>\r\n\r\n<p><strong>Cost efficiency:<\/strong> FPGAs are more cost-effective than ASICs for some applications. For example, the cost of an FPGA is about 20% of that of an ASIC with similar performance. One reason is that the design process is less expensive with FPGA than with ASICs. Its manufacturing costs can be lower because no mask costs are involved in fabricating FPGAs.<\/p>\r\n\r\n<h2>Top 10 FPGA Companies in the World<\/h2>\r\n\r\n<p>The FPGA industry is a global market and has a presence in all countries and regions. Currently, these FPGA companies dominate the field, with Altera (now Intel) and Xilinx (AMD Xilinx) topping the list. These two companies are the pioneer and leading manufacturers in the FPGA industry, along with the other FPGA companies listed below.<\/p>\r\n\r\n<p><img alt=\"Top 5 FPGA Companies in the World\" src=https://www.nextpcb.com/"//uploads//images//202211//10//1668060201-5655-uHRmlx.png/" style=\"width: 640px; height: 464px;\" \/><\/p>\r\n\r\n<p> <\/p>\r\n\r\n<p>The Top 10 FPGA key players in the industry are the following:<\/p>\r\n\r\n<p><img alt=\"Top 5 FPGA Companies, Sales 2019\" src=https://www.nextpcb.com/"//uploads//images//202211//10//1668060257-7726-obPHDQ.png/" style=\"width: 800px; height: 275px;\" \/><\/p>\r\n\r\n<p> <\/p>\r\n\r\n<h3>1. AMD Xilinx, Inc. (Advanced Micro Devices, Inc.) (US)<\/h3>\r\n\r\n<p>The company is the pioneer and one of the most popular FPGA manufacturers worldwide. With AMD’s acquisition, they created the industry's high-performance and adaptive computing leader. Their main headquarters is in San Jose, California.<\/p>\r\n\r\n<p>AMD Xilinx provides a broad multi-node portfolio to meet the needs of a wide range of applications. They are known to cater to those who are into designing cutting-edge networking applications and to those who are into low-cost, small-footprint FPGAs.<\/p>\r\n\r\n<h3>2. Intel Corporation (US)<\/h3>\r\n\r\n<p>Intel completed the acquisition of Altera last December 2015. Altera has had a long-running design partnership with Intel since 1984, just a year after their company was founded. It is now an Intel business unit known as Programmable Solutions Group (PSG).<\/p>\r\n\r\n<p>Intel FPGAs provide a broad range of programmable embedded SRAM, high-speed transceivers, I\/Os, logic blocks, and routing. Their built-in intellectual property (IP), paired with great software tools, is renowned for reducing FPGA production time, power, and cost.<\/p>\r\n\r\n<h3>3. Microchip Technology Inc. (US)<\/h3>\r\n\r\n<p>Microchip Technology Inc. is a leading microcontroller and analog semiconductors provider for a broad range of customer applications worldwide. Their headquarters is in Chandler, Arizona, with offices in the US, Canada, Asia Pacific, the Middle East and Europe.<\/p>\r\n\r\n<p>The company provides FPGA for logic integration to customers that want high speed, security, and volume. To expedite the design and simplify development. They also offer pre-built solutions for Digital Signal Processing (DSP), Serializer\/Deserializer (SerDes), networking, microcontrollers (MCUs) and microprocessors (MPUs), and even analog blocks.<\/p>\r\n\r\n<h3>4. Lattice Semiconductor Corporation (US)<\/h3>\r\n\r\n<p>Lattice Semiconductor is an American semiconductor manufacturing company that designs and produces low-power, field programmable gate arrays (FPGA).<\/p>\r\n\r\n<p>Designers may use Lattice FPGA to accelerate innovation and save production time in a variety of applications, including communications, computation, automotive, and industrial.<\/p>\r\n\r\n<h3>5. Achronix Semiconductor Corporation (US)<\/h3>\r\n\r\n<p>The firm is an American fabless semiconductor company based in Santa Clara, California, with an additional R&D unit in Bangalore, India, and a sales office in Shenzhen, China.<br \/>\r\nAchronix Semiconductor provides high-performance FPGA solutions, embedded FPGA (eFPGA) products, system-level solutions, and supporting design tools.<\/p>\r\n\r\n<h3>6. QuickLogic Corporation (US)<\/h3>\r\n\r\n<p>QuickLogic is a fabless semiconductor firm. They build a full-stack platform for artificial intelligence (AI), speech, and sensor processing.<\/p>\r\n\r\n<p>The company develops a comprehensive artificial intelligence (AI), voice, and sensor processing platform. In addition to pASIC3 and QuickRAM FPGA families, they also offer programming hardware and design software. It also has an IP business that licenses its eFPGA technology to other companies for use in their SoCs.<\/p>\r\n\r\n<h3>7. Efinix, Inc. (US)<\/h3>\r\n\r\n<p>Efinix is a multinational company with offices in several countries. Their investors are a diverse group of high-tech semiconductor and system manufacturers that found value in the firm's Quantum architecture.<\/p>\r\n\r\n<p>They are one of the industry leaders in programmable platforms that accelerate advancements in artificial intelligence, edge computing, compute acceleration, and custom logic. The company’s key technology is the Quantum programmable fabric, which significantly improves Power-Performance-Area over conventional FPGAs. Efinix devices serve a wide array of applications, ranging from simple consumer items to I\/O-intensive interfaces to comprehensive system solutions.<\/p>\r\n\r\n<h3>8. Flex Logix Technologies, Inc. (US)<\/h3>\r\n\r\n<p>The company's EFLX-embedded FPGA IP allows any semiconductor design to adapt to changing protocols, standards, algorithms, and customer requirements. They also enable designers to construct reconfigurable accelerators that boost essential workloads 30-100 times faster than standard processors.<\/p>\r\n\r\n<h3>9. GOWIN Semiconductor Corporation (China)<\/h3>\r\n\r\n<p>The company was founded in 2014 and is located in China, aiming to expedite customer innovation through programmable solutions. They optimize items and eliminate limitations for PLD users. Their drive to technology and quality helps companies minimize costs by deploying FPGA on production boards. They provide programmable logic devices, design software, IP cores, reference designs, and development kits.<\/p>\r\n\r\n<h3>10. S2C (China)<strong> <\/strong><\/h3>\r\n\r\n<p>S2C is the worldwide field leader in FPGA prototype solutions for modern cutting-edge SoC\/ASIC designs. The company has successfully delivered quick SoC prototype solutions since 2004, with sales offices across the United States, Europe, Israel, China, Hong Kong, Korea, Japan, and Taiwan.<\/p>\r\n\r\n<h2><strong>FPGA Companies in Asia Pacific<\/strong><\/h2>\r\n\r\n<p>There are many FPGA manufacturers out there, and they usually have a regional focus. The Asia Pacific has the largest FPGA market share and will still be in the years to come. The most significant contributor to this is the rise of 5G telecommunication network deployment and the expansion of hyperscale and cloud data centers in the Asia Pacific region.<\/p>\r\n\r\n<p>One particular country in the region, China, manufactures and uses FPGAs across the country. It has more than 290<a href=https://www.nextpcb.com/"https:////www.globenewswire.com//news-release//2022//10//11//2532158//0//en//The-FPGA-market-is-projected-to-grow-from-USD-8-0-billion-in-2022-and-is-projected-to-reach-USD-15-5-billion-by-2027-it-is-expected-to-grow-at-a-CAGR-of-14-2-from-2022-to-2027.html/"> semiconductor wafer fabrication, IC testing, and packaging plants. These facilities have various equipment with integrated FPGAs to improve functionality, thus, reducing time and development costs.<\/p>\r\n\r\n<p>Also, China’s number one ranking in motor vehicle production in the region has a significant role in the growth of the FPGA industry. The increase of applications in the automotive field, like networking and connectivity systems, infotainment and the wider use of e-vehicles and charging stations deployment added and opened more opportunities in the field.<\/p>\r\n\r\n<p>Asia Pacific region holds the largest FPGA market share from 2022 to 2027. It is likely to dominate the field throughout this period.<\/p>\r\n\r\n<p>The historical report and forecast in the Asia Pacific region below:<\/p>\r\n\r\n<p><img alt=\"Asia Pacific FPGA Market Size, by Region\" src=https://www.nextpcb.com/"//uploads//images//202211//10//1668060482-1853-tXRNFL.png/" style=\"width: 590px; height: 348px;\" \/><\/p>\r\n\r\n<p><img alt=\"FPGA Market Size, by Configuration\" src=https://www.nextpcb.com/"//uploads//images//202211//10//1668060515-4558-dYbDpe.png/" style=\"width: 590px; height: 307px;\" \/><\/p>\r\n\r\n<p><img alt=\" FPGA Market Size, by Application\" src=https://www.nextpcb.com/"//uploads//images//202211//10//1668060555-6225-QPFflc.png/" style=\"width: 590px; height: 343px;\" \/><\/p>\r\n\r\n<h2>What Makes a Good FPGA Company?<\/h2>\r\n\r\n<p>There are many FPGA companies in the field, but it can be challenging to find a good one. Before investing in an FPGA company, it is essential to consider which criteria are most important, as one company may be much better for specific projects than another.<\/p>\r\n\r\n<p>It is important that all agreed plans are feasible and will be executed effectively. It may be advantageous to investigate the company's financial statements before investing. You should also determine if the company has sufficient resources and a management team with experience in innovation for advancing and boosting your product.<\/p>\r\n\r\n<h3>How to find good FPGA companies?<\/h3>\r\n\r\n<p>There are many different things to consider when looking for good FPGA companies. Here are some metrics you should consider once you are ready to dive into the great possibilities of FPGA.<\/p>\r\n\r\n<h4>Product offer:<\/h4>\r\n\r\n<p>Vendor products may seem identical, but if you examine the various FPGA product offerings from different vendors, you will see the difference. Some FPGA companies have additional clock signals or specific blocks that might give you an advantage. Certain FPGAs are better designed for a high-speed interface; hence, analyzing your FPGA needs and categorizing them is crucial.<\/p>\r\n\r\n<h4>Product performance:<\/h4>\r\n\r\n<p>Look for FPGA companies that offer fast and reliable products, especially when you need to purchase in bulk without compromising the quality.<\/p>\r\n\r\n<h4>Quality assurance:<\/h4>\r\n\r\n<p>Find a company that offers quality assurance with highly skilled employees who are experts in their fields and with the latest technologies. Some vendors have a local representative and support team that may assist you with your design. A competent and supportive representative may help you speed up your design timetable.<\/p>\r\n\r\n<h4>Support:<\/h4>\r\n\r\n<p>It would also help to look for a company that provides technical support to its customers. The company should have a dedicated customer service team available to offer instant assistance in case of emergencies.<\/p>\r\n\r\n<h4>Warranty:<\/h4>\r\n\r\n<p>Filter FPGA companies that offer warranties on their products and services, as it will help ensure years of smooth and safe operation.<\/p>\r\n\r\n<h4>Price:<\/h4>\r\n\r\n<p>Cost is most likely a major consideration in your decision-making process. FPGA costs are mostly available and published online. The price of the chips varies by FPGA companies and the type of chip itself. Some FPGA chips cost more than $1 million, while others might be as low as $50.<br \/>\r\nYou should always look for a company that offers competitive pricing and is willing to work with your budget. A company that offers honest pricing, which means you will know the total cost of their services right from the very start. You may try to haggle and strike a deal that fits your budget.<\/p>\r\n\r\n<h2><strong>FPGA Market Size Estimation<\/strong><\/h2>\r\n\r\n<p>The FPGA market size surpassed USD 6 billion in 2021, and industry experts project it to expand at a CAGR of over 12% from 2022 to 2028. Increasing adoption of artificial intelligence (AI) and machine learning (ML) technologies for edge computing applications in data centers is driving FPGA expansion.<\/p>\r\n\r\n<h2><strong>FPGA Market Scope<\/strong><\/h2>\r\n\r\n<p>You can find FPGAs in a wide range of industries, just about everywhere, from medicine to defense.<\/p>\r\n\r\n<p>FPGAs play a key role in 5G networks since they provide the increased flexibility and efficiency needed to address the rising and constantly changing demand for 5G wireless connectivity.<\/p>\r\n\r\n<p>With FPGA's programmable nature, they suit best in a variety of sectors across the globe. Below is a list of the<a href=https://www.nextpcb.com/"https:////www.xilinx.com//products//silicon-devices//fpga//what-is-an-fpga.html/"> application<\/a> in different business segments.<\/p>\r\n\r\n<p><img alt=\"FPGA Consumption Market-Global Outlook\" src=https://www.nextpcb.com/"//uploads//images//202211//10//1668060778-5444-BKfOEF.jpg/" style=\"width: 800px; height: 450px;\" \/><\/p>\r\n\r\n<h3><strong>Where are FPGAs found in the world?<\/strong><\/h3>\r\n\r\n<ul>\r\n\t<li><b>Aerospace and Defense<\/b> - Radiation-tolerant FPGAs and intellectual property for image processing, waveform synthesis, and partial reconfiguration of SDRs. Avionics, Missiles and Munition, Radars and Sensors, etc.<\/li>\r\n\t<li><b>ASIC Prototyping<\/b> - FPGAs enable fast and accurate SoC system modelling and verification of embedded software.<\/li>\r\n\t<li><b>Automotive<\/b> - Advance Driver Assistance System (ADAS), Automated Driving, Electrification and Networking Automotive silicon and IP solutions for gateways and driver assistance and information systems, comfort, convenience, and in-vehicle infotainment.<\/li>\r\n\t<li><b>Broadcast and Pro AV<\/b> - FPGAs can adapt to the changing requirements faster and lengthen product life cycles associated with the platforms and solutions for high-end professional broadcast systems.<\/li>\r\n\t<li><b>Consumer Electronics<\/b> - A cost-effective solution that enables next-generation applications, like converged handsets, digital flat panel displays, appliances, home networking, and set-top boxes.<\/li>\r\n\t<li><b>Data Center<\/b> - Designed for high-bandwidth, low-latency servers, networking, and storage applications for higher-value cloud deployments and hardware acceleration.<\/li>\r\n\t<li><b>High-Performance Computing and Data Storage<\/b> - Offering solutions for Network Attached Storage, Storage Area Network, servers, and storage appliances.<\/li>\r\n\t<li><b>Industrial<\/b> - Industrial imaging, surveillance, automation, and medical imaging equipment. Video surveillance systems, machine vision solutions, industrial networking solutions, industrial motor control solutions, and robotics, among others.<\/li>\r\n\t<li><b>Medical -<\/b> FPGA helps meet various requirements for diagnostic, monitoring, and therapy applications, wearable devices,  and Imaging Diagnostic Systems such as ultrasound machines, CT scanners, MRI machines, X-Ray machines and more.<\/li>\r\n\t<li><b>Security<\/b> - From access control to surveillance and safety systems.<\/li>\r\n\t<li><b>Video & Image Processing -<\/b> Offering higher degrees of flexibility, faster time-to-market, and lower overall non-recurring engineering costs for a wide range of video and imaging applications.<\/li>\r\n\t<li><b>Wired Communications<\/b> - End-to-end solutions for the Reprogrammable Networking Linecard Packet Processing, Framer\/MAC, serial backplanes, etc.<\/li>\r\n\t<li><b>Wireless Communications<\/b> - RF, baseband, connectivity, transport and networking solutions for wireless equipment, addressing standards such as WCDMA, HSDPA, WiMAX, etc.<\/li>\r\n<\/ul>\r\n\r\n<h3><strong>What is the demand for FPGA?<\/strong><\/h3>\r\n\r\n<p>The FPGA industry is now growing in terms of product sophistication, as they can help accelerate the performance of a system. They are used primarily in embedded systems and are now gaining popularity in data centers.<\/p>\r\n\r\n<p>Demand for FPGA components surged in the latter half of 2021 as industrial activity expanded and the usage of telecommunications, automotive goods, data centers, and electronic gadgets increased. In addition, many companies are focusing on setting up factories in new geographical regions to reduce the risk associated with supply chain disruptions in the event of a crisis; think about what happened at the height of the COVID-19 pandemic.<\/p>\r\n\r\n<p>Currently, there is a significant skill shortage in this field, and the trend of future development is highly promising. Because FPGAs are employed in various companies in different sectors, the growing industry has a greater demand for competent engineers for a variety of market segments, including telecommunications, automotive, products, industrial, military and aerospace, and data processing.<\/p>\r\n\r\n<p>It is a good idea to take advantage of this while the industry is still not saturated. Notably, future technological and industrial development trends are more crucial than this status quo. The potential of FPGAs is still underestimated, looking from the standpoint of industrial development trends, and there is more work and advancements in the future.<\/p>\r\n\r\n<h2>Looking Towards the Future of the FPGA Market<\/h2>\r\n\r\n<h3>What is the future of FPGA?<\/h3>\r\n\r\n<p>The future of FPGA technology is looking very promising. With the new advances in tailored-made models and algorithms, we can expect FPGAs to provide better performance than other platforms. Notably, the present development trend of artificial intelligence algorithm models goes from training to inference, which is ideal for the future development of FPGAs.<\/p>\r\n\r\n<p>We can also expect FPGA to play a central role in military and aerospace applications. In addition, the use of FPGAs in oil and gas is growing at a rapid pace.<\/p>\r\n\r\n<h3>What are the changes in technology?<\/h3>\r\n\r\n<p>FPGA technology has been gaining a following and demand due to the several advantages it provides. They are practical in the long term and work with many design paradigms, including digital, analog, mixed-signal, and others.<\/p>\r\n\r\n<p>We can expect the industry to grow steadily in the coming years as pressure from the ASIC leads to a return to FPGA technology. eFPGA technology is generic and works like an off-the-shelf FPGA chip bringing logic reconfigurability to ASIC and SoC.<\/p>\r\n\r\n<p>Algorithms for artificial intelligence are rapidly and constantly changing. While ASIC chips provide the highest performance in terms of utilization, speed, and low power consumption, AISC development is risky. A big market is necessary to ensure cost-effective prices, in addition to the duration process from R&D to market that is so long, that it is unviable for areas where algorithms rapidly evolve. Because of the cost and risk associated with ASIC chips, only a few companies, like Google, are willing to take the risk.<\/p>\r\n\r\n<h3>What is the future of the FPGA market in Asia Pacific and worldwide?<\/h3>\r\n\r\n<p>With the rising telecom infrastructure development in Asia Pacific and Africa, we can expect the demand for FPGAs to grow. Key players in the industry are investing in technological advancements, consequently driving market growth.<\/p>\r\n\r\n<p>We also see the FPGA security market reach US$ 1,573.6 million by 2027 from US$ 736.8 million in 2019. Reports show an estimated compound annual growth rate of 11.4%; hence, we are expecting the field programmable gate array share to reach USD 25.85 billion by 2030, with an average CAGR of 11.2% from 2020 to 2030.<\/p>\r\n\r\n<p>We will witness significant growth in the region, owing to the rising adoption of FPGAs in various applications, such as electronics, automotive, aerospace and defense, and industrial. Moreover, the increasing number of data centers and cloud service providers in the region will likely drive the demand for FPGAs.<\/p>\r\n\r\n<h1>Conclusion<\/h1>\r\n\r\n<p>FPGA, or Field Programmable Gate Array, is very popular in the market these days. It offers a high-performance processing chip that you can configure after manufacturing to accelerate the performance of software applications. You can program them to perform tasks that need high performance or reliability for different industries. These may include computer graphics, industrial automation, military systems, medical devices and equipment, electronics, robotics, aerospace, communications networks, wireless technologies, etc.<\/p>\r\n\r\n<p>FPGA companies are a key part of the semiconductor industry and have a significant impact on the computing industry. Knowing more about the top 10 industry players and learning what brought them to their current market standing gives you an idea of what makes a reputable FPGA company.<\/p>\r\n\r\n<p>You may use those metrics once you are ready to explore the<a href=https://www.nextpcb.com/"https:////www.nextpcb.com//blog//how-to-choose-the-right-fpga/"> exciting possibilities that FPGAs provide<\/a>. As the FPGA technology industry grows, you may see great potential in other industry players. <\/p>\r\n\r\n<p>The metrics discussed earlier should also help you gauge whether such a company is truly promising or just merely making empty promises. Areas to consider before you choose an FPGA manufacturer is their financial standing, their resources and management team, product delivery, price and quality, customer service and sales support and warranty\/guarantee. <\/p>\r\n\r\n<p>Moving forward, expect Asia Pacific to be a key market for the growth of the FPGA industry due to the emergence of innovative FPGA based products and the growing demand for electronics. We expect it to grow notably in the future years due to the rising telecom infrastructure development in the region. A number of APAC countries are investing heavily in the telecom sector, thereby driving the demand for FPGAs. Furthermore, the presence of key industry players and technological advancements are also fueling FPGA growth.<\/p>\r\n","status":1,"create_time":1668060888,"update_time":1668060911,"clicks":13280,"hits":0,"custom_url":"top-10-fpga-companies-in-the-world","related":"","add_uid":111,"publish_uid":0,"attr":0,"type":0,"keywords":"fpga companies","comment_count":0,"share_count":0,"need_move":0,"c_time":"2022-11-10 14:14:48","u_time":"2025-06-27 15:09:09","comments_count":0,"is_like":0}">

Top 10 FPGA Companies in the World - NextPCB
Posted on November 10, 2022 by NextPCB
Top 10 FPGA companies in the world. Know more about FPGA market scope, demand, analysis, and more. Find reputable FPGA manufacturers.

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Tag: FPGA

standard of UL94V-0<\/a>. Hence, FR-1 is a flame-retardant material that does not catch fire easily and extinguishes the fire itself. The flame retardancy of FR-1 material makes it suitable for consumer electronics such as chargers, adapters and other home appliances.<\/p>\r\n\r\n<h3><b>Low-Cost Material<\/b><\/h3>\r\n\r\n<p>FR-1 is a low-cost material with good electrical specifications that meet industry standards while aiding the budget. Further, FR-1, due to its electrical properties and low price, is the first choice of PCB engineers for single-layer PCBs.<\/p>\r\n\r\n<h3><b>Good Glass Transition Temperature Tg of FR-1<\/b><\/h3>\r\n\r\n<p>FR-1 provides a glass transition value of 130C, which is not soo high and, of course, less than the glass transition value of FR-4 (150C to 170C). Firstly, the transition temperature of a PCB base material defines the temperature at which the PCB starts getting soft and losing its shape. But still, with a lower Tg than FR-4, FR-1 provides exceptional performance in his applications. The applications of FR-1 PCB material are not complex a lot. Hence, a glass transition temperature of 130C is enough to meet the criteria of its applications.<\/p>\r\n\r\n<h3><b>Mechanical Strength of FR- 1<\/b><\/h3>\r\n\r\n<p>FR-1 PCB material is a combination of paper and epoxy. Thus it provides high mechanical strength to the circuit board and makes the PCB withstand the load of components. The mechanical strength of FR-1 is somewhere near the mechanical strength of FR-4.<\/p>\r\n\r\n<h3><b>Environmentally Friendly PCB Material<\/b><\/h3>\r\n\r\n<p>FR-1 does not contain elements of the halogen group or any other harmful material. Hence, not only FR-1 but the whole family of Flame-Retardant materials are eco-friendly and do not produce toxic material or gas during operation.<\/p>\r\n\r\n<h2><b>What are the Drawbacks of FR-1 PCB?<\/b><\/h2>\r\n\r\n<p>Every matter present in the universe, along with its benefits, has some drawbacks; that may limit its use but never question its reliability and performance in the right places. The widely used PCB material FR-1 also has some disadvantages and limitations that restrict its use for some specific applications.<\/p>\r\n\r\n<p>To understand the FR-1 PCB specifications and their behaviour deeply. It is significant to pay attention to its limitations. So, let's have a look at the drawbacks of FR-1 PCB material.<\/p>\r\n\r\n<h3><b>Lower Temperature Resistance<\/b><\/h3>\r\n\r\n<p>FR-1 is not a good base material for circuit boards that produce ample heat during operation and require high-temperature resistance. As stated above, the Glass transition temperature value of FR-1 PCB material is 130C. Hence, if the device generates a lot of heat, gradually, the PCB will start losing its shape and experience electrical and physical damage.<\/p>\r\n\r\n<h3><b>Lower Dissipation Factor (Signal Loss)<\/b><\/h3>\r\n\r\n<p>The higher dissipation factor of FR-1 material makes it unsuitable for high-frequency and high-speed applications. Due to the higher dissipation factor, the circuit board experience higher signal loss. That is why the manufacturers do not recommend FR-1 for complex electronic circuit boards that require specific undisturbed inputs to produce accurate outputs.<\/p>\r\n\r\n<h3><b>Poor Moisture Resistance<\/b><\/h3>\r\n\r\n<p>FR-1 PCB material has poor moisture resistance, at high-humidity areas, it absorbs a sufficient amount of water, enough to make it swell. Hence, FR-1 material is not a good option for devices that work in highly humid areas. FR-1 is also not a suitable material for marine applications.<\/p>\r\n\r\n<h3><b>Precise Calculation<\/b><\/h3>\r\n\r\n<p>FR-1 dielectric PCB material has some operating limitations. Hence, FR-1 requires a precise calculation of the maximum electrical properties the circuit board will operate. If the voltage, power or heat of the circuit board exceeds the limit of FR-1 PCB material, the material will face a dielectric breakdown. Due to the dielectric breakdown, FR-1 will initiate to lose its insulating properties. Hence, it will begin performing as a conductor instead of an insulator. To avoid such a disaster in a circuit, it is crucial to precisely calculate the values; the PCB will be operating.<\/p>\r\n\r\n<h2><b>Application of FR-1 PCB<\/b><\/h2>\r\n\r\n<p>FR-1 PCB material is a blend of two materials, paper and phenol-formaldehyde resin. The FR-1 is available in thin dielectric plates coated with copper, known as PCB laminates, used to insulate copper layers from each other and provide mechanical strength and shape to the circuit board.<\/p>\r\n\r\n<p>When it comes to the applications of FR-1 PCB material, it has several uses in different domains. The mass producers of PCB emphasize FR-1 for single-layer circuit boards. Mainly FR-1 has applications in portable consumer electronics, such as adapters, chargers and some other, not soo complex devices. FR-1 may also use in industries like automobiles, medicine and telecommunication.<\/p>\r\n\r\n<h2><b>The Difference Between FR-1, FR-2, FR-3, FR-4<\/b><\/h2>\r\n\r\n<p>FR-1, FR-2, FR-3 and FR-4 all come under <b>Flame-Retardent<\/b> <a href=https://www.nextpcb.com/"https:////www.nema.org///">NEMA-graded materials. All four are significant PCB dielectric materials with good electrical specifications. The family members of Flame Retardent material have different specifications, which proves them better than each other for specific applications. Hence, we should know the differences between these materials to pick the best possible material for our project. To ease your learning about the family of flame-retardent material, NextPCB provides a chart that significantly covers basic to advance knowledge about all four materials.<\/p>\r\n\r\n<h3><strong>A Comprehensive Chart to Describe the Difference between<\/strong> <strong>FR-1, FR-2, FR-3 and FR-4 PCB Material<\/strong><\/h3>\r\n\r\n<table>\r\n\t<tbody>\r\n\t\t<tr>\r\n\t\t\t<td> <\/td>\r\n\t\t\t<td>\r\n\t\t\t<h4><b>Property<\/b><\/h4>\r\n\t\t\t<\/td>\r\n\t\t\t<td><b>FR-1<\/b><\/td>\r\n\t\t\t<td><b>FR-2<\/b><\/td>\r\n\t\t\t<td><b>FR-3<\/b><\/td>\r\n\t\t\t<td><b>FR-4<\/b><\/td>\r\n\t\t<\/tr>\r\n\t\t<tr>\r\n\t\t\t<td>1.<\/td>\r\n\t\t\t<td>\r\n\t\t\t<h4><b>Material<\/b><\/h4>\r\n\t\t\t<\/td>\r\n\t\t\t<td>Paper and phenol-formaldehyde resin.<\/td>\r\n\t\t\t<td>Paper impregnated with a plasticized phenol formaldehyde resin.<\/td>\r\n\t\t\t<td>Cotton linter\/alpha cellulose paper impregnated with epoxy resin formulation.<\/td>\r\n\t\t\t<td>Woven \/ Unwoven fibre-glass cloth impregnated with epoxy resin.<\/td>\r\n\t\t<\/tr>\r\n\t\t<tr>\r\n\t\t\t<td>2.<\/td>\r\n\t\t\t<td>\r\n\t\t\t<h4><b>Glass Transition Temperature<\/b><\/h4>\r\n\t\t\t<\/td>\r\n\t\t\t<td>130C<\/td>\r\n\t\t\t<td>130C<\/td>\r\n\t\t\t<td>130C<\/td>\r\n\t\t\t<td>140 to 170C<\/td>\r\n\t\t<\/tr>\r\n\t\t<tr>\r\n\t\t\t<td>3.<\/td>\r\n\t\t\t<td>\r\n\t\t\t<h4><b>Co-efficient of Thermal Expansion<\/b><\/h4>\r\n\t\t\t<\/td>\r\n\t\t\t<td> <\/td>\r\n\t\t\t<td> <\/td>\r\n\t\t\t<td> <\/td>\r\n\t\t\t<td>2.5 to 3.8%<\/td>\r\n\t\t<\/tr>\r\n\t\t<tr>\r\n\t\t\t<td>4.<\/td>\r\n\t\t\t<td>\r\n\t\t\t<h4><b>Decomposition Temperature <\/b><\/h4>\r\n\t\t\t<\/td>\r\n\t\t\t<td> <\/td>\r\n\t\t\t<td> <\/td>\r\n\t\t\t<td> <\/td>\r\n\t\t\t<td>>345C<\/td>\r\n\t\t<\/tr>\r\n\t\t<tr>\r\n\t\t\t<td>5.<\/td>\r\n\t\t\t<td>\r\n\t\t\t<h4><b>Dielectric Strength<\/b><\/h4>\r\n\t\t\t<\/td>\r\n\t\t\t<td> <\/td>\r\n\t\t\t<td>740V<\/td>\r\n\t\t\t<td> <\/td>\r\n\t\t\t<td>800 to 900V<\/td>\r\n\t\t<\/tr>\r\n\t\t<tr>\r\n\t\t\t<td>6.<\/td>\r\n\t\t\t<td>\r\n\t\t\t<h4><b>Dielectric Constant or relative permittivity<\/b><\/h4>\r\n\t\t\t<\/td>\r\n\t\t\t<td>4.0~5.0<\/td>\r\n\t\t\t<td>4.5<\/td>\r\n\t\t\t<td> <\/td>\r\n\t\t\t<td>4.25 to 4.55<\/td>\r\n\t\t<\/tr>\r\n\t\t<tr>\r\n\t\t\t<td>7.<\/td>\r\n\t\t\t<td>\r\n\t\t\t<h4><b>Dissipation Factor<\/b><\/h4>\r\n\t\t\t<\/td>\r\n\t\t\t<td> <\/td>\r\n\t\t\t<td>0.024–0.26 <\/td>\r\n\t\t\t<td> <\/td>\r\n\t\t\t<td>0.016<\/td>\r\n\t\t<\/tr>\r\n\t\t<tr>\r\n\t\t\t<td>8.<\/td>\r\n\t\t\t<td>\r\n\t\t\t<h4><b>Water Resistance<\/b><\/h4>\r\n\t\t\t<\/td>\r\n\t\t\t<td>Low  -Not suitable for highly humid areas.<\/td>\r\n\t\t\t<td>Fair  - Appropriate for standard humid areas.<\/td>\r\n\t\t\t<td>Medium  -Appropriate for highly humid areas.<\/td>\r\n\t\t\t<td>High  -Surely suitable for marine applications and highly humid areas.<\/td>\r\n\t\t<\/tr>\r\n\t\t<tr>\r\n\t\t\t<td>9. <\/td>\r\n\t\t\t<td>\r\n\t\t\t<h4><b>Chemical Resistance<\/b><\/h4>\r\n\t\t\t<\/td>\r\n\t\t\t<td>Low<\/td>\r\n\t\t\t<td>Low<\/td>\r\n\t\t\t<td>Medium<\/td>\r\n\t\t\t<td>High<\/td>\r\n\t\t<\/tr>\r\n\t\t<tr>\r\n\t\t\t<td>10.<\/td>\r\n\t\t\t<td>\r\n\t\t\t<h4><b>Suitability for Single-layer PCB<\/b><\/h4>\r\n\t\t\t<\/td>\r\n\t\t\t<td>Recommended –due to its low price and good electrical properties.<\/td>\r\n\t\t\t<td>Recommended –due to its low price and good electrical properties.<\/td>\r\n\t\t\t<td>Yes<\/td>\r\n\t\t\t<td>Yes  -but quite expensive. Because if there are no specific requirements the FR-1 can perform the same function at much lower prices. <\/td>\r\n\t\t<\/tr>\r\n\t\t<tr>\r\n\t\t\t<td>11.<\/td>\r\n\t\t\t<td>\r\n\t\t\t<h4><b>Suitability For double-layer PCB<\/b><\/h4>\r\n\t\t\t<\/td>\r\n\t\t\t<td>Fair<\/td>\r\n\t\t\t<td>Fair<\/td>\r\n\t\t\t<td>Yes<\/td>\r\n\t\t\t<td>Recommended –due to its low price compared to PTEF & Rogers and good electrical properties.<\/td>\r\n\t\t<\/tr>\r\n\t\t<tr>\r\n\t\t\t<td>12.<\/td>\r\n\t\t\t<td>\r\n\t\t\t<h4><b>Suitability For Multi-layer PCB<\/b><\/h4>\r\n\t\t\t<\/td>\r\n\t\t\t<td>No<\/td>\r\n\t\t\t<td>No<\/td>\r\n\t\t\t<td>Yes<\/td>\r\n\t\t\t<td>Recommended –due to its low price compared to PTEF & Rogers and good electrical properties.<\/td>\r\n\t\t<\/tr>\r\n\t\t<tr>\r\n\t\t\t<td>13.<\/td>\r\n\t\t\t<td>\r\n\t\t\t<h4><b>Suitability for high-frequency PCBs<\/b><\/h4>\r\n\t\t\t<\/td>\r\n\t\t\t<td>No<\/td>\r\n\t\t\t<td>Fair<\/td>\r\n\t\t\t<td>Fair<\/td>\r\n\t\t\t<td>Yes<\/td>\r\n\t\t<\/tr>\r\n\t\t<tr>\r\n\t\t\t<td>14.<\/td>\r\n\t\t\t<td>\r\n\t\t\t<h4><b>Level of Complexity while Working with the Material<\/b><\/h4>\r\n\t\t\t<\/td>\r\n\t\t\t<td>Low\/Easy<\/td>\r\n\t\t\t<td>Hard\/Complex<\/td>\r\n\t\t\t<td> <\/td>\r\n\t\t\t<td>Low\/Easy<\/td>\r\n\t\t<\/tr>\r\n\t<\/tbody>\r\n<\/table>\r\n\r\n<p> <\/p>\r\n\r\n<p><b>A Comprehensive Understanding of the Difference Between FR-1, FR-2, FR-3 and FR-4<\/b><\/p>\r\n\r\n<p>FR-1, FR-2, and FR-3 all provide good properties and have wide applications in different industries. However, FR-4 is the most commonly used PCB substrate. The exceptional properties of FR-4 support its hype in the market. The PCB producers certainly like to stick with FR-4 for multi-layer and complex circuit boards. But, when it comes to single-layer PCBs, they emphasize FR-1 due to its low cost and ease of handling.<\/p>\r\n\r\n<p>The substrate selection for the PCB might be difficult. But it is crucial to identify an appropriate material for the circuit, as the properties of the PCB base material affect the performance of the circuit board. For example, if a circuit operates high-frequency or high-speed signals, it will need a substrate with a lower dissipation factor to minimize signal loss during signal transmission. So in such a case, if we use any other material rather than a substrate with a lower dissipation factor, we will lose on quality. Hence, it is mandatory to identify the requirements of the circuit and the properties of different substrates before selecting the base material for the PCB. <\/p>\r\n\r\n<p>NextPCB hopes that its provided information will certainly help you understand the difference between the different members of the family of Flame-Retardent material and will influence your selection of substrate for good.<\/p>\r\n\r\n<p>Related: <a href=https://www.nextpcb.com/"https:////www.nextpcb.com//blog//guide-to-fr-4-printed-circuit-board-material-nextpcb/">An Ultimate Guide to FR-4 PCB material<\/a><\/p>\r\n\r\n<h2><b>NextPCB: The Best FR-1 PCB Manufacturer around the Globe<\/b><\/h2>\r\n\r\n<p>NextPCB has been providing PCB manufacturing, testing and assembling services for more than 15 years. For so long, we have been serving the industry; we know how to work with different substrates and implement unique PCB design technologies.<\/p>\r\n\r\n<p>FR-1 and FR-2 PCBs are complex and require skilful labour during manufacturing. We at NextPCB ensure that each PCB fabricate under the supervision of skilled labour and go through several automatic and manual tests because it is necessary to provide outstanding high-quality FR-1 and FR-2 PCBs.<\/p>\r\n\r\n<p>Along with PCB manufacturing, NextPCB offers component sourcing services. To avail our PCB manufacturing services and experience maximum customer support, <a href=https://www.nextpcb.com/"https:////www.nextpcb.com//pcb-quote/">please contact us with your queries<\/a>.<\/p>\r\n\r\n<h2><b>Conclusion<\/b><\/h2>\r\n\r\n<p>FR-1 PCB material is a member of the flame retardant family, with good electrical and mechanical properties. The sharp end of FR-1 is that it is cheaper than FR-4, and over time it has proven perfect for single-layer PCBs. That is why FR-1 is the first choice of PCB producers for simple and single-layer printed circuit boards.<\/p>\r\n\r\n<p>However, FR-1 is a productive substrate, but the fact is that it is not appropriate for every type of circuit. High-frequency, high-speed or complex circuit designs require more critical and keen electrical values, which surely FR-1 fails to provide.<\/p>\r\n","status":1,"create_time":1667550794,"update_time":1667550998,"clicks":14010,"hits":1,"custom_url":"fr-1-pcb","related":"","add_uid":111,"publish_uid":0,"attr":0,"type":0,"keywords":"FR-1 PCB","comment_count":0,"share_count":0,"need_move":0,"c_time":"2022-11-04 16:33:14","u_time":"2025-06-27 16:36:32","comments_count":0,"is_like":0}">

FR-1 PCB | Difference Between FR-1, FR-2, FR-3 and FR-4 PCB
Posted on November 04, 2022 by NextPCB
FR-1 PCB material is a member of the flame retardant family, with good electrical and mechanical properties.

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Tag: FR PCB FR-1 PCB

A Guide to Printed Circuit Board (PCB) Material
Posted on June 19, 2025 by NextPCB
The PCB materials and other properties for your design will always depend on the application, the material must match the application and be carefully selected to operate in all expected conditions.

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Tag: PCB Material

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