PCB Manufacturer & PCB Assembly

Power line and ground wire processing technology in PCB

Posted on March 28, 2019 by G

In the PCB layout, the handling of the power and ground wires is very important. The noise interference generated by the power cables and ground wires should be minimized to ensure the quality of the products.

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PCB layout three special routing skills

Posted on March 28, 2019 by G

1. Right angle routing (three aspects) 2. Differential traces ("equal length, equidistant, reference plane") 3. Serpentine line (adjustment delay)

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Summary of Multilayer Board (BUM-PCB)

Posted on March 20, 2019 by G

As early as the 1970s, there was already a literature report on BUM technology, but it was not until the early 1990s that the Japanese company (Yasu) developed a coating of photosensitive resin on the core board to form conductive micropores by photo-induced method. Even after the new method of manufacturing a high-density circuit board by the new method of addition, the high-density circuit board was successfully used in a Thinkpad type notebook computer, and the new technology was first published in 1991. It is called Surface Laminar Circuit, SLC (Surface Laminated Circuit Board). Since this technology has created an unprecedented high-density Interconnect, HDI (High-density Interconnect) new ideas, Japanese electronics manufacturers have developed and unveiled The BUM era in the history of PCB development.

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Introduction of high-density HDI circuit boards and circuit boards

Posted on March 20, 2019 by G

Since the printed circuit board is not a general end product, the definition of the name is slightly confusing. For example, the motherboard for the personal computer is called the motherboard and cannot be directly called the circuit board. Although there is a circuit board in the motherboard, It's not the same, so when you evaluate the industry, you can't say the same thing. For example, because there are integrated circuit parts on the board, the news media called him an IC board, but in fact he is not equivalent to a printed circuit board.

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The role and location of characteristic impedance in signal integrity

Posted on March 13, 2019 by G

When the signal propagates on the transmission line, the transient impedance sensed by the signal is related to the capacitance per unit length and the dielectric constant of the material.

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Fast Positioning of Signal Integrity Problems in High Speed Circuit Design

Posted on March 13, 2019 by G

In high-speed circuit design, the traditional approach to locating signal integrity problems is to use hardware triggers to isolate events and/or to capture events using deep acquisition storage techniques before looking for problems. As the speed and complexity of high-performance circuit systems continue to increase, the limitations of using oscilloscopes to locate signal integrity problems are becoming more prominent.

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Signal Integrity Analysis in High Speed Circuit Design

Posted on March 13, 2019 by G

Modern digital circuits can be up to GHz and rise time is within 50ps. At such a rate, the negligence on the PCB design trace is even one foot, and the resulting voltage, delay and interface problems will not only be limited to this line, but will also affect the entire board and Adjacent boards.

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EMI interference: conduction is the culprit

Posted on March 08, 2019 by G

Radiated EMI interference can come from an undirected source and an unintentional antenna. Conductive EMI interference can also come from a source of radiated EMI interference or caused by some board components. Once your board receives conductive interference, it resides in the PCB trace of the application circuit. Some common sources of radiated EMI interference include the components discussed in previous articles, as well as on-board switching power supplies, cables and switches, or clock networks.

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Correct differential pair routing method in Altium 9

Posted on March 06, 2019 by G

How to define differential pairs in the schematic

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How to make your PCB design better

Posted on March 06, 2019 by G

Many people think that the work of PCB Layout is very boring. Every day, thousands of wires are routed to the board, and various packages are repeated, and the work of pulling the wires is repeated. However, designers must make trade-offs between various design rules, taking into account performance, cost, process and other aspects, but also notice that the layout of the board is neat and tidy, not as simple as it seems, and requires more wisdom. Let's talk about developing some good work habits during design, which will make your design more reasonable, easier to produce, and better.

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How to deal with the interference of circuit board parasitic components on circuit performance

Posted on March 05, 2019 by G

The main parasitic components generated by board layout are resistors, capacitors, and inductors. When switching from a circuit diagram to an actual board, all parasitic components have a chance to interfere with circuit performance. When a system mixes digital and analog components, careful routing is key to the success of the board. In particular, digital traces that are often close to high-impedance analog traces will cause severe coupling noise, which can only be avoided by keeping the two traces at a distance. This article quantifies the toughest board parasitic components, board capacitors, and lists the performance examples that can be clearly seen on the board.

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What is the reduction in noise and electromagnetic interference in PCB design?

Posted on March 05, 2019 by G

Which method do you know below to reduce noise and electromagnetic interference in PCB design?

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Protel-based PCB board design

Posted on March 05, 2019 by G

This article uses Protel99 SE as a design tool to analyze and discuss the basic principles and experience and skills in PCB design.

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Common problems and solutions in high speed PCB design

Posted on February 27, 2019 by G

Although the high-speed simulation tools and interconnect tools at this stage can help designers solve some of the problems, high-speed PCB design also requires the accumulation of experience and in-depth communication between the industry.

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Use of high speed PCB vias

Posted on February 27, 2019 by G

The via design consists of a pad and a pad area around the hole and an inner electrically isolated area. The parasitic inductance, parasitic capacitance, etc. of the vias affect the high-speed signals passing through the vias. The size of the vias and the pads connected to them have a direct effect on the properties of the vias.

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Circuit board PCB design and process

Posted on February 26, 2019 by G

Printed circuit board design is another important part of Protel 98. In this process, you can use the powerful functions provided by protel98/protel99se to realize the layout design of the board and complete the difficult wiring work.

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The golden rule that PCB design never changes

Posted on February 26, 2019 by G

10 Rules

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PCB design technology

Posted on February 19, 2019 by G

PCB design techniques have an impact on the following three effects:

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Characteristic impedance of PCB in high speed design

Posted on February 19, 2019 by G

In high-speed designs, the characteristic impedance of the controllable impedance plates and lines is one of the most important and common problems. First, let's look at the definition of a transmission line: a transmission line consists of two conductors of a certain length, one for transmitting signals and the other for receiving signals (remember that the "loop" replaces the concept of "ground"). In a multi-layer board, each line is part of the transmission line and the adjacent reference plane can be used as a second line or loop. The key to a line becoming a "perfect" transmission line is to keep its characteristic impedance constant throughout the line.

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Design performance requirements for PCB multi-layer

Posted on February 19, 2019 by G

The design performance of multi-layer boards is mostly similar to single-panel or double-panel, which is to avoid avoiding too many circuits to fill too small space, resulting in impractical tolerances, high inner layer capacity, and possibly even dangerous products. Quality safety. Therefore, the performance specification should consider the complete evaluation of the thermal shock, insulation resistance, welding resistance, etc. of the inner layer. The following sections describe important factors that should be considered in the design of multilayer boards.

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Power line and ground wire processing technology in PCB

PCB layout three special routing skills

Summary of Multilayer Board (BUM-PCB)

Introduction of high-density HDI circuit boards and circuit boards

The role and location of characteristic impedance in signal integrity

Fast Positioning of Signal Integrity Problems in High Speed Circuit Design

Signal Integrity Analysis in High Speed Circuit Design

EMI interference: conduction is the culprit

Correct differential pair routing method in Altium 9

How to make your PCB design better

How to deal with the interference of circuit board parasitic components on circuit performance

What is the reduction in noise and electromagnetic interference in PCB design?

Protel-based PCB board design

Common problems and solutions in high speed PCB design

Use of high speed PCB vias

Circuit board PCB design and process

The golden rule that PCB design never changes

PCB design technology

Characteristic impedance of PCB in high speed design

Design performance requirements for PCB multi-layer

Categories

Recommended Article:

BLOG

Power line and ground wire processing technology in PCB

PCB layout three special routing skills

Summary of Multilayer Board (BUM-PCB)

Introduction of high-density HDI circuit boards and circuit boards

The role and location of characteristic impedance in signal integrity

Fast Positioning of Signal Integrity Problems in High Speed ​​Circuit Design

Signal Integrity Analysis in High Speed ​​Circuit Design

EMI interference: conduction is the culprit

Correct differential pair routing method in Altium 9

How to make your PCB design better

How to deal with the interference of circuit board parasitic components on circuit performance

What is the reduction in noise and electromagnetic interference in PCB design?

Protel-based PCB board design

Common problems and solutions in high speed PCB design

Use of high speed PCB vias

Circuit board PCB design and process

The golden rule that PCB design never changes

PCB design technology

Characteristic impedance of PCB in high speed design

Design performance requirements for PCB multi-layer

Categories

Recommended Article:

Fast Positioning of Signal Integrity Problems in High Speed Circuit Design

Signal Integrity Analysis in High Speed Circuit Design